Abstract: An apparatus and methods for testing an integrated device comprising memory a test device are provided. At least two data inputs of the memory are coupled to a data output of the test device. As an alternative, at least two data outputs of the memory are coupled to a data input of the test device. Test data are transferred from the test device to the memory chip and written to memory cells of the memory. Data are read from the memory cells of the memory and transferring from the memory to the test device. The data read from the memory chip are compared with the test data written to the memory in order to identify faults of the memory.

Abstract: An integrated device comprises a functional circuit, a test circuit for testing the functional circuit and for providing an error data item and a register element for storing the error data item and for outputting the error data item at an error data output of the integrated device responsive to an output signal. The register element is connected to a data input of the integrated device in order to accept a data item, which is applied to the data input, responsive to the output signal.

Abstract: A device can be used for refreshing memory contents of first and second memory cells. The memory contents of the first memory cells are refreshed in a first period of time and the memory contents of the second memory cells are refreshed in a second period of time. A pre-charge circuit is provided for bit lines for the first memory cells and the second memory cells. A controller may be coupled to the pre-charge circuit to control the pre-charge circuit such that a pre-charge voltage may be applied to the bit lines of the first memory cells during the first period of time and not during the second period of time and that the pre-charge voltage may be applied to the bit lines of the second memory cells during the second period of time and not during the first period of time.

Abstract: A method for improving the reliability of a memory having a used memory region and an unused memory region, wherein defect memory elements in the used memory region can be substituted by functional memory elements in the unused memory region, having the steps of providing the used memory region with a first stress sequence; and providing the unused memory region with a second stress sequence.

Abstract: Semiconductor memories (1) have segmented word lines (5a, 5b), which in each case have a main word line (10a, 10b) made of a conductive metal and a plurality of interconnect segments (15a, 15b) coupled to the main word line (10a, 10b), which are coupled to the respective main word line (10a, 10b) in each case via at least one contact hole filling (11). If one of the contact hole fillings (11) is defective or at high resistance then functional errors of the semiconductor memory occur. The interconnect segments (15a, 15b) of two respective word lines (5a, 5b) can be short-circuited in pairs with the aid of switching units (20), whereby a static current (I) that flows via the contact hole fillings (11) can be used for electrically stressing the contact hole fillings (11). Electrical stressing of contact hole fillings of segmented word lines is thus made possible.

Abstract: An integrated semiconductor memory device includes at least one memory cell, at least one sense amplifier and a pair of bit lines connected to each sense amplifier, where each memory cell includes a selection transistor and a storage capacitor. The storage capacitor of each memory cell includes a first capacitor electrode and a second capacitor electrode, and the selection transistor of each memory cell includes a first source/drain region that is connected by a first contact connection to one bit line of a pair of bit lines corresponding with the memory cell, and a second source/drain region that is conductively connected to the first capacitor electrode of the storage capacitor of the memory cell. The second capacitor electrode of the storage capacitor of each memory cell is connected to the other bit line of the pair of bit lines corresponding with the memory cell.

Abstract: A memory device and method for internal voltage monitoring is disclosed. One embodiment includes at least one error register configured to store a particular error flag during the stress test. This error flag is generated if the supply voltage applied at the memory device during the test method in the memory device or an internally generated voltage of the memory device lies below a predetermined threshold value.

Abstract: An apparatus and methods for testing an integrated device comprising memory a test device are provided. At least two data inputs of the memory are coupled to a data output of the test device. As an alternative, at least two data outputs of the memory are coupled to a data input of the test device. Test data are transferred from the test device to the memory chip and written to memory cells of the memory. Data are read from the memory cells of the memory and transferring from the memory to the test device. The data read from the memory chip are compared with the test data written to the memory in order to identify faults of the memory.

Abstract: A semiconductor memory and method for testing semiconductor memory is disclosed. One embodiment provides a method including activating a first master word line. An electric voltage difference between the first master word line and an adjacent master word line is generated. The leakage current between the first master word line and the adjacent master word line is measured.

Abstract: A device is disclosed for refreshing memory contents of first and second memory cells, wherein the memory contents of the first memory cells are refreshed in a first period of time and the memory contents of the second memory cells are refreshed in a second period of time, having a pre-charge circuit for bit lines for the first memory cells and the second memory cells, and having a controller which may be coupled to the pre-charge circuit to control the pre-charge circuit such that a pre-charge voltage may be applied to the bit lines of the first memory cells during the first period of time and not during the second period of time and that the pre-charge voltage may be applied to the bit lines of the second memory cells during the second period of time and not during the first period of time.

