Abstract: A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.

Abstract: A capacitor comprising: a thin film laminate including a plurality of dielectric thin films and a plurality of electrode conductor thin films laminated alternately; and first kind terminals and second kind terminals formed over a first main surface of said thin film laminate and isolated from each other in a DC current, wherein a first kind electrode conductor thin films electrically connecting with said first kind terminals and a second kind electrode conductor thin films electrically connecting with said second kind terminals are so alternately laminated in a laminate direction as are separated by said dielectric thin films, and a first dielectric thin film, an other kind electrode conductor thin film and a second dielectric thin film are laminated in this order between one same kind electrode conductor thin film and other same kind electrode conductor thin film adjoining in said laminate direction, and first through holes, second through holes and the like are defined herein.

Abstract: A capacitor includes a capacitor main body having a front surface on which a semiconductor device is to be mounted and a rear surface at which the capacitor main body is to be mounted on a first main surface of a circuit substrate, a plurality of internal electrodes disposed within the capacitor main body, and a plurality of via conductors penetrating the capacitor main body between the front surface and the rear surface and electrically connected to the internal electrodes, wherein the capacitor main body has a first dielectric layer located on a side of the capacitor main body closer to the front surface and a second dielectric layer located on a side of the first dielectric layer closer to the rear surface, the second dielectric layer having a higher thermal expansion coefficient and a higher dielectric constant than the first dielectric layer.

Abstract: A method for producing a multi-layer ceramic capacitor 10 in which reliability of electrical contact between a via electrode 28 and an internal electrode layer 24 (24a or 24b) provided between ceramic layers 22 is enhanced. A laminated sheet 100 including ceramic layers 22 and internal electrode layers 24, the layers 22 and 24 being alternately laminated and combined together, is formed, through-holes 26 are formed in the laminated sheet 100 by means of laser irradiation, and an electrically conductive material is charged into the through-holes 26 using charging container 110, to thereby form via electrodes 28. The electrically conductive material is charged, under application of pressure, into each of the through-holes 26 via an opening of the through-hole 26.

Abstract: An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.

Abstract: A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.

Abstract: A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.

Abstract: A dielectric composition is based on a BaO—MgO—Nb2O5 system material (BMN system material) having a dielectric constant, &egr;, of about 30, a large Q-value (no-load quality coefficient) and a comparatively small absolute value of the temperature coefficient (&tgr;f) of its resonance frequency but containing no expensive Ta. The dielectric material has a composite perovskite crystal structure as the main crystal phase, wherein a predetermined amount of KNbO3 is added to a BMN system material. The high frequency characteristics can be further improved by partially replacing Nb with Sb and partially replacing the B site of the perovskite crystal structure with Sn.

Abstract: A vehicle including a cabin and a centerline extending in forward and rearward directions and a transverse line intersecting the centerline. The vehicle includes a cross member extending in a first direction parallel to the transverse line. The vehicle also has an extruded floor that is connected to the cross member. The floor and the dash cross member partially define the cabin. The floor extends in a second direction, which is parallel to the centerline. The floor also has first and second side sills that are spaced from each other in the first direction and that extend in the second direction. Forward ends of the first and second side sills contact the cross member. At least one load-transmitting member is disposed between the cross member and the floor. Each one load-transmitting member applies an impact load from the cross member to the floor at a substantially right angle to the floor.

Abstract: A compact vehicle production line. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

Abstract: A wiring board obtained by coating a copper paste on a ceramic green sheet and firing it to form a conductor layer and an insulating layer, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: an SiO2 particle having an average particle size of 50 nm or less; and a ceramic particle having an average particle size of 100 nm or less and non-vitrifiable after sintering.

Abstract: A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.

Abstract: A compact vehicle production line is disclosed. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

Abstract: The bumper mounting structure includes a front side member 1 and a bumper reinforcing member 2. In assembly, the tip end of the front side member 1 is connected with the bumper reinforcing member 2. The tip end of the member 1 is opened and provided with a slant part 10, forming a weakened part in the member 1. When an impact load causes the bumper reinforcing member 2 to be deformed, the deformation of the front side member 1 is induced at its opened end because of its weakened structure. Consequently, it is possible to carry out the effective absorption of impact energy without elevating a reaction force abruptly.

Abstract: The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulated and mixed with gahnite filler and titania filler which are inorganic filler powders. Subsequently, a binder is thrown into the powders to produce a composition of dielectric ceramic, and then is formed, followed by sintering. The mixed powders may contain at least one kind of alkali metal of Li, K and Na.

Abstract: When etching a stacked-film layer including a plurality of films made of different quality materials by means of a magnetron plasma etching method, a magnetic field angle &thgr; at which the magnetic line of force 45 intersects the edge portion of a wafer surface approximately at right angles, is optimized and set to every sort of the film to be etched, thereby enabling good etching uniformity to be realized.

Abstract: A dielectric composition is based on a BaO—MgO—Nb2O5 system material (BMN system material) having a dielectric constant, &egr;, of about 30, a large Q-value (no-load quality coefficient) and a comparatively small absolute value of the temperature coefficient (&tgr;f) of its resonance frequency but containing no expensive Ta. The dielectric material has a composite perovskite crystal structure as the main crystal phase, wherein a predetermined amount of KNbO3 is added to a BMN system material. The high frequency characteristics can be further improved by partially replacing Nb with Sb and partially replacing the B site of the perovskite crystal structure with Sn.

Abstract: A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2Si2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole % or less.

Abstract: An optical recording medium in which a high recording density is to be realized as compatibility with respect to a pre-existing optical recording medium is kept. A wobbling groove 5 is formed on a disc substrate 1. The modulation/demodulation system for the wobbling signals recorded on the wobbling groove 5 and that for information signals recorded and/or reproduced on or from the recording track are made to be the same as the modulation/demodulation system for a standardized pre-existing optical recording medium. Moreover, if the track pitch of kept recording track is Tp, the shortest recording mark period in recording on kept recording track is Mc, the wavelength of a light beam used in recording and/or reproducing kept recording track is &lgr;, and the numerical aperture of the objective lens is NA, the following relation (1) to (3) X=Tp/(&lgr;/NA)  (1) Y=Mc/(&lgr;/NA)  (2) Y>2.9118X2−5.5422X+3.19  (3) are met.

Abstract: An optical recording medium which can provide a wobbling signal at a sufficiently high level even if the track pitch is reduced to enhance the recording density. The recording medium can attain a practically adequate recording-reproducing characteristic such as jitter characteristic. The medium has a wobbling groove that has a depth falling within the range of &lgr;/2.90 n to &lgr;/2.15 n. Here, &lgr; is the wavelength of a light beam applied to record and reproduce signals and n is the refractive index of the substrate of the optical recording medium. The ratio of the width Wg of the wobbling groove to the track pitch Tp (Wg/Tp) falls within the range of 25.0% to 45.5%.