Patents by Inventor Mani Prakash

Mani Prakash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11717347
    Abstract: A microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. Proximal and distal radiating portions of the antenna assembly are separated by a junction member. A reinforcing member is disposed within the junction member to increase structural rigidity.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: August 8, 2023
    Assignee: Covidien LP
    Inventors: Roman Turovskiy, Ted Su, Mani Prakash, Steven Kim
  • Patent number: 11587597
    Abstract: A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: February 21, 2023
    Assignee: Intel Corporation
    Inventors: Xiang Li, Phil Geng, George Vergis, Mani Prakash
  • Publication number: 20220100464
    Abstract: Methods and systems for energy efficient execution of voice commands are disclosed. On receiving a command, based on an action specified by, and the intent of, the command, IoT devices, in the IoT environment, capable of executing the command are determined. Various embodiments determine natural alternative(s) and combinations of natural alternative(s) and IoT devices for executing the command. Individual ranks are assigned to each of the IoT devices, the natural alternative(s), and combinations of natural alternative(s) and IoT devices, based on power consumption of the IoT devices and at least one ecological factor affecting the user experience when the IoT devices and/or the natural alternative(s) may be used in executing the command. An IoT device, a natural alternative, or a combination of an IoT device and a natural alternative may be selected to execute the command, based on the selected IoT device and/or the natural alternative having the highest rank.
    Type: Application
    Filed: June 2, 2021
    Publication date: March 31, 2022
    Inventors: Mani Prakash, Shiva Murthy Busetty, Srinivasa Rao Payyavula, Satyam Bharadwaj, Manoj Devender Goud Nanumasa, Ramaswamy Srinivasa Ramanujam
  • Patent number: 11045253
    Abstract: An electrosurgical energy channel splitter apparatus includes a channel input a plurality of channel outputs, and a controller. The channel input is configured to receive electrosurgical energy from an electrosurgical energy source. Each channel output is configured to couple to a respective electrosurgical device. The controller is coupled to the channel input and the plurality of channel outputs. The controller is configured to selectively direct the electrosurgical energy from the channel input to one of the plurality of channel outputs.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: June 29, 2021
    Assignee: COVIDIEN LP
    Inventors: Mani Prakash, Francesca Rossetto, Steven Kim, Brian Shiu, Thomas J. Fogarty, Sascha Zarins
  • Publication number: 20210191490
    Abstract: Methods and apparatus for balancing power between discrete components, such as processing units (e.g., CPUs) and accelerators in a compute node or platform. Power consumption of the compute platform is monitored to detect for conditions under which a threshold (e.g., power supply capacity threshold) is exceeded. In response, the operating frequencies of a processing unit and/or other platform components such as accelerators, are adjusted to reduce the power consumption of the platform to return below the threshold. Power limit biasing hints (scaling weights) are provided to platform components, along with a power violation index, which are used to adjust the operating frequencies of the platform components. Optionally, a processing unit can calculate the power violation index and the scaling weights and directly control the frequencies of itself and platform components. Embodiments of multi-socket platforms are also provided.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 24, 2021
    Inventors: Phani Kumar KANDULA, Eric J. DEHAEMER, Dorit SHAPIRA, Ramkumar NAGAPPAN, Vivek GARG, Fuat KECELI, Mani PRAKASH, David C. HOLCOMB, Horthense D. TAMDEM, Olivier FRANZA, Vjekoslav SVILAN
  • Patent number: 10950958
    Abstract: A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: March 16, 2021
    Assignee: Intel Corporation
    Inventors: Phil Geng, Xiang Li, Mani Prakash, George Vergis
  • Publication number: 20200388962
    Abstract: An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Applicant: Intel Corporation
    Inventors: Phil Geng, Xiang Li, George Vergis, Mani Prakash
  • Publication number: 20200327912
    Abstract: A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.
