Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
Latest Siemens Aktiengesellschaft Patents:
- Network Node Point and Method for Linking Different Input Devices
- Verification of Data of an Authentication and Key-Agreement Protocol Process
- Workflow Execution Methods and Apparatus, Storage Medium, and Program Product
- SEMICONDUCTOR ASSEMBLY HAVING A SEMICONDUCTOR ELEMENT AND A SUBSTRATE
- CIRCUIT ASSEMBLY WITH A CIRCUIT CARRIER AND A SEMICONDUCTOR COMPONENT
Description
The single FIGURE is a top perspective view of a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module showing our new design.
The features on the undisclosed bottom are not claimed.
Referenced Cited
Patent History
Patent number: D406821
Type: Grant
Filed: Sep 8, 1997
Date of Patent: Mar 16, 1999
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Jurgen Fischer (Deuerling), Manfred Fries (Hunderdorf), Josef Mundigl (Duggendorf), Frank Puschner (Kelheim), Christian Hauser (Regensburg)
Primary Examiner: Brian N. Vinson
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/76,604
Type: Grant
Filed: Sep 8, 1997
Date of Patent: Mar 16, 1999
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Jurgen Fischer (Deuerling), Manfred Fries (Hunderdorf), Josef Mundigl (Duggendorf), Frank Puschner (Kelheim), Christian Hauser (Regensburg)
Primary Examiner: Brian N. Vinson
Attorneys: Herbert L. Lerner, Laurence A. Greenberg
Application Number: 0/76,604
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;