Abstract: A memory circuit comprises a memory cell array with dynamic memory cells arranged on word lines and bit lines, a selection unit providing selection information and a refresh circuit selecting the memory cells in each case in dependence on the selection information and refreshing the selected memory cells so that any information stored therein is retained in each case.

Abstract: Methods and apparatus for applying a test pattern to cells in a memory module. A test auxiliary device in a memory module contains a test pattern selection device for selecting a test pattern from at least two elementary M-bit test patterns. The test pattern is applied to a group of M data lines of the memory module, M being an integer.

Abstract: An integrated semiconductor memory with a test function comprises a bit line pair having a first end and a second end. A voltage generation circuit having a first connection and a second connection is coupled to the first end of the bit line pair. A plurality of memory cells are connected to a bit line of the bit line pair between the first end and second end of the bit line pair. A controllable switch is connected between the second end of the bit line pair.

Abstract: An integrated device comprises a functional circuit, a test circuit for testing the functional circuit and for providing an error data item and a register element for storing the error data item and for outputting the error data item at an error data output of the integrated device responsive to an output signal. The register element is connected to a data input of the integrated device in order to accept a data item, which is applied to the data input, responsive to the output signal.

Abstract: An integrated semiconductor memory includes word lines connected to a first voltage potential via a respective first controllable switch and a respective third controllable switch and to a second voltage potential via a respective second controllable switch. In order to test whether one of the word lines is connected to the first voltage potential via its respective first and third controllable switches, the one of the word lines is connected to a comparator circuit via the respective second controllable switch and a driver line. After the respective first and third controllable switches have been controlled into the on state, in a test operating state of the integrated semiconductor memory, the respective second controllable switch is controlled into the on state and a potential state on the word line is evaluated by the comparator circuit. The result of the evaluation is fed to an external data terminal by an evaluation signal.

Abstract: An integrated circuit, in particular, an integrated memory, contains a control circuit for ascertaining an operating state of the circuit. A self-repair circuit, which is connected to the control circuit, is used to implement self-test and self-repair operation for checking the functioning of, and repairing, defective circuit sections of the integrated circuit. After a supply voltage has been applied to the integrated circuit, the control circuit ascertains an operating state of the integrated circuit and, in a manner dependent thereon, the self-repair circuit is activated by the control circuit in a self-controlling manner in order to put the integrated circuit into a self-repair mode for implementing self-test and self-repair operation. The integrated circuit can be tested for its functionality and repaired even after being soldered onto a module substrate.

Abstract: A circuit arrangement can have a number of integrated circuit components, which are arranged on a carrier substrate. A reception circuit for receiving a control signal can be coupled to one of the connection pads on the input side and can be connected to each of the circuit components on the output side. A bridging circuit controlled by a test mode signal can electrically bridge the reception circuit. In a testing method, a plurality of connection pads can be connected to a first potential and at least one of the connection pads can be connected to a second potential. The bridging circuit can be activated and the current measured, by a test arrangement, at the at least one of the connection pads. Inspection for leakage currents in connections between input-side reception circuits and the circuit components can be measured.

Abstract: A semiconductor memory and a method for operating the latter in order are provided, at least in testwise fashion, to deactivate a word line segment (12) of a segmented word line not via a first line (21) otherwise used for deactivation, but rather via a second line (22) via that the word line segment (12) is otherwise activated. The second line (22) can optionally be biased with a second potential (Vpp) provided for activation or with a third potential (Vgnd). If the third potential (Vgnd) is used for at least temporarily deactivating the word line segment (12), the word line segment can be driven via a switching element (17), which couples the word line segment to the second line (22), without the complementary switching element (16) of the driver segment (20) having to be used for deactivation.

Abstract: An integrated semiconductor memory including memory cells which can be driven via first and second word lines and can be replaced by redundant memory cells. In the first memory cell type, data can be stored corresponding to the data present at a data input terminal. In the memory cells of a second memory cell type, data can be stored inverted with respect to data present at the data input terminal. The integrated semiconductor memory includes a circuit for data inversion, wherein the data are written to a redundant memory cell, inverted with respect to the data present at the data input terminal if the defective memory cell and the redundant memory cell replacing it are situated in different word line strips of a bit line twist, and if the defective memory cell and the redundant memory cell replacing it are associated with different memory cell types.

Abstract: A method for improving the reliability of a memory having a used memory region and an unused memory region, wherein defect memory elements in the used memory region can be substituted by functional memory elements in the unused memory region, having the steps of providing the used memory region with a first stress sequence; and providing the unused memory region with a second stress sequence.