Abstract: The invention relates to a cell balancing module, particularly for voltage balancing of a stack of batteries. The cell balancing module comprises an interface (SPI, VrefH, VrefL) to input a coded reference voltage (Vref) and input nodes (In1, . . . , InN) for connecting a stack of energy storage cells (BAT1, . . . , BATn). A switching unit (SW) is connected to each of the input nodes (In1, . . . , InN) and a local balancing unit (loc) coupled to the switching unit (SW) and the interface (SPI, VrefH, VrefL). The local balancing unit (loc) is designed to compare the coded reference voltage (Vref) with cell voltages (VBAT1, . . . , VBATn) of the stack of energy storage cells (BAT1, . . . , BATn) to be connected and to charge balance the stack of energy storage cells (BAT1, . . . , BATn) to be connected depending on the comparison of coded reference voltage (Vref) and cell voltages (VBAT1, . . . , VBATn).

Abstract: An arrangement for operating a sensor, in particular a bridge sensor, comprises a sensor input (Vin1, Vin2) for connecting the sensor (Brdg) and a clocked signal generator (Osc), which is coupled to the sensor input (Vin1, Vin2). Furthermore an amplifier (Amp) is provided for detecting sensor signals (Sn, Sn+1), which is connected on the input side to a signal input (IN+, IN?) for connecting the sensor (Brdg), wherein the detection takes place depending on the clock pulse of the signal generator (Osc). A signal processing device (PROC) is connected to an output (AOUT+, AOUT?) of the amplifier (Amp) and is arranged to demodulate the sensor signals (Sn, Sn+1) that follow one another according to the clock pulse.

Abstract: The invention relates to a spring (1), in particular for a push button, for fixing to a carrier (2) and for registering a vertical force (F). The spring (3) is designed in such a way that when actuated it converts a vertical movement into a horizontal movement that can be detected by sensor means (4).

Abstract: An arrangement for operating a sensor, in particular a bridge sensor, comprises a sensor input (Vin1, Vin2) for connecting the sensor (Brdg) and a clocked signal generator (Osc), which is coupled to the sensor input (Vin1, Vin2). Furthermore an amplifier (Amp) is provided for detecting sensor signals (Sn, Sn+1), which is connected on the input side to a signal input (IN+, IN?) for connecting the sensor (Brdg), wherein the detection takes place depending on the clock pulse of the signal generator (Osc). A signal processing device (PROC) is connected to an output (AOUT+, AOUT?) of the amplifier (Amp) and is arranged to demodulate the sensor signals (Sn, Sn+1) that follow one another according to the clock pulse.

Abstract: The invention relates to a cell balancing module, particularly for voltage balancing of a stack of batteries. The cell balancing module comprises an interface (SPI, VrefH, VrefL) to input a coded reference voltage (Vref) and input nodes (In1, . . . , InN) for connecting a stack of energy storage cells (BAT1, . . . , BATn). A switching unit (SW) is connected to each of the input nodes (In1, . . . , InN) and a local balancing unit (loc) coupled to the switching unit (SW) and the interface (SPI, VrefH, VrefL). The local balancing unit (loc) is designed to compare the coded reference voltage (Vref) with cell voltages (VBAT1, . . . , VBATn) of the stack of energy storage cells (BAT1, . . . , BATn) to be connected and to charge balance the stack of energy storage cells (BAT1, . . . , BATn) to be connected depending on the comparison of coded reference voltage (Vref) and cell voltages (VBAT1, . . . , VBATn).

Abstract: The invention relates to a spring (1), in particular for a push button, for fixing to a carrier (2) and for registering a vertical force (F). The spring (3) is designed in such a way that when actuated it converts a vertical movement into a horizontal movement that can be detected by sensor means (4).

Abstract: A device for inspecting and rotating electronic components, particularly flip chips, includes a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. Also a method for inspecting and rotating electronic components, particularly flip chips.

Abstract: A magnetic field sensor arrangement (4) comprises a stacked arrangement (1) with a first magnetic field sensor body (20) and a second magnetic field sensor body (40). The first magnetic field sensor body (20) has a first main surface (21), on which is arranged a first magnetic field sensitive element (23), and a second main surface (22), which is approximately parallel to the first main surface (21). The second magnetic field sensor body (40) has similarly a first main surface (41), on which is arranged a second magnetic field sensitive element (43), and a second main surface (42), which is approximately parallel to the first main surface (41).

Abstract: In a method for transmitting data, the step of transmitting the data representing a measured pressure or pressure variation is repeated with a first repetition rate if no pressure variation has been detected or repeated with a second repetition rate if a specific pressure variation has been detected. The second repetition rate is higher than the first repetition rate. The different repetition frequencies can be used in a method for determining a tire position in a tire pressure measurement system to switch between a first mode of operation and a second mode of operation. The method for determining a tire position evaluates the repetition rate between the received data packets of transmitted data and extracts a pressure variation out of the received data packets.

Abstract: A magnetic field sensor arrangement (4) comprises a stacked arrangement (1) with a first magnetic field sensor body (20) and a second magnetic field sensor body (40). The first magnetic field sensor body (20) has a first main surface (21), on which is arranged a first magnetic field sensitive element (23), and a second main surface (22), which is approximately parallel to the first main surface (21). The second magnetic field sensor body (40) has similarly a first main surface (41), on which is arranged a second magnetic field sensitive element (43), and a second main surface (42), which is approximately parallel to the first main surface (41).

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: In a method for transmitting data, the step of transmitting the data representing a measured pressure or pressure variation is repeated with a first repetition rate if no pressure variation has been detected or repeated with a second repetition rate if a specific pressure variation has been detected. The second repetition rate is higher than the first repetition rate. The different repetition frequencies can be used in a method for determining a tire position in a tire pressure measurement system to switch between a first mode of operation and a second mode of operation. The method for determining a tire position evaluates the repetition rate between the received data packets of transmitted data and extracts a pressure variation out of the received data packets.

Abstract: The present invention describes a microsensor with a sensor element (2) and an integrated circuit (1), containing a semiconductor body (11) with an intergrated circuit (4), the sensor element (2) being positioned on a main surface (12) of the semiconductor body (11) and there being a eutectic connection (3) formed between the semiconductor body (11) and the sensor element (2).

Abstract: To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: An apparatus for detecting torque affecting an axle includes a carrier system, located along the axle, and having a central detector segment and external detector segments. The central detector segment and external detector segments interacts such that rotary motion of an external detector segment results in axial motion of the central detector segment. A sensor detects relative motion of the central detector segment, and produces a differential signal following the relative motion.

Abstract: To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.

Abstract: The present invention describes a microsensor with a sensor element (2) and an integrated circuit (1), containing a semiconductor body (11) with an integrated circuit (4), the sensor element (2) being positioned on a main surface (12) of the semiconductor body (11) and there being a eutectic connection (3) formed between the semiconductor body (11) and the sensor element (2).

Abstract: In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.