Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Abstract: The invention relates to a device (14) for laminating a film-tape-like multilayer thermoplastic film arrangement (1), according to the invention comprising heatable press plates (8.1, 8.2) and cooling surfaces (10), wherein a width of said press plates (8.1, 8.2) and cooling surfaces (10) is greater than or equal to a width of the film arrangement (1), wherein the film arrangement (1) is arranged in the position thereof relative to the press plates (8.1, 8.2) such that press plate edges (20) lie at the grid center (5.1) and the cooling surfaces (10) are arranged with a distance up to 3 mm next to a press plate edge (20) and beginning in the same grid (5), wherein a length of the cooling surfaces (10) is greater than or equal to a length of the press plates (8.1, 8.2), wherein one press plate (8.1, 8.2) and one cooling surface (10) are respectively arranged on both sides of the film arrangement (1), wherein the press plates (8.1, 8.

Abstract: The invention refers to a method for manufacturing such a functional laminate, the method comprising the following steps: providing at least one patchwork layer; stacking the patchwork layer with at least one other layer in order to obtain a stack of layers, wherein at least one proximate layer directly adjacent to the patchwork layer comprises at least one zone comprising a first material or a second material; laminating the stack of layers together by heat and/or pressure and/or gluing.

Abstract: The present invention relates to a circuit arrangement (1) having a prescribed electrical capacitance, comprising a substrate (S) having at least one metallic, electrically conductive conductor (L, Lb, Ls). According to the invention, at least one first conductor strip segment (LA1) is disposed on the substrate (S) and at least some regions of at least one second conductor strip segment (LA2, LA3, LA4) are disposed on the first conductor strip segment (LA1), wherein an electrically insulating layer (iS) is disposed between the conductor strip segments (LA1, LA2, LA3, LA4), forming a dielectric. The invention further relates to a method and a device (2) for producing a circuit arrangement (1) having a prescribed electrical capacitance.

Abstract: The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.

Abstract: The invention relates to a chip card having a card body (36) which is equipped with a cavity on the top side thereof, and a chip module (37) which is inserted into the cavity in such a way that contacts (38) of the module face antenna contacts (39) of the antenna arranged in the card body, said antenna contacts being arranged in a bottom of the cavity, and in such a way that the module contacts make electrical contact with the antenna contacts via wire connections (60) which are formed by contact conductors and are arranged in the cavity, wherein the wire connections have a contact conductor cross-section whose width along a transverse axis arranged parallel to a contact surface of the antenna contacts or of the module contacts is larger than the height of said cross-section along a vertical axis arranged perpendicular to the contact surface of the antenna contacts or of the module contacts.

Abstract: The present invention relates to a circuit arrangement (1) having a prescribed electrical capacitance, comprising a substrate (S) having at least one metallic, electrically conductive conductor (L, Lb, Ls). According to the invention, at least one first conductor strip segment (LA1) is disposed on the substrate (S) and at least some regions of at least one second conductor strip segment (LA2, LA3, LA4) are disposed on the first conductor strip segment (LA1), wherein an electrically insulating layer (iS) is disposed between the conductor strip segments (LA1, LA2, LA3, LA4), forming a dielectric. The invention further relates to a method and a device (2) for producing a circuit arrangement (1) having a prescribed electrical capacitance.

Abstract: The present invention relates to a method for producing a functional laminate (14), wherein the method comprises the following steps: providing at least one thermoplastic film as the substrate layer (8), producing at least one aperture (9) in the substrate layer (8), inserting at least one functional component (1) into the aperture (9), laminating the substrate layer (8) with at least one additional plastic film as the cover layer (10, 10.1, 10.2) by applying pressure and supplying heat. A soft, elastic and temperature-resistant embedding material is disposed such that the functional component (1) is surrounded by the embedding material at least in the substrate layer (8), said embedding material having a thermal expansion coefficient that is at least as large as a thermal expansion coefficient of the material of the substrate layer (8), wherein the shrinkage behavior of the embedding material and of the material of the substrate layer (8) is similar or the same.

Abstract: The invention relates to a device (14) for laminating a film-tape-like multilayer thermoplastic film arrangement (1), according to the invention comprising heatable press plates (8.1, 8.2) and cooling surfaces (10), wherein a width of said press plates (8.1, 8.2) and cooling surfaces (10) is greater than or equal to a width of the film arrangement (1), wherein the film arrangement (1) is arranged in the position thereof relative to the press plates (8.1, 8.2) such that press plate edges (20) lie at the grid center (5.1) and the cooling surfaces (10) are arranged with a distance up to 3 mm next to a press plate edge (20) and beginning in the same grid (5), wherein a length of the cooling surfaces (10) is greater than or equal to a length of the press plates (8.1, 8.2), wherein one press plate (8.1, 8.2) and one cooling surface (10) are respectively arranged on both sides of the film arrangement (1), wherein the press plates (8.1, 8.

