Abstract: The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.

Abstract: The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier (7) made of plastic, on whose two larger opposite outer surfaces a paper layer (6) applied by lamination is in each case applied.

Abstract: The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips (3) on a metallic substrate (16), whereby an etch resist (27) is located at least on one substrate side, and semiconductor chips (3) are contacted on the contacting side (30) by means of flip-chip bonding processes, during which a contacting region (7) is created on the contacting side (30) of the substrate (16).