Patents by Inventor Manabu Edamura

Manabu Edamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130174556
    Abstract: A hybrid construction machine has an electric motor for driving the swing structure, and the electric motor is prevented from becoming incapable of generating torque due to a low energy state or an overcharged state of an electricity storage device. A swing-mode selector switch 77 which is manually operated switches between a hydraulic/electric combined swing mode for driving the swing structure by driving both the electric motor and a hydraulic motor and a hydraulic solo swing mode for driving the swing structure by driving only the hydraulic motor. For a normal operation, the swing mode is initially set in the hydraulic/electric combined swing mode. For a specific operation, the operator switches the swing-mode selector switch from a hydraulic/electric combined swing position to a hydraulic solo swing position.
    Type: Application
    Filed: July 20, 2011
    Publication date: July 11, 2013
    Applicant: HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Shinji Nishikawa, Takenori Hiroki, Kouji Ishikawa, Manabu Edamura, Hidetoshi Satake, Takatoshi Ooki
  • Publication number: 20130058750
    Abstract: A hybrid construction machine is capable of performing satisfactory operations even when trouble occurs that disables the electric motor from outputting torque. The hybrid construction has both a hydraulic motor and an electric motor driving the swing structure and a controller for switching between a hydraulic/electric hybrid swing mode (using both the hydraulic motor and the electric motor) and a hydraulic-alone swing mode (using only the hydraulic motor). The switching is executed while achieving satisfactory operability and performance in each mode. Normally, an energy saving operation is performed in the hydraulic/electric hybrid swing mode. When the electric amount of an electricity storage device has gone out of a prescribed range or an abnormality has occurred in an electric system (e.g., failure of an inverter), the swing mode is switched to the hydraulic-alone swing mode so that driving with normal braking torque is possible by the hydraulic motor alone.
    Type: Application
    Filed: May 16, 2011
    Publication date: March 7, 2013
    Applicant: HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Takenori Hiroki, Manabu Edamura, Toshihiko Ishida, Manabu Sugiura, Hidetoshi Satake, Kouji Ishikawa, Takatoshi Ooki, Shinji Nishikawa
  • Publication number: 20130011233
    Abstract: A construction machine has a hydraulic pump driven by a prime mover, a hydraulic motor, an electric motor, a storage device for delivering and receiving electric power to and from the electric motor, and a controller for exercising drive control of the electric motor. A speed reduction mechanism for transmitting drive forces of the electric motor and hydraulic motor to a swing structure is also provided. The controller includes inductive voltage waveform detecting means for detecting an inductive voltage waveform of the electric motor, and magnetic pole position computing means for, in a state where the swing structure is driven only by the torque of the hydraulic motor, taking in the inductive voltage waveform from the inductive voltage detecting means and computing a magnetic pole position of a rotor of the electric motor on the basis of the inductive voltage waveform and not via a rotation position sensor.
    Type: Application
    Filed: March 25, 2011
    Publication date: January 10, 2013
    Applicant: HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Toshihiko Watanabe, Toshihiko Ishida, Manabu Edamura
  • Patent number: 8342008
    Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: January 1, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Shuichi Baba, Masahiro Watanabe, Toshihiko Nakata, Yukio Kembo, Toru Kurenuma, Takafumi Morimoto, Manabu Edamura, Satoshi Sekino
  • Publication number: 20120273136
    Abstract: A plasma processing apparatus includes a processing chamber, a sample stage, a radio-frequency power supply which enables generation of plasma in the processing chamber, and at least one induction coil. The induction coil is formed by connecting a plurality of identical coil elements so that a same radio-frequency voltage is applied to each of the plurality of identical coil elements, and each input terminals of the identical coil elements is displaced at intervals of an angle calculated by dividing 360° by the number of identical coil elements. Continuous conductor portions of the identical coil elements are formed on different adjacent surfaces of the annular ring and constituted so as to be displaced from one another for a predetermined angle at a time so as to extend along a circumferential direction of the different adjacent surfaces of the annular ring.