Abstract: The invention concerns a functional laminate and a method for manufacturing said functional laminate, the method comprising the following steps:—providing a substrate sheet (1);—inserting at least one functional component (2) into the substrate sheet (1);—wearing out the substrate sheet (1) and/or at least one layer laminated to the substrate sheet (1) in an area adjacent to the functional component (2) resulting in at least one recess (5) with a small width in proportion to dimensions of the functional component (2) before at least one lamination step;—carrying out at least one lamination step, wherein the substrate sheet (1) is laminated with at least one additional layer by heat and/or pressure and/or gluing in such a manner that the width of the at least one recess (5) is considerably reduced or the at least one recess (5) is barely shut at least by surrounding material after lamination by virtue of shrinking of the substrate sheet (1) and/or the at least one additional layer.

Abstract: The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier (7) made of plastic, on whose two larger opposite outer surfaces a paper layer (6) applied by lamination is in each case applied.

Abstract: The method comprises the following steps: the substrate in the form of a one-piece basic substrate (4) is prepatterned into regions corresponding to future modules, pads of the semiconductor chip (1) are then contact-connected in predetermined regions of a first area of the basic substrate (4) and on the top side (12) of the prepatterned basic substrate (4) and on one area side of the semiconductor chip (1) a first adhesive layer (16) is applied, a second adhesive layer (17) is subsequently applied to the other area side of the semiconductor chip (1), and a curing of the adhesive layers (16, 17) and a final patterning of the metallic basic substrate (4) are then effected.

Abstract: A circuit layout having a substrate with at least one electronic component, wherein contacts of the electronic component are electrically connected to contacting regions of a conductor strip. Furthermore, a method for producing a circuit pattern is provided, whereby at least one conductor strip is attached onto at least one surface side of the substrate, the conductor strip being coated with a meltable insulating varnish and whereby the insulating varnish is heated and the conductor strip is pressed onto the substrate. A device is also provided for producing a circuit pattern comprising a conductor strip coil and a cylindrical or conical laying tool, which at least over a part of its length has an interior bore guiding the conductor strip and an annular active area arranged perpendicular to its longitudinal axis and merging in inner and outer radius.

Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Abstract: The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips (3) on a metallic substrate (16), whereby an etch resist (27) is located at least on one substrate side, and semiconductor chips (3) are contacted on the contacting side (30) by means of flip-chip bonding processes, during which a contacting region (7) is created on the contacting side (30) of the substrate (16).

Abstract: The invention refers to a functional laminate (1) comprising at least two co-laminated layers (2, 2?, 3, 3?), wherein at least one of the layers (2, 2?, 3, 3?) is a patchwork layer consisting of zones (2.1 to 2.n, 2?.1 to 2?.n, 3.1 to 3.n, 3?.1 to 3?.n) of multiple types distinct from each other, wherein at least one zone (2.1 to 2.n, 2?.1 to 2?.n, 3.1 to 3.n, 3?.1 to 3?.n) of a first type comprises a first material and one zone (2.1 to 2.n, 2?.1 to 2?.n, 3.1 to 3.n, 3?.1 to 3?.n) of a second type comprise a second material, distinct from the first material, and wherein the proximate layer or layers (2, 2?, 3, 3?) adjacent to the patchwork layer (2, 2?, 3, 3?) comprises or comprise at least one zone (2.1 to 2.n, 2?.1 to 2?.n, 3.1 to 3.n, 3?.1 to 3?.n) comprising the first or the second material.

Abstract: The method comprises the following steps: the substrate in the form of a one-piece basic substrate (4) is prepatterned into regions corresponding to future modules, pads of the semiconductor chip (1) are then contact-connected in predetermined regions of a first area of the basic substrate (4) and on the top side (12) of the prepatterned basic substrate (4) and on one area side of the semiconductor chip (1) a first adhesive layer (16) is applied, a second adhesive layer (17) is subsequently applied to the other area side of the semiconductor chip (1), and a curing of the adhesive layers (16, 17) and a final patterning of the metallic basic substrate (4) are then effected.

Abstract: The invention refers to a functional laminate including at least one electrically conductive component, particularly an antenna coil or a track, arranged on a non-woven substrate with a grammage of less than 25 g/m2.