Patents by Inventor Mao-Hsiu Hsu

Mao-Hsiu Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Patent number: 10896314
    Abstract: A fingerprint identification module includes a contact layer, at least one light source, at least one image sensor and a lens. The at least one light source emits at least one light beam. The contact layer is exposed outside the fingerprint identification module to be contacted with a user's finger. The at least one image sensor is located under the contact area. After the at least light beam is received by the at least one image sensor, a corresponding fingerprint image is generated. The lens is arranged between the contact layer and the at least one image sensor, and includes plural openings. The lens includes plural openings. After the at least one light beam is reflected by the finger, the at least one light beam is transmitted through the plural openings and projected to the at least one image sensor.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: January 19, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventor: Mao-Hsiu Hsu
  • Publication number: 20200334444
    Abstract: A fingerprint identification module includes a contact layer, at least one light source, at least one image sensor and a lens. The at least one light source emits at least one light beam. The contact layer is exposed outside the fingerprint identification module to be contacted with a user's finger. The at least one image sensor is located under the contact area. After the at least light beam is received by the at least one image sensor, a corresponding fingerprint image is generated. The lens is arranged between the contact layer and the at least one image sensor, and includes plural openings. The lens includes plural openings. After the at least one light beam is reflected by the finger, the at least one light beam is transmitted through the plural openings and projected to the at least one image sensor.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 22, 2020
    Inventor: MAO-HSIU HSU
  • Patent number: 10528787
    Abstract: The present invention relates to a fingerprint identifying module, including a circuit board, a fingerprint sensing component, a cover plate, and a waterproof sleeve. The fingerprint sensing component is disposed on the circuit board, and the cover plate covers the fingerprint sensing component. The waterproof sleeve partially covers the cover plate and the circuit board, so as to prevent a foreign liquid from entering a space between the fingerprint sensing component and the circuit board. The cover plate includes a cover plate body and an extending portion. The cover plate body covers the fingerprint sensing component. The extending portion surrounds the cover plate body, is located between the waterproof sleeve and the fingerprint sensing component, and may block the foreign liquid from passing.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: January 7, 2020
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Patent number: 10373414
    Abstract: The present invention provides a scooter handle having a fingerprint identification module. The scooter handle having a fingerprint identification module includes: an inner tube, an outer tube, and a fingerprint identification module. After collecting and determining a fingerprint of a user, the fingerprint identification module drives an electromagnetic module in the inner tube to engage the inner tube with the outer tube, so that the outer tube and the inner tube are interlocked.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: August 6, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Patent number: 10354112
    Abstract: A fingerprint identification module is provided for identifying a fingerprint of a finger. The fingerprint identification module includes a sensing chip and a thermally deformable layer. The thermally deformable layer is disposed over the sensing chip and includes a sensing region. When the finger is placed on the sensing region, the fingerprint of the finger is sensed by the sensing chip. If the fingerprint identification result of the fingerprint identification module fails, the thermally deformable layer is firstly changed to a molten state and then returned to a solidified state within a predetermined time period. Consequently, the finger is fixed by the thermally deformable layer.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: July 16, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Patent number: 10275637
    Abstract: A fingerprint identification module is installed in an accommodation space of an electronic device. The fingerprint identification module includes a circuit board, a fingerprint sensor and a resilient fixing plate. The fingerprint sensor is disposed on the circuit board, and detects a fingerprint image of a finger. The resilient fixing plate is located under the circuit board, connected with the circuit board, and contacted with a bottom side of the accommodation space. The resilient fixing plate is subjected to deformation and descended according to the accommodation space. Consequently, the fingerprint identification module installed in the accommodation space.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: April 30, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Patent number: 10275636
    Abstract: A fingerprint identifying module includes a sensing assembly, a cover and a metal ring. The cover has a protruding portion and the metal ring has an accommodation groove. The protruding portion of the cover is engaged with the accommodation groove of the metal ring so that the metal ring is bonded to the cover. Since no liquid glue is required for bonding the metal ring to the module, the step of baking and solidifying the liquid glue is saved and the manufacturing efficiency of the fingerprint identifying module is improved.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 30, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Patent number: 10235549
    Abstract: A jig for a fingerprint identification module includes a base, a top cover and a rotating shaft. The rotating shaft is connected with the base or the top cover. The base includes plural accommodation spaces. A circuit board and a fingerprint sensor fixed on the circuit board are accommodated within the corresponding accommodation space. The top cover is fixed on the base in response to a magnetic attraction force. The top cover includes plural perforations corresponding to the plural accommodation spaces. When an output element is penetrated through a specified perforation, an isolation material is outputted from the output element and placed on a periphery of a junction between the circuit board and the fingerprint sensor.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: March 19, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Patent number: 10176356
    Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: January 8, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Li-Pin Wang, Hong-Kai Huang, Chih-Hao Hsu
  • Patent number: 10146982
    Abstract: A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: December 4, 2018
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Hsin-Tso Chen, Ying-Chieh Chuang
  • Patent number: 10108842
    Abstract: A method for assembling a fingerprint identification module is provided. During the process of cutting a sensing strip, the junction parts between adjacent fingerprint sensors are retained. Consequently, the cut sensing strip is still a one-piece structure. Then, a paint-spraying process is performed to spray paint on the one-piece structure of the sensing strip. After the junction parts are removed, plural individual fingerprint sensors are produced. In comparison with the conventional technology of spraying paint on the individual fingerprint sensors, the assembling time of the method of the present invention is largely reduced. Consequently, the production efficiency of the present invention is enhanced.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: October 23, 2018
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Chih-Hao Hsu, Ying-Chieh Chuang
  • Patent number: 10089517
    Abstract: The present invention relates to a fingerprint identifying module, including a fingerprint identifying and sensing element, a support board, and a metal ring. The support board may bear the fingerprint identifying and sensing element thereon, and includes an accommodation groove. The metal ring is sleeved on the fingerprint identifying and sensing element and the support board. Moreover, the metal ring includes a fixing column which is formed by extending a lower surface of the metal ring, so as to extend into the accommodation groove to fix the metal ring on the support board. The fingerprint identifying module of the present invention strengthens bonding between the metal ring and the support board by bonding the fixing column and the accommodation groove.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: October 2, 2018
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Kuan-Pao Ting
  • Publication number: 20180253584
    Abstract: A jig for a fingerprint identification module includes a base, a top cover and a rotating shaft. The rotating shaft is connected with the base or the top cover. The base includes plural accommodation spaces. A circuit board and a fingerprint sensor fixed on the circuit board are accommodated within the corresponding accommodation space. The top cover is fixed on the base in response to a magnetic attraction force. The top cover includes plural perforations corresponding to the plural accommodation spaces. When an output element is penetrated through a specified perforation, an isolation material is outputted from the output element and placed on a periphery of a junction between the circuit board and the fingerprint sensor.
