Patents by Inventor Manfred Brandl

Manfred Brandl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for housing sensors in a package
    Patent number: 6395585
    Abstract: A method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires. In a second method step, the package is formed by molding, in particular injection molding. In a third method step, or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: May 28, 2002
    Assignee: Austria Mikro Systeme International Aktiengesellschaft
    Inventor: Manfred Brandl
  • Method for housing sensors in a package
    Publication number: 20010023087
    Abstract: There is disclosed a method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires. In a second method step, the package is formed by molding, in particular injection molding. In a third method step, or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.
    Type: Application
    Filed: March 13, 2001
    Publication date: September 20, 2001
    Inventor: Manfred Brandl