    Type: Application
    Filed: July 10, 2012
    Publication date: November 1, 2012
    Inventors: Manabu Edamura, Go Miya, Ken Yoshioka
  • Publication number: 20120240581
    Abstract: A hybrid construction machine drives the upper swing structure using a hydraulic motor and an electric motor together and is capable of regenerating the energy of the upper swing structure in deceleration or stopping into electric power and using the regenerated electric power for assisting the hydraulic motor for driving the upper swing structure. The opening area characteristics of a meter-out restrictor and a bleed-off restrictor of a swing directional control valve are set to become larger than for construction machines driving the upper swing structure with the hydraulic motor alone. Torque of the electric motor is controlled so that the total sum of the actual torque occurring in the hydraulic and electric motors in deceleration or acceleration of the hydraulic motor equals the torque occurring when the opening area of the meter-out restrictor or the bleed-off restrictor is set at the prescribed opening area.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Applicant: HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Takatoshi OOKI, Yusuke KAJITA, Hidetoshi SATAKE, Seiji ISHIDA, Shiho IZUMI, Kouji ISHIKAWA, Shinya OKUMURA, Manabu EDAMURA
  • Patent number: 8231759
    Abstract: A plasma processing apparatus includes a processing chamber, a sample stage for mounting an object to be processed, a power supply, and at least one induction coil connected to the power supply. The induction coil is formed by connecting at least two identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage. The induction coil is positioned so that a center thereof corresponds to a center of the object, and input ends of the coil elements are displaced circumferentially at equal angular intervals calculated by dividing 360° by the number of identical coil elements.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: July 31, 2012
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Manabu Edamura, Go Miya, Ken Yoshioka
  • Patent number: 8083889
    Abstract: A plasma etching apparatus capable of performing processing with excellent in-plane uniformity on an object to be processed having a large diameter is provided.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: December 27, 2011
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Go Miya, Manabu Edamura, Ken Yoshioka, Ryoji Nishio
  • Patent number: 8011230
    Abstract: A scanning probe microscope, capable of performing shape measurement not affected by electrostatic charge distribution of a sample, which: monitors an electrostatic charge state by detecting a change in a flexure or vibrating state of a cantilever due to electrostatic charges in synchronization with scanning during measurement with relative scanning between the probe and the sample, and makes potential adjustment so as to cancel an influence of electrostatic charge distribution, thus preventing damage of the probe or the sample due to discharge and achieving reduction in measurement errors due to electrostatic charge distribution.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: September 6, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Masahiro Watanabe, Toru Kurenuma, Hiroshi Kuroda, Takafumi Morimoto, Shuichi Baba, Toshihiko Nakata, Manabu Edamura, Yukio Kembo
  • Publication number: 20100294432
    Abstract: A plasma processing apparatus, a processing chamber having one surface formed by a flat-plate-like insulating-material manufactured window, a sample mounting electrode having a sample mounting plane formed on a surface opposed to the insulating-material manufactured window, a gas-inlet for a flat-plate-structured capacitively coupled antenna formed on an outer surface of the insulating-material manufactured window with slits provided in a radial pattern, an inductively coupled antenna formed outside OF the insulating-material manufactured window and performing an inductive coupling with a plasma via the window, the plasma being formed within the processing chamber, a radio-frequency power supply, and an LC circuit. The inductively coupled antenna is configured by a coil which is wound a plurality of times with a direction defined as a longitudinal direction, the direction extending perpendicular to the sample mounting plane.
    Type: Application
    Filed: August 5, 2010
    Publication date: November 25, 2010
    Inventors: Manabu EDAMURA, Ken YOSHIOKA, Takeshi SHIMADA
  • Publication number: 20100263796
    Abstract: A plasma processing apparatus includes a processing chamber, a sample stage for mounting an object to be processed, a power supply, and at least one induction coil connected to the power supply. The induction coil is formed by connecting at least two identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage. The induction coil is positioned so that a center thereof corresponds to a center of the object, and input ends of the coil elements are displaced circumferentially at equal angular intervals calculated by dividing 360° by the number of identical coil elements.
    Type: Application
    Filed: May 20, 2010
    Publication date: October 21, 2010
    Inventors: Manabu Edamura, Go Miya, Ken Yoshioka
  • Patent number: 7744721
    Abstract: A plasma processing apparatus including a processing chamber for subjecting an object to plasma processing, a gas inlet, an evacuation device, a sample stage for the object, a power supply, and at least one induction coil. The at least one induction coil enables generation of the plasma in the processing chamber and is formed by connecting a plurality of identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: June 29, 2010
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Manabu Edamura, Go Miya, Ken Yoshioka
  • Patent number: 7713756
    Abstract: A plasma etching method for a plasma etching apparatus including: a processing chamber for performing plasma etching on an object to be processed; a first gas supply source; a second gas supply source; a first gas inlet for introducing a processing gas into the processing chamber; a second gas inlet for introducing a processing gas into the processing chamber; a flow rate regulator for regulating the flow rate of the processing gas; and a gas shunt for dividing the first processing gas into a plurality of portions, wherein the second processing gas is merged with at least one part between the gas shunt and the first gas inlet and between the gas shunt and the second gas inlet.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: May 11, 2010
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Go Miya, Manabu Edamura, Ken Yoshioka, Ryoji Nishio
  • Publication number: 20100078130
    Abstract: A plasma processing apparatus including a processing chamber for subjecting an object to plasma processing, a gas inlet, an evacuation device, a sample stage for the object, a power supply, and at least one induction coil. The at least one induction coil enables generation of the plasma in the processing chamber and is formed by connecting a plurality of identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage.
