Patents by Inventor MAN-ZHI PENG

MAN-ZHI PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200146149
    Abstract: A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.
    Type: Application
    Filed: January 4, 2019
    Publication date: May 7, 2020
    Inventors: RUI-WU LIU, MING-JAAN HO, MAN-ZHI PENG
  • Publication number: 20200137888
    Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.
    Type: Application
    Filed: January 9, 2019
    Publication date: April 30, 2020
    Inventors: RUI-WU LIU, MING-JAAN HO, LEI ZHOU, MAN-ZHI PENG
  • Publication number: 20200107455
    Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 2, 2020
    Inventors: RUI-WU LIU, MING-JAAN HO, MAN-ZHI PENG