Abstract: An electrosurgical energy channel splitter apparatus includes a channel input a plurality of channel outputs, and a controller. The channel input is configured to receive electrosurgical energy from an electrosurgical energy source. Each channel output is configured to couple to a respective electrosurgical device. The controller is coupled to the channel input and the plurality of channel outputs. The controller is configured to selectively direct the electrosurgical energy from the channel input to one of the plurality of channel outputs.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Abstract: Methods and apparatus related to supporting both DDR (Double Data Rate) and NVM (Non-Volatile Memory) DIMM (Dual Inline Memory Module) on the same memory slot are described. In one embodiment, a DIMM comprises volatile memory and non-volatile memory, and data is communicated with the volatile memory and the non-volatile memory via a single memory slot. Other embodiments are also disclosed and claimed.

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Abstract: A microwave antenna having a curved configuration is described herein. The antenna portion is formed into various shapes whereby the antenna substantially encloses, by a partial or complete loop or enclosure, at least a majority of the tissue to be irradiated. When microwave energy is delivered through the antenna, the curved configuration forms an ablation field or region defined by the curved antenna and any tissue enclosed within the ablation region becomes irradiated by the microwave energy. The microwave antenna is deployed through one of several methods, and multiple curved antennas can be used in conjunction with one another. Moreover, RF energy can also be used at the distal tip of the antenna to provide a cutting tip for the antenna during deployment in tissue.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Abstract: Some examples relate to an electronic system that includes a substrate and a non-volatile memory (NVM) mounted on the substrate. The electronic system further includes a Peltier device mounted to a portion of the NVM to provide on demand short term cooling to the NVM during operation of the NVM. Other examples relate to a method that includes operating a plurality non-volatile memories (NVMs) that is part of an electronic system, and using a plurality of Peltier devices to provide on demand short term cooling to a portion of each NVM.

Abstract: Memory modules, controllers, and electronic devices comprising memory modules are described. In one embodiment, a memory module comprises a nonvolatile memory and an interface to a volatile memory bus, at least one input power rail to receive power from a host platform, and a controller comprising logic, at least partially including hardware logic, to convert the power from the input power rail from an input voltage to at least one output voltage, different from the input voltage. Other embodiments are also disclosed and claimed.

Abstract: A microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. Proximal and distal radiating portions of the antenna assembly are separated by a junction member. A reinforcing member is disposed within the junction member to increase structural rigidity.

Abstract: High-strength microwave antenna assemblies and methods of use are described herein. The microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. Proximal and distal radiating portions of the antenna assembly are separated by a junction member. A reinforcing member is disposed within the junction member to increase structural rigidity.

Abstract: An electrosurgical energy channel splitter apparatus includes a channel input a plurality of channel outputs, and a controller. The channel input is configured to receive electrosurgical energy from an electrosurgical energy source. Each channel output is configured to couple to a respective electrosurgical device. The controller is coupled to the channel input and the plurality of channel outputs. The controller is configured to selectively direct the electrosurgical energy from the channel input to one of the plurality of channel outputs.

Abstract: High-strength microwave antenna assemblies and methods of use are described herein. The microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. Proximal and distal radiating portions of the antenna assembly are separated by a junction member. A reinforcing member is disposed within the junction member to increase structural rigidity.