Patents by Inventor Manabu Ohta
Manabu Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9406420Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 ?m or more and 100 ?m or less. The third average grain diameter is 2 ?m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.Type: GrantFiled: September 4, 2013Date of Patent: August 2, 2016Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
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Publication number: 20160155550Abstract: In a coil component (planar coil element), at least part of a third metal magnetic powder constituting a metal magnetic powder and having a minimum average grain diameter is uncoated, which suppresses a reduction in magnetic permeability. On the other hand, the remaining metal powders are coated with glass, which improves the insulating properties of a metal magnetic powder-containing resin and reduces core loss.Type: ApplicationFiled: November 25, 2015Publication date: June 2, 2016Applicant: TDK CORPORATIONInventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
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Publication number: 20160155556Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.Type: ApplicationFiled: November 24, 2015Publication date: June 2, 2016Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
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Patent number: 9349522Abstract: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.Type: GrantFiled: August 20, 2015Date of Patent: May 24, 2016Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara, Takashi Nakagawa
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Patent number: 9236171Abstract: A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.Type: GrantFiled: October 14, 2011Date of Patent: January 12, 2016Assignee: TDK CorporationInventors: Tomokazu Ito, Hitoshi Ohkubo, Yoshihiro Maeda, Makoto Morita, Toshiyuki Anbo, Kyohei Tonoyama, Manabu Ohta
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Publication number: 20150357115Abstract: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.Type: ApplicationFiled: August 20, 2015Publication date: December 10, 2015Inventors: Hitoshi OHKUBO, Tomokazu ITO, Hideto ITOH, Yoshihiro MAEDA, Manabu OHTA, Yuuya KANAME, Takahiro KAWAHARA, Takashi NAKAGAWA
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Patent number: 9142343Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.Type: GrantFiled: July 3, 2013Date of Patent: September 22, 2015Assignee: TDK CorporationInventors: Hitoshi Ohkubo, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
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Patent number: 8975997Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.Type: GrantFiled: March 19, 2013Date of Patent: March 10, 2015Assignee: TDK CorporationInventors: Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hitoshi Ohkubo, Manabu Ohta, Yoshihiro Maeda, Yuuya Kaname, Hideharu Moro
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Publication number: 20140077914Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 ?m or more and 100 ?m or less. The third average grain diameter is 2 ?m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.Type: ApplicationFiled: September 4, 2013Publication date: March 20, 2014Applicant: TDK CorporationInventors: Hitoshi Ohkubo, Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
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Publication number: 20140009254Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.Type: ApplicationFiled: July 3, 2013Publication date: January 9, 2014Inventors: Hitoshi OHKUBO, Tomokazu ITO, Hideto ITOH, Yoshihiro MAEDA, Manabu OHTA, Yuuya KANAME, Takahiro KAWAHARA, Takashi NAKAGAWA
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Publication number: 20130249664Abstract: In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 ?m) smaller than that (32 ?m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.Type: ApplicationFiled: March 21, 2013Publication date: September 26, 2013Inventors: Kyohei TONOYAMA, Makoto MORITA, Tomokazu ITO, Hitoshi OHKUBO, Manabu OHTA, Yoshihiro MAEDA, Yuuya KANAME, Hideharu MORO
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Publication number: 20130249662Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.Type: ApplicationFiled: March 19, 2013Publication date: September 26, 2013Inventors: Kyohei TONOYAMA, Makoto MORITA, Tomokazu ITO, Hitoshi OHKUBO, Manabu OHTA, Yoshihiro MAEDA, Yuuya KANAME, Hideharu MORO
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Publication number: 20130222101Abstract: A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.Type: ApplicationFiled: October 14, 2011Publication date: August 29, 2013Applicant: TDK CORPORATIONInventors: Tomokazu Ito, Hitoshi Ohkubo, Yoshihiro Maeda, Makoto Morita, Toshiyuki Anbo, Kyohei Tonoyama, Manabu Ohta
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Patent number: 7905012Abstract: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.Type: GrantFiled: February 12, 2008Date of Patent: March 15, 2011Assignee: TDK CorporationInventors: Hajime Kuwajima, Hitoshi Ohkubo, Manabu Ohta
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Patent number: 7592892Abstract: A fusible link unit includes a bus bar adapted to be connected to a battery without interposing a fuse between the bus bar and the battery, and a heat resistant insulating sheet which covers at least an upper edge portion of the bus bar. The fusible link unit is adapted to be accommodated inside an in-vehicle electrical connection box.Type: GrantFiled: March 30, 2007Date of Patent: September 22, 2009Assignees: Sumitomo Wiring Systems, Ltd., Pacific Engineering Corp.Inventors: Katsuya Ito, Akira Hirata, Manabu Ohta
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Publication number: 20080236870Abstract: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.Type: ApplicationFiled: February 12, 2008Publication date: October 2, 2008Applicant: TDK CORPORATIONInventors: Hajime KUWAJIMA, Hitoshi Ohkubo, Manabu Ohta
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Patent number: D555600Type: GrantFiled: May 17, 2005Date of Patent: November 20, 2007Assignee: Pacific Engineering Corp.Inventor: Manabu Ohta
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Patent number: D560172Type: GrantFiled: April 27, 2007Date of Patent: January 22, 2008Assignees: Pacific Engineering Corp., Sumitomo Wiring Systems, Ltd.Inventors: Manabu Ohta, Hideki Shibata, Katsuya Ito
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Patent number: D567765Type: GrantFiled: June 24, 2007Date of Patent: April 29, 2008Assignee: Pacific Engineering Corp.Inventor: Manabu Ohta
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Patent number: D567766Type: GrantFiled: June 24, 2007Date of Patent: April 29, 2008Assignee: Pacific Engineering Corp.Inventor: Manabu Ohta