Abstract: A rotary disc made of synthetic resin has a fixed portion fixed to a rotary shaft, a cylindrical portion extending in the thrust direction from the outer peripheral edge of the fixed portion, and a disc main body portion extending in the radial direction from the lower portion of the cylindrical portion, and a scale portion for detecting the rotation angle is disposed on the underside of the disc main body portion.

Abstract: A common mode choke coil adapted for surface mount applications is provided which is minimized in overall size (particularly in height), and has an improved bonding coefficient.

Abstract: A chip inductor has a coiled conducting wire and a magnetic core which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic core in an arcuate or similar shape. External electrodes are coated on both the end surfaces of the magnetic core and are connected to both end portions of the coiled conducting wire.

Abstract: A common mode choke coil adapted for surface mount applications minimized in overall size (particularly in height), with an improved bonding coefficient. This common mode choke coil has a structure comprising a ferrite core consisting of a winding core and two square planar flanges with recesses formed therein, the square planar flanges being formed integrally on each end of a winding core thereof, a pair of external electrodes disposed on the square planar flanges, a plurality of windings wound about the winding core of the ferrite core and connected by thermal bonding to the external electrodes at the recesses provided in the left and right sides of each flange, and a ferrite plate adhesively bonded to the outermost surface of the windings to join the two flanges at both ends of the ferrite core, without an adhesive bonding to the flanges themselves. As a result, a closed magnetic circuit structure of a cubic component having a high rate of bonding coefficient is obtained.

Abstract: It is an object of this invention to provide a mold for manufacturing an optical scale which can be easily manufactured and is capable of outputting high-precision position signals. In order to achieve this object, there is provided a mold for an optical scale, which has fixed and movable platens and is used to mold an optical scale, wherein both a first mold portion for forming a shaft mount hole for the optical scale and a second mold portion for forming a slit portion of the optical scale are arranged in one of the fixed and movable platens.

Abstract: A wound type common mode choke coil resulting in a tip shape finished product is provided, having a good appearance, high reliability, and excellent common mode characteristics, by reducing the profile of the common mode component. This wound type common mode choke coil has a magnetic core with square collar portions at both ends of a winding core, grooves in the square collars, first electrodes, a pair of coil conductors wound around the winding core portion connected conductively to the first electrode layers of the collar portions, a non-magnetic first insulation coating layer coating the outer circumference of the magnetic core, a second insulation coating layer containing magnetic power armor-coated to the whole outer circumference of the common mode choke coil, and second electrode layers coating from the groove portions over the first electrode layers.

Abstract: A chip inductor has a coiled conducting wire and a magnetic core which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic core in an arcuate or similar shape. External electrodes are coated on both the end surfaces of the magnetic core and are connected to both end portions of the coiled conducting wire.

Abstract: An electronic device including a ceramic element and outer electrodes wherein each of the outer electrodes includes an undercoat layer, an intermediate metal plating layer formed on the undercoat layer and a surface layer formed by metal plating which is formed on the intermediate metal plating layer; the intermediate metal plating layer is extended beyond the edge of the periphery of the undercoat layer to a surface portion of the ceramic element; and the undercoat layer is entirely coated with the intermediate metal plating layer.