Patents by Inventor Manabu Okamoto

Manabu Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12033658
    Abstract: Provided is a technology of learning an acoustic model with a certain degree of accuracy of sound recognition within a short calculation period.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 9, 2024
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Kiyoaki Matsui, Takafumi Moriya, Takaaki Fukutomi, Yusuke Shinohara, Yoshikazu Yamaguchi, Manabu Okamoto
  • Patent number: 11621015
    Abstract: A training speech data generating apparatus includes: a voice conversion unit that converts, using fourth noise data, which is noise data based on third noise data, and speech data, the speech data so as to make the speech data clearly audible under a noise environment corresponding to the fourth noise data; and a noise superimposition unit that obtains training speech data by superimposing the third noise data and the converted speech data.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: April 4, 2023
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takaaki Fukutomi, Manabu Okamoto, Takashi Nakamura, Kiyoaki Matsui
  • Publication number: 20220122626
    Abstract: Provided is a technology of learning an acoustic model with a certain degree of accuracy of sound recognition within a short calculation period.
    Type: Application
    Filed: January 23, 2020
    Publication date: April 21, 2022
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Kiyoaki MATSUI, Takafumi MORIYA, Takaaki FUKUTOMI, Yusuke SHINOHARA, Yoshikazu YAMAGUCHI, Manabu OKAMOTO
  • Patent number: 11291151
    Abstract: A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 29, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Manabu Okamoto
  • Publication number: 20210005215
    Abstract: A training speech data generating apparatus includes: a voice conversion unit that converts, using fourth noise data, which is noise data based on third noise data, and speech data, the speech data so as to make the speech data clearly audible under a noise environment corresponding to the fourth noise data; and a noise superimposition unit that obtains training speech data by superimposing the third noise data and the converted speech data.
    Type: Application
    Filed: March 11, 2019
    Publication date: January 7, 2021
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takaaki FUKUTOMI, Manabu OKAMOTO, Takashi NAKAMURA, Kiyoaki MATSUI
  • Publication number: 20200077551
    Abstract: A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.
    Type: Application
    Filed: December 7, 2016
    Publication date: March 5, 2020
    Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Manabu OKAMOTO
  • Publication number: 20180310529
    Abstract: A method for manufacturing an electronic apparatus functioning as a component of a wireless communication system includes providing a lower part formed with a first concave portion, a second concave portion spaced away from the first concave portion, and a third concave portion which couples the first concave portion and the second concave portion, providing an upper part for sealing the first concave portion, the second concave portion, and the third concave portion formed in the lower part, providing a module unit including a sensor which detects a physical quantity, and a radio communication unit which transmits data based on an output signal from the sensor, providing a battery for supplying power to the module unit, coupling the module unit and the battery by a wiring, and after the coupling the module unit and the battery, arranging the module unit in the first concave portion of the lower part.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 1, 2018
    Inventors: Takuo Funaya, Tomohiro NISHIYAMA, Hiroki SHIBUYA, Manabu OKAMOTO
  • Patent number: 10085425
    Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.
    Type: Grant
    Filed: June 27, 2015
    Date of Patent: October 2, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takuo Funaya, Tomohiro Nishiyama, Hiroki Shibuya, Manabu Okamoto
  • Patent number: 9585192
    Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: February 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Hiroki Shibuya, Manabu Okamoto, Tomohiro Nishiyama, Norikazu Motohashi
  • Patent number: 9362262
    Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 7, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
  • Publication number: 20160128179
    Abstract: Miniaturization of an electronic apparatus which functions as a component of a wireless communication system is achieved. A main feature point in an embodiment resides in that a plurality of test terminals provided over an upper surface of a wiring board are collectively arranged as shown in a drawing, for example. Thus, it is possible to reduce the size of a test terminal forming area (first test terminal forming area) formed with the test terminals used in a unit test. As a result, miniaturization of an electronic apparatus according to the present embodiment can be achieved.
    Type: Application
    Filed: October 8, 2015
    Publication date: May 5, 2016
    Inventors: Manabu Okamoto, Hiroki Shibuya
  • Patent number: 9325572
    Abstract: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: April 26, 2016
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Takashi Saegusa, Terunobu Funatsu, Manabu Okamoto, Ikuo Takemura, Masaharu Yoshida, Hideyuki Kamasuka
  • Publication number: 20160007409
    Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.
    Type: Application
    Filed: June 24, 2015
    Publication date: January 7, 2016
    Inventors: Hiroki SHIBUYA, Manabu Okamoto, Tomohiro Nishiyama, Norikazu Motohashi
  • Publication number: 20160000045
    Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.
    Type: Application
    Filed: June 27, 2015
    Publication date: January 7, 2016
    Inventors: Takuo Funaya, Tomohiro Nishiyama, Hiroki Shibuya, Manabu Okamoto
  • Publication number: 20150333048
    Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
    Type: Application
    Filed: July 23, 2015
    Publication date: November 19, 2015
    Inventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
  • Patent number: 9117814
    Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: August 25, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
  • Publication number: 20140361410
    Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
    Type: Application
    Filed: May 22, 2014
    Publication date: December 11, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Shintaro Yamamichi, Manabu Okamoto, Hirokazu Honda
  • Patent number: 8565238
    Abstract: A central communication unit 110 and a terminal communication unit 120 are provided with a priority order number storing unit 115 and fifo type storing units, and perform communication according to the priority order of data communication stored in the priority order number storing unit 115. At this time the priority order and the layout of respective devices of control objects are optimized and set through a software processing in a host computer according to the communication cycle and response performance required for the devices of control objects, thereby, the plurality of devices of control objects requiring different communication cycles and response performances can be connected on one network.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: October 22, 2013
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Takashi Saegusa, Terunobu Funatsu, Manabu Okamoto, Ikuo Takemura, Masaharu Yoshida, Hideyuki Kamasuka
  • Publication number: 20130275565
    Abstract: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.
    Type: Application
    Filed: June 13, 2013
    Publication date: October 17, 2013
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Takashi SAEGUSA, Terunobu FUNATSU, Manabu OKAMOTO, Ikuo TAKEMURA, Masaharu YOSHIDA, Hideyuki KAMASUKA
  • Patent number: 8468221
    Abstract: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: June 18, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Takashi Saegusa, Terunobu Funatsu, Manabu Okamoto, Ikuo Takemura, Masaharu Yoshida, Hideyuki Kamasuka