Abstract: A robot system including a robot apparatus and an imaging apparatus includes a control apparatus configured to control the robot apparatus and the imaging apparatus, and the control apparatus controls, based on a path in which a predetermined part of the robot apparatus is moved, a movement of the imaging apparatus to image the predetermined part even if the robot apparatus is moved.

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a resistance film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the resistance film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the resistance film and such that an exte

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a conductor film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the conductor film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the conductor film and such that an externa

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a resistance film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the resistance film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the resistance film and such that an exte

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a conductor film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the conductor film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the conductor film and such that an externa

Abstract: A common mode choke coil has a plurality of metallic conducting wires buried into a sintered magnetic material such that the metallic conducting wires are proximate to each other and an electrode mounted on a surface of the sintered magnetic material so as to be connected to each end portion of each of the metallic conducting wires. The metallic conducting wires are integrally coated with a non-magnetic and electrically insulating material at a predetermined distance between each of the metallic conducting wires to thereby form coated conducting wires. The coated conducting wires buried into the sintered magnetic material are thus obtained.

Abstract: A common mode choke coil has a plurality of metallic conducting wires buried into a sintered magnetic material such that the metallic conducting wires are proximate to each other and an electrode mounted on a surface of the sintered magnetic material so as to be connected to each end portion of each of the metallic conducting wires. The metallic conducting wires are integrally coated with a non-magnetic and electrically insulating material at a predetermined distance between each of the metallic conducting wires to thereby form coated conducting wires. The coated conducting wires buried into the sintered magnetic material are thus obtained.

Abstract: A rotary disc made of synthetic resin has a fixed portion fixed to a rotary shaft, a cylindrical portion extending in the thrust direction from the outer peripheral edge of the fixed portion, and a disc main body portion extending in the radial direction from the lower portion of the cylindrical portion, and a scale portion for detecting the rotation angle is disposed on the underside of the disc main body portion.

Abstract: It is an object of this invention to provide a mold for manufacturing an optical scale which can be easily manufactured and is capable of outputting high-precision position signals. In order to achieve this object, there is provided a mold for an optical scale, which has fixed and movable platens and is used to mold an optical scale, wherein both a first mold portion for forming a shaft mount hole for the optical scale and a second mold portion for forming a slit portion of the optical scale are arranged in one of the fixed and movable platens.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: An optical encoder has a light irradiating device; an optical scale having a grating for transmitting or reflecting incident light; light-receiving elements disposed in a plurality of different directions; and an optical system for amplitude-modulating light traveling from the light irradiating device to the optical scale and transmitted or reflected by the grating, by a dividing element in which a plurality of V-shaped grooves are juxtaposed, and for dividing the amplitude-modulated light into beams along a plurality of different directions to guide the beams to the respective light-receiving elements. The dividing element is comprised of repetitions of such structure that a plurality of V-grooves consisting of planes of mutually different angles are juxtaposed at a predetermined pitch.

Abstract: This invention relates to a displacement information detecting apparatus which has a light beam illuminating system for making a light beam enter a first area of the grating portion of a relatively displaceable scale member provided with a grating portion having a wavefront dividing function in the direction of grating arrangement, a reflecting member for reflecting the light beam having emerged from the first area into which the light beam has been made to enter by the light beam illuminating system to enter a second area which is in a direction substantially perpendicular to the grating arrangement relative to the first area, and a plurality of light receiving portions for receiving a plurality of light beams created by the wavefront dividing function in the second area into which the light beam has been made to enter by the reflecting member, a signal corresponding to the displacement relative to the scale member being provided by the light reception by each of the light receiving portions.

Abstract: A common mode choke coil has a plurality of metallic conducting wires buried into a sintered magnetic material such that the metallic conducting wires are proximate to each other and an electrode mounted on a surface of the sintered magnetic material so as to be connected to each end portion of each of the metallic conducting wires. The metallic conducting wires are integrally coated with a non-magnetic and electrically insulating material at a predetermined distance between each of the metallic conducting wires to thereby form coated conducting wires. The coated conducting wires buried into the sintered magnetic material are thus obtained.

Abstract: A common mode choke coil has a plurality of metallic conducting wires buried into a sintered magnetic material such that the metallic conducting wires are proximate to each other and an electrode mounted on a surface of the sintered magnetic material so as to be connected to each end portion of each of the metallic conducting wires. The metallic conducting wires are integrally coated with a non-magnetic and electrically insulating material at a predetermined distance between each of the metallic conducting wires to thereby form coated conducting wires. The coated conducting wires buried into the sintered magnetic material are thus obtained.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: A wound type common mode choke coil resulting in a tip shape finished product is provided, having a good appearance, high reliability, and excellent common mode characteristics, by reducing the profile of the common mode component. This wound type common mode choke coil has a magnetic core with square collar portions at both ends of a winding core, grooves in the square collars, first electrodes, a pair of coil conductors wound around the winding core portion connected conductively to the first electrode layers of the collar portions, a non-magnetic first insulation coating layer coating the outer circumference of the magnetic core, a second insulation coating layer containing magnetic power armor-coated to the whole outer circumference of the common mode choke coil, and second electrode layers coating from the groove portions over the first electrode layers.

Abstract: A rotary disc made of synthetic resin has a fixed portion fixed to a rotary shaft, a cylindrical portion extending in the thrust direction from the outer peripheral edge of the fixed portion, and a disc main body portion extending in the radial direction from the lower portion of the cylindrical portion, and a scale portion for detecting the rotation angle is disposed on the underside of the disc main body portion.

Abstract: A common mode choke coil adapted for surface mount applications is provided which is minimized in overall size (particularly in height), and has an improved bonding coefficient.