Patents by Inventor Manabu Okamoto
Manabu Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12033658Abstract: Provided is a technology of learning an acoustic model with a certain degree of accuracy of sound recognition within a short calculation period.Type: GrantFiled: January 23, 2020Date of Patent: July 9, 2024Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Kiyoaki Matsui, Takafumi Moriya, Takaaki Fukutomi, Yusuke Shinohara, Yoshikazu Yamaguchi, Manabu Okamoto
-
Patent number: 11621015Abstract: A training speech data generating apparatus includes: a voice conversion unit that converts, using fourth noise data, which is noise data based on third noise data, and speech data, the speech data so as to make the speech data clearly audible under a noise environment corresponding to the fourth noise data; and a noise superimposition unit that obtains training speech data by superimposing the third noise data and the converted speech data.Type: GrantFiled: March 11, 2019Date of Patent: April 4, 2023Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Takaaki Fukutomi, Manabu Okamoto, Takashi Nakamura, Kiyoaki Matsui
-
Publication number: 20220122626Abstract: Provided is a technology of learning an acoustic model with a certain degree of accuracy of sound recognition within a short calculation period.Type: ApplicationFiled: January 23, 2020Publication date: April 21, 2022Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Kiyoaki MATSUI, Takafumi MORIYA, Takaaki FUKUTOMI, Yusuke SHINOHARA, Yoshikazu YAMAGUCHI, Manabu OKAMOTO
-
Patent number: 11291151Abstract: A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.Type: GrantFiled: December 7, 2016Date of Patent: March 29, 2022Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Manabu Okamoto
-
Publication number: 20210005215Abstract: A training speech data generating apparatus includes: a voice conversion unit that converts, using fourth noise data, which is noise data based on third noise data, and speech data, the speech data so as to make the speech data clearly audible under a noise environment corresponding to the fourth noise data; and a noise superimposition unit that obtains training speech data by superimposing the third noise data and the converted speech data.Type: ApplicationFiled: March 11, 2019Publication date: January 7, 2021Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Takaaki FUKUTOMI, Manabu OKAMOTO, Takashi NAKAMURA, Kiyoaki MATSUI
-
Publication number: 20200077551Abstract: A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.Type: ApplicationFiled: December 7, 2016Publication date: March 5, 2020Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHAInventor: Manabu OKAMOTO
-
Publication number: 20180310529Abstract: A method for manufacturing an electronic apparatus functioning as a component of a wireless communication system includes providing a lower part formed with a first concave portion, a second concave portion spaced away from the first concave portion, and a third concave portion which couples the first concave portion and the second concave portion, providing an upper part for sealing the first concave portion, the second concave portion, and the third concave portion formed in the lower part, providing a module unit including a sensor which detects a physical quantity, and a radio communication unit which transmits data based on an output signal from the sensor, providing a battery for supplying power to the module unit, coupling the module unit and the battery by a wiring, and after the coupling the module unit and the battery, arranging the module unit in the first concave portion of the lower part.Type: ApplicationFiled: July 9, 2018Publication date: November 1, 2018Inventors: Takuo Funaya, Tomohiro NISHIYAMA, Hiroki SHIBUYA, Manabu OKAMOTO
-
Patent number: 10085425Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.Type: GrantFiled: June 27, 2015Date of Patent: October 2, 2018Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Takuo Funaya, Tomohiro Nishiyama, Hiroki Shibuya, Manabu Okamoto
-
Patent number: 9585192Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.Type: GrantFiled: June 24, 2015Date of Patent: February 28, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Hiroki Shibuya, Manabu Okamoto, Tomohiro Nishiyama, Norikazu Motohashi
-
Patent number: 9362262Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.Type: GrantFiled: July 23, 2015Date of Patent: June 7, 2016Assignee: Renesas Electronics CorporationInventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
-
Publication number: 20160128179Abstract: Miniaturization of an electronic apparatus which functions as a component of a wireless communication system is achieved. A main feature point in an embodiment resides in that a plurality of test terminals provided over an upper surface of a wiring board are collectively arranged as shown in a drawing, for example. Thus, it is possible to reduce the size of a test terminal forming area (first test terminal forming area) formed with the test terminals used in a unit test. As a result, miniaturization of an electronic apparatus according to the present embodiment can be achieved.Type: ApplicationFiled: October 8, 2015Publication date: May 5, 2016Inventors: Manabu Okamoto, Hiroki Shibuya
-
Patent number: 9325572Abstract: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.Type: GrantFiled: June 13, 2013Date of Patent: April 26, 2016Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Takashi Saegusa, Terunobu Funatsu, Manabu Okamoto, Ikuo Takemura, Masaharu Yoshida, Hideyuki Kamasuka
-
Publication number: 20160007409Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.Type: ApplicationFiled: June 24, 2015Publication date: January 7, 2016Inventors: Hiroki SHIBUYA, Manabu Okamoto, Tomohiro Nishiyama, Norikazu Motohashi
-
Publication number: 20160000045Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.Type: ApplicationFiled: June 27, 2015Publication date: January 7, 2016Inventors: Takuo Funaya, Tomohiro Nishiyama, Hiroki Shibuya, Manabu Okamoto
-
Publication number: 20150333048Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.Type: ApplicationFiled: July 23, 2015Publication date: November 19, 2015Inventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
-
Patent number: 9117814Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.Type: GrantFiled: May 22, 2014Date of Patent: August 25, 2015Assignee: Renesas Electronics CorporationInventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
-
Publication number: 20140361410Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.Type: ApplicationFiled: May 22, 2014Publication date: December 11, 2014Applicant: Renesas Electronics CorporationInventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
-
Patent number: 8565238Abstract: A central communication unit 110 and a terminal communication unit 120 are provided with a priority order number storing unit 115 and fifo type storing units, and perform communication according to the priority order of data communication stored in the priority order number storing unit 115. At this time the priority order and the layout of respective devices of control objects are optimized and set through a software processing in a host computer according to the communication cycle and response performance required for the devices of control objects, thereby, the plurality of devices of control objects requiring different communication cycles and response performances can be connected on one network.Type: GrantFiled: February 7, 2011Date of Patent: October 22, 2013Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Takashi Saegusa, Terunobu Funatsu, Manabu Okamoto, Ikuo Takemura, Masaharu Yoshida, Hideyuki Kamasuka
-
Publication number: 20130275565Abstract: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.Type: ApplicationFiled: June 13, 2013Publication date: October 17, 2013Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Takashi SAEGUSA, Terunobu FUNATSU, Manabu OKAMOTO, Ikuo TAKEMURA, Masaharu YOSHIDA, Hideyuki KAMASUKA
-
Patent number: 8468221Abstract: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.Type: GrantFiled: May 20, 2010Date of Patent: June 18, 2013Assignee: Hitachi High-Technologies CorporationInventors: Takashi Saegusa, Terunobu Funatsu, Manabu Okamoto, Ikuo Takemura, Masaharu Yoshida, Hideyuki Kamasuka