    Type: Application
    Filed: September 25, 2009
    Publication date: April 1, 2010
    Inventors: Manabu Edamura, Go Miya, Ken Yoshioka
  • Patent number: 7631548
    Abstract: With a scanning probe microscope, if a plurality of sample properties are measured using a scanning scheme of allowing a probe to approach and withdraw from a sample, the sample properties need to be accurately and reliably detected in the minimum required measurement time. Further, the acting force between the probe and the sample varies depending on the type of the probe and the wear condition of a probe tip. Thus, disadvantageously, property values acquired using different probes cannot be compared with one another unless the artifactual effect of the measuring probes are eliminated. In accordance with the present invention, with a scanning probe microscope, the probe is brought into intermittent contact with the sample, while driving means repeatedly allows the probe to approach and withdraw from the sample with a variable amplitude. The sample property is thus acquired at a high speed.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: December 15, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Shuichi Baba, Masahiro Watanabe, Toshihiko Nakata, Toru Kurenuma, Hiroshi Kuroda, Takafumi Morimoto, Yukio Kembo, Manabu Edamura
  • Publication number: 20090223633
    Abstract: A plasma etching apparatus capable of performing processing with excellent in-plane uniformity on an object to be processed having a large diameter is provided.
    Type: Application
    Filed: May 4, 2009
    Publication date: September 10, 2009
    Inventors: Go MIYA, Manabu EDAMURA, Ken YOSHIOKA, Ryoji NISHIO
  • Publication number: 20090158828
    Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.
    Type: Application
    Filed: August 7, 2008
    Publication date: June 25, 2009
    Inventors: Shuichi BABA, Masahiro Watanabe, Toshihiko Nakata, Yukio Kembo, Toru Kurenuma, Takafumi Morimoto, Manabu Edamura, Satoshi Sekino
  • Publication number: 20090095423
    Abstract: A plasma processing apparatus for performing plasma processing on an object to be processed, including: a processing chamber for performing plasma etching on an object to be processed; a first gas inlet provided at an upper portion of the processing chamber for supplying gas to a center portion in the processing chamber; a plurality of second gas inlets placed on an outer circumference of the first gas inlet for supplying gas to an outer circumference portion in the processing chamber; two lines of gas supply systems for supplying processing gases to the first gas inlet and the second gas inlets, respectively; an evacuation means for reducing the pressure in the processing chamber; an electrode on which the object to be processed is placed disposed in the processing chamber opposed to the first gas inlet and the second gas inlets; a high frequency power supply for generating plasma; and additional gas supply systems provided to the two lines of gas supply systems, respectively, for adding a gas for generating
    Type: Application
    Filed: December 8, 2008
    Publication date: April 16, 2009
    Inventors: Go MIYA, Manabu Edamura, Ken Yoshioka, Ryoji Nishio
  • Publication number: 20080245139
    Abstract: A measurement method of a scanning probe microscope including a first approach operation adjusting an operation position of a fine positioning unit to near a maximum extension amount and ending the approach by coarse positioning, a first measurement operation making the probe scan the surface for measurement in a close probe state based on the first approach operation to obtain relief information of the sample surface, a positioning operation positioning the probe at a recessed part based on the relief information obtained by the first measurement operation, a second approach operation making the probe again approach the surface at a position determined by the positioning operation, adjusting an operation position of the Z-axis fine positioning device to close to a maximum extension amount, and ending the repeated approach, and a second measurement operation making the probe scan the surface for measurement in a close probe state based on the second approach operation to obtain relief information of the sampl
    Type: Application
    Filed: April 2, 2008
    Publication date: October 9, 2008
    Inventors: Takafumi Morimoto, Toru Kurenuma, Manabu Edamura, Hiroshi Kuroda, Yukio Kembo, Masahiro Watanabe, Shuichi Baba
  • Publication number: 20080223122
    Abstract: A scanning probe microscope, capable of performing shape measurement not affected by electrostatic charge distribution of a sample, which: monitors an electrostatic charge state by detecting a change in a flexure or vibrating state of a cantilever due to electrostatic charges in synchronization with scanning during measurement with relative scanning between the probe and the sample, and makes potential adjustment so as to cancel an influence of electrostatic charge distribution, thus preventing damage of the probe or the sample due to discharge and achieving reduction in measurement errors due to electrostatic charge distribution.
    Type: Application
    Filed: January 31, 2008
    Publication date: September 18, 2008
    Inventors: Masahiro Watanabe, Toru KURENUMA, Hiroshi Kuroda, Takafumi Morimoto, Shuichi Baba, Toshihiko Nakata, Manabu Edamura, Yukio Kembo