    Type: Application
    Filed: June 24, 2020
    Publication date: October 15, 2020
    Inventors: Xiang LI, Phil GENG, George VERGIS, Mani PRAKASH
  • Patent number: 10790603
    Abstract: An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: September 29, 2020
    Assignee: Intel Corporation
    Inventors: Phil Geng, Xiang Li, George Vergis, Mani Prakash
  • Publication number: 20200113629
    Abstract: A microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. Proximal and distal radiating portions of the antenna assembly are separated by a junction member. A reinforcing member is disposed within the junction member to increase structural rigidity.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Inventors: Roman Turovskiy, Ted Su, Mani Prakash, Steven Kim
  • Patent number: 10537386
    Abstract: A microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. Proximal and distal radiating portions of the antenna assembly are separated by a junction member. A reinforcing member is disposed within the junction member to increase structural rigidity.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 21, 2020
    Assignee: COVIDIEN LP
    Inventors: Roman Turovskiy, Ted Su, Mani Prakash, Steven Kim
  • Patent number: 10363097
    Abstract: A microwave antenna having a curved configuration is described herein. The antenna portion is formed into various shapes whereby the antenna substantially encloses, by a partial or complete loop or enclosure, at least a majority of the tissue to be irradiated. When microwave energy is delivered through the antenna, the curved configuration forms an ablation field or region defined by the curved antenna and any tissue enclosed within the ablation region becomes irradiated by the microwave energy. The microwave antenna is deployed through one of several methods, and multiple curved antennas can be used in conjunction with one another. Moreover, RF energy can also be used at the distal tip of the antenna to provide a cutting tip for the antenna during deployment in tissue.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: July 30, 2019
    Assignee: COVIDEN LP
    Inventors: Mani Prakash, Francesca Rossetto
  • Publication number: 20190165503
    Abstract: An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: February 1, 2019
    Publication date: May 30, 2019
    Inventors: Phil Geng, Xiang Li, George Vergis, Mani Prakash
  • Publication number: 20190141845
    Abstract: A configurable processor module includes a central processing unit (CPU) package mounted to a CPU substrate, which may be mounted to a circuit board substrate. The CPU substrate may include physical resources usable by the CPU package, which may not be included or duplicated on the circuit board substrate. As such, features of the CPU package that are unavailable on the circuit board substrate may be available on the CPU substrate. Additionally, the CPU substrate and physical resources may be selected and designed so as to provide varying levels of functionality across different compute devices that use the same type of CPU package.
    Type: Application
    Filed: December 14, 2018
    Publication date: May 9, 2019
    Inventors: Mani Prakash, Thomas T. Holden, Aaron Gorius, Michael T. Crocker, Matthew J. Adiletta, Russell Aoki
  • Publication number: 20190067158
    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
    Type: Application
    Filed: October 30, 2018
    Publication date: February 28, 2019
    Inventors: Jeffory L. SMALLEY, Susan F. SMITH, Mani PRAKASH, Tao LIU, Henry C. BOSAK, Harvey R. KOFSTAD, Almanzo T. ORTIZ
  • Publication number: 20190044262
    Abstract: A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.
    Type: Application
    Filed: June 28, 2018
    Publication date: February 7, 2019
    Inventors: Phil Geng, Xiang Li, Mani Prakash, George Vergis
  • Patent number: 10163508
    Abstract: Methods and apparatus related to supporting both DDR (Double Data Rate) and NVM (Non-Volatile Memory) DIMM (Dual Inline Memory Module) on the same memory slot are described. In one embodiment, a DIMM comprises volatile memory and non-volatile memory, and data is communicated with the volatile memory and the non-volatile memory via a single memory slot. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: December 25, 2018
    Assignee: Intel Corporation
    Inventors: Woojong Han, Mohamed Arafa, Brian S. Morris, Mani Prakash, James K. Pickett, John K. Grooms, Bruce Querbach, Edward L Payton, Dong Wang
  • Publication number: 20180360539
    Abstract: An electrosurgical energy channel splitter apparatus includes a channel input a plurality of channel outputs, and a controller. The channel input is configured to receive electrosurgical energy from an electrosurgical energy source. Each channel output is configured to couple to a respective electrosurgical device. The controller is coupled to the channel input and the plurality of channel outputs. The controller is configured to selectively direct the electrosurgical energy from the channel input to one of the plurality of channel outputs.
    Type: Application
    Filed: August 6, 2018
    Publication date: December 20, 2018
    Inventors: MANI PRAKASH, FRANCESCA ROSSETTO, STEVEN KIM, BRIAN SHIU, THOMAS J. FOGARTY, SASCHA ZARINS
  • Patent number: 10141241
    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: November 27, 2018
    Assignee: Intel Corporation
    Inventors: Jeffory L. Smalley, Susan F. Smith, Mani Prakash, Tao Liu, Henry C. Bosak, Harvey R. Kofstad, Almanzo T. Ortiz
  • Patent number: 10039602
    Abstract: An electrosurgical energy channel splitter apparatus includes a channel input a plurality of channel outputs, and a controller. The channel input is configured to receive electrosurgical energy from an electrosurgical energy source. Each channel output is configured to couple to a respective electrosurgical device. The controller is coupled to the channel input and the plurality of channel outputs. The controller is configured to selectively direct the electrosurgical energy from the channel input to one of the plurality of channel outputs.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: August 7, 2018
    Assignee: Covidien LP
    Inventors: Mani Prakash, Francesca Rossetto, Steven Kim, Brian Shiu, Thomas J. Fogarty, Sascha Zarins