Abstract: According to one embodiment, a semiconductor device is provided which includes a substrate in which conductor layers and insulated layers are stacked alternately, a semiconductor element mounted on a first surface side of the substrate, and a reinforcing plate attached to a second surface side that is an opposite side of the first surface of the substrate.

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Abstract: A user is enabled to make different selection as to whether or not to include a blank page for each data processing. A storage portion stores setting information indicating whether or not to perform data processing of image data with a blank page excluded for each data processing, and a control portion judges whether or not each data processing is processing performed with a blank page of the image data excluded based on the setting information stored in the storage portion, and executes first data processing which is judged as processing performed with the blank page excluded by excluding the blank page as well as executes second data processing which is judged as processing performed without excluding the blank page concurrently with the first data processing by including the blank page.

Abstract: The present invention aims to provide an interlayer film for a laminated glass providing excellent overall sound insulation at temperatures in the wide range of from 10 to 60° C. The present invention is an interlayer film for a laminated glass, including: a sound insulation layer 1; a middle layer; and a sound insulation layer 2, the layers each containing a polyvinyl acetal resin and a plasticizer and being laminated in the stated order, wherein the amount of the plasticizer per 100 parts by weight of the polyvinyl acetal resin in the sound insulation layer 1 is different by from 5 to 60 parts by weight from the amount of the plasticizer per 100 parts by weight of the polyvinyl acetal resin in the sound insulation layer 2, and the amounts of acetyl groups in the polyvinyl acetal resin contained in the sound insulation layer 1 and the sound insulation layer 2 each are larger than the amount of acetyl groups in the polyvinyl acetal resin contained in the middle layer.

Abstract: Based on whether image formation is to be performed on an one side or both sides of record paper, and on whether image data concerning image formation is image data of an one-sided document or image data of a double-sided document, it is judged whether a blank page or a blank sheet whose both sides are blank pages is included, and image formation is performed excluding said blank page or both sides of the blank sheet based on said judgment result.

Abstract: A semiconductor device includes a semiconductor mounting substrate, a mother case having an opening and housing the semiconductor mounting substrate, a plurality of securing members provided along a rim of the mother case, a screw terminal, and a lid member. The screw terminal has a flat plate portion, an insertion portion extending from the flat plate portion, and a terminal bottom portion, is secured to the securing members by insertion of the insertion portion between adjacent securing members, and is electrically connected to the semiconductor mounting substrate on the terminal bottom portion side. The lid member closes the opening with the screw terminal secured to the securing members. The screw terminal is bent such that the flat plate portion faces an upper surface of the lid member closing the opening. The semiconductor device that can achieve reduction in size of the entire device is obtained.

Abstract: On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member.

Abstract: On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member.

Abstract: A case is formed with a box main body and a cover. This box includes a locking member for keeping the box main body and the cover attached to each other, and a pair of temporarily locking members for absorbing a rattle generated between the box main body and the cover. The locking member is mounted on the center of a sidewall of the case. The temporarily locking members are mounted on both ends of the sidewall between which the locking member is interposed. The temporarily locking members are temporarily locked together simultaneously with an engagement of the locking member, and unlocked by bending the sidewall when the locking member is disengaged.

Abstract: On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member.

Abstract: A semiconductor chip has devices formed on a first principal plane of a semiconductor substrate, wherein a second principal plane of the semiconductor substrate is planarized, and an organic film having plus charges on an outer side is provided on the second principal plane.

Abstract: A grommet is formed having a funnel shaped portion and a tubular portion linked to a small diameter end portion of the funnel shaped portion. The grommet is inserted to an aperture of a car body panel after a wire harness is passed through and attached to the funnel shaped portion and the tubular portion, and a body latch groove provided on the external circumferential surface of the funnel shaped portion is latched to the car body panel. An extended tubular portion is provided that projects from the tubular portion, and extends inside the funnel shaped portion. A plurality of ribs is provided on an external circumferential surface of the extended tubular portion. The ribs include type one ribs having grooves on both surfaces of an element linking the rib to the extended tubular portion, and a type two rib having no groove.

Abstract: An electrical connecting box suitable to widely-ranging temperature conditions from high temperature to low temperature inside the engine room of a vehicle is described, having a printed circuit board 300 and a first protecting member 100 and a second protecting member 200 housing the printed circuit board in a sandwich state. In this electrical connecting box an extended portion 310 being a part of electrical parts is formed upon a board surface 301 on the side of the first protecting member of the printed circuit board. Additionally, first pillar portions 110 and a second pillar portion 120 are formed upon the inside surface of the first protecting member facing one side of the board surfaces, and a tip 111 and a tip 121 of these pillar portions, according to bending of the first protecting member, can be in either a contacted state or a spaced state with respect to the board surface 301 or, alternatively, a projecting body 321 fixed to the board surface.

Abstract: Based on whether image formation is to be performed on an one side or both sides of record paper, and on whether image data concerning image formation is image data of an one-sided document or image data of a double-sided document, it is judged whether a blank page or a blank sheet whose both sides are blank pages is included, and image formation is performed excluding said blank page or both sides of the blank sheet based on said judgment result.