Patents by Inventor Manabu Ohta
Manabu Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240331905Abstract: In the coil component, the terminal electrode enters an aperture of the element body and is jointed with the bump electrode inside the element body. That is, the terminal electrode is in contact with both the bump electrode and the element body. Therefore, as compared with the case where the bump electrode is exposed to the lower surface of the element body, a joint surface of the terminal electrode is enlarged, and high adhesion of the terminal electrode is realized.Type: ApplicationFiled: March 27, 2024Publication date: October 3, 2024Applicant: TDK CorporationInventors: Manabu OHTA, Ryo Fukuoka, Yuji Matsuura, Hokuto Eda, Takahiro Nemoto, Kenei Onuma, Masazumi Arata, Hitoshi Ohkubo
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Publication number: 20240331933Abstract: In the coil component, the edge of the aperture of the protection film covering the coil from the lower surface side of the element body does not extend in the same plane. In this case, even if a crack occurs in the joint region between the coil and the bump electrode, the crack is less likely to cross the joint region as compared with the case where the edge extends in the same plane. Therefore, in the coil component, the crack is effectively suppressed.Type: ApplicationFiled: March 27, 2024Publication date: October 3, 2024Applicant: TDK CorporationInventors: Hokuto EDA, Takahiro Nemoto, Manabu Ohta, Ryo Fukuoka, Masazumi Arata, Hitoshi Ohkubo
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Publication number: 20240331926Abstract: In the coil component, the lower end portion of the bump electrode protruding from the lower surface of the element body includes a flange portion, and the lower surface of the lower end portion is concave-convex. Therefore, compared to the case where the bump electrode is exposed in the form of a flat surface so as to be flat with the lower surface of the element body, the contact areas between the bump electrodes and the terminal electrodes are increased, and high connection reliability between the bump electrodes and the terminal electrodes is realized.Type: ApplicationFiled: March 27, 2024Publication date: October 3, 2024Applicant: TDK CorporationInventors: Manabu OHTA, Ryo FUKUOKA, Yuji MATSUURA, Hokuto EDA, Takahiro NEMOTO, Kenei ONUMA, Masazumi ARATA, Hitoshi OHKUBO
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Patent number: 11894174Abstract: In a coil component, a height h1 of a pedestal portion of a resin wall corresponds to the height position of a step portion. In addition, a height of a seed portion corresponds to the plating start position at a time when a winding portion of a coil is plated and grown. The plating start position and the step portion are designed to be close to each other by the height h1 of the pedestal portion and the height h2 of the seed portion satisfying 0.3?h1/h2?10. Accordingly, although the coil component has a configuration in which the resin wall has the step portion, the inside of the step portion is sufficiently filled with a coil conductor, and thus deterioration of characteristics is suppressed.Type: GrantFiled: November 10, 2020Date of Patent: February 6, 2024Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Manabu Ohta, Ryo Fukuoka, Hironori Kimata
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Patent number: 11894177Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: GrantFiled: March 9, 2023Date of Patent: February 6, 2024Assignee: TDK CORPORATIONInventors: Takahiro Kawahara, Manabu Ohta, Kenei Onuma, Yuuya Kaname, Ryo Fukuoka, Hokuto Eda, Masataro Saito, Kohei Takahashi
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Patent number: 11810708Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: GrantFiled: March 9, 2023Date of Patent: November 7, 2023Assignee: TDK CORPORATIONInventors: Takahiro Kawahara, Manabu Ohta, Kenei Onuma, Yuuya Kaname, Ryo Fukuoka, Hokuto Eda, Masataro Saito, Kohei Takahashi
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Publication number: 20230215618Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: ApplicationFiled: March 9, 2023Publication date: July 6, 2023Applicant: TDK CORPORATIONInventors: Takahiro KAWAHARA, Manabu OHTA, Kenei ONUMA, Yuuya KANAME, Ryo FUKUOKA, Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI
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Publication number: 20230215617Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: ApplicationFiled: March 9, 2023Publication date: July 6, 2023Applicant: TDK CORPORATIONInventors: Takahiro KAWAHARA, Manabu OHTA, Kenei ONUMA, Yuuya KANAME, Ryo FUKUOKA, Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI
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Patent number: 11631529Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: GrantFiled: March 6, 2020Date of Patent: April 18, 2023Assignee: TDK CORPORATIONInventors: Takahiro Kawahara, Manabu Ohta, Kenei Onuma, Yuuya Kaname, Ryo Fukuoka, Hokuto Eda, Masataro Saito, Kohei Takahashi
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Publication number: 20230066655Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.Type: ApplicationFiled: August 22, 2022Publication date: March 2, 2023Applicant: TDK CORPORATIONInventors: Hokuto EDA, Hitoshi OHKUBO, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI, Manabu OHTA, Kenei ONUMA
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Patent number: 11557427Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.Type: GrantFiled: January 3, 2020Date of Patent: January 17, 2023Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Yuuya Kaname, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
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Publication number: 20220415566Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.Type: ApplicationFiled: June 21, 2022Publication date: December 29, 2022Applicant: TDK CORPORATIONInventors: Hokuto EDA, Hitoshi OHKUBO, Masazumi ARATA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI, Manabu OHTA, Kenei ONUMA
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Publication number: 20210225588Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.Type: ApplicationFiled: April 7, 2021Publication date: July 22, 2021Applicant: TDK CORPORATIONInventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
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Publication number: 20210151234Abstract: In a coil component, a height h1 of a pedestal portion of a resin wall corresponds to the height position of a step portion. In addition, a height of a seed portion corresponds to the plating start position at a time when a winding portion of a coil is plated and grown. The plating start position and the step portion are designed to be close to each other by the height h1 of the pedestal portion and the height h2 of the seed portion satisfying 0.3?h1/h2?10. Accordingly, although the coil component has a configuration in which the resin wall has the step portion, the inside of the step portion is sufficiently filled with a coil conductor, and thus deterioration of characteristics is suppressed.Type: ApplicationFiled: November 10, 2020Publication date: May 20, 2021Applicant: TDK CORPORATIONInventors: Hitoshi OHKUBO, Manabu OHTA, Ryo FUKUOKA, Hironori KIMATA
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Patent number: 10998130Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.Type: GrantFiled: August 29, 2019Date of Patent: May 4, 2021Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
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Publication number: 20200303116Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: ApplicationFiled: March 6, 2020Publication date: September 24, 2020Applicant: TDK CORPORATIONInventors: Takahiro KAWAHARA, Manabu OHTA, Kenei ONUMA, Yuuya KANAME, Ryo FUKUOKA, Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI
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Publication number: 20200143980Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.Type: ApplicationFiled: January 3, 2020Publication date: May 7, 2020Applicant: TDK CORPORATIONInventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Yuuya KANAME, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
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Patent number: 10559417Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.Type: GrantFiled: May 27, 2016Date of Patent: February 11, 2020Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Yuuya Kaname, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
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Publication number: 20190385792Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.Type: ApplicationFiled: August 29, 2019Publication date: December 19, 2019Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
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Patent number: 10468184Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.Type: GrantFiled: November 24, 2015Date of Patent: November 5, 2019Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato