Abstract: A housing for biometric sensor chips and a method for producing such a housing includes a freely accessible fingerprint checking area on a sensor chip, a mount substrate with contact outer surfaces thereon, the mount substrate being a mounting strip with perforated edges, on which the contact outer surfaces are disposed partially outside a housing frame, and the sensor chip is positioned within the housing frame.

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Abstract: A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.

Abstract: A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

Abstract: A flat carrier having a power supply, for example in the form of a coil. The carrier is characterized by an electroluminescent device that contains two flat electrodes lying above one another and an electroluminescent paste located between the electrodes. The electrodes of the electroluminescent device are connected to terminals of the power supply, which can be implemented, for example, as a coil or battery.

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Abstract: The portable data transmission system is adapted to the contactless transmission of electrical signals and/or data between a smart card and a read-write station. The smart card has an electronic circuit with a data memory and an induction coil integrated in a smart card body. A coupling element is assigned to the induction coil and is disposed in a predetermined spatial position with regard to the induction coil. The smart card and the coupling element are respectively autonomous components which can be used independently of one another. A fixing element is at least partially matched to the outer dimensions of the smart card. The fixing element supports the smart card, on the one hand, and the coupling element, on the other hand, in the predetermined position with regard to the smart card.

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Abstract: A copy-protection device for a semiconductor chip with a cover has a resonant oscillating circuit whose elements are located on the chip surface and within the cover. The semiconductor chip also has an evaluation circuit connected to the oscillating circuit. The evaluation circuit disables the semiconductor chip if the oscillating circuit is detuned and thus stopped from resonating. This detuning of the oscillating circuit occurs when the cover is removed, since the cover acts as a dielectric for the capacitor. After the cover has been removed, it is impossible to operate the semiconductor chip, in order to copy or analyze it.

Abstract: A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrated manner. The semiconductor chip is provided on its surface with contact elements for electrical connection of the electronic circuit and the contact connections of the coupling element. A carrier made of an electrically insulating material supports at least part of the conductor tracks and the contact connections of the coupling element. The carrier is provided with an aperture in the vicinity of the contact connections of the coupling element, for receiving the semiconductor chip.