    Type: Application
    Filed: July 17, 2017
    Publication date: September 6, 2018
    Inventors: MAO-HSIU HSU, KUAN-PAO TING
  • Publication number: 20180247103
    Abstract: The present invention provides a mechanical parking garage control system, configured to control storage and retrieval of a vehicle, and including: an identification apparatus, having a first camera module and a first fingerprint recognition module, where the first camera module is configured to capture a vehicle license plate image, and the first fingerprint recognition module is configured to capture fingerprint information; and a control apparatus, having a control module and a memory unit, wherein the control module identifies the vehicle license plate image to generate a vehicle license number and allocates a storage space to the vehicle according to the vehicle license number and the fingerprint information, and the memory unit is configured to store the vehicle license plate image, the vehicle license number, and the fingerprint information.
    Type: Application
    Filed: June 19, 2017
    Publication date: August 30, 2018
    Inventors: MAO-HSIU HSU, KUAN-PAO TING
  • Patent number: 10061968
    Abstract: A method for assembling a fingerprint identification module is provided. During the process of cutting the sensing strip, the thin junction slices between the fingerprint sensors are retained. Consequently, the size of the top surface of the fingerprint sensor is close to a predetermined size. After the thin junction slices are cut, the concave structures are formed on the bottom surfaces of the fingerprint sensors. Consequently, the size of the bottom surface of the fingerprint sensor is smaller than the size of the top surface of the fingerprint sensor. Even if the cutting skew is generated during the cutting process, the fingerprint sensor can pass the size test. Consequently, the production efficiency is enhanced.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: August 28, 2018
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Hsin-Tso Chen, Ying-Chieh Chuang
  • Publication number: 20180239945
    Abstract: A fingerprint identification module includes a substrate, a fingerprint sensor and a covering plate. The fingerprint sensor is disposed on the substrate and electrically connected with the substrate. The fingerprint sensor detects a fingerprint image. The covering plate is located over the fingerprint sensor and combined with the fingerprint sensor through an adhesive layer. The adhesive layer is arranged between the covering plate and the fingerprint sensor, and includes a solid adhesive part and a liquid adhesive part. The liquid adhesive part is arranged around the solid adhesive part.
    Type: Application
    Filed: June 19, 2017
    Publication date: August 23, 2018
    Inventors: MAO-HSIU HSU, KUAN-PAO TING
  • Publication number: 20180232982
    Abstract: The present invention provides a scooter handle having a fingerprint identification module. The scooter handle having a fingerprint identification module includes: an inner tube, an outer tube, and a fingerprint identification module. After collecting and determining a fingerprint of a user, the fingerprint identification module drives an electromagnetic module in the inner tube to engage the inner tube with the outer tube, so that the outer tube and the inner tube are interlocked.
    Type: Application
    Filed: June 19, 2017
    Publication date: August 16, 2018
    Inventors: MAO-HSIU HSU, KUAN-PAO TING
  • Publication number: 20180211091
    Abstract: The present invention relates to a fingerprint identifying module, including a circuit board, a fingerprint sensing component, a cover plate, and a waterproof sleeve. The fingerprint sensing component is disposed on the circuit board, and the cover plate covers the fingerprint sensing component. The waterproof sleeve partially covers the cover plate and the circuit board, so as to prevent a foreign liquid from entering a space between the fingerprint sensing component and the circuit board. The cover plate includes a cover plate body and an extending portion. The cover plate body covers the fingerprint sensing component. The extending portion surrounds the cover plate body, is located between the waterproof sleeve and the fingerprint sensing component, and may block the foreign liquid from passing.
    Type: Application
    Filed: June 21, 2017
    Publication date: July 26, 2018
    Inventors: MAO-HSIU HSU, KUAN-PAO TING
  • Publication number: 20180196986
    Abstract: A fingerprint identification module is installed in an accommodation space of an electronic device. The fingerprint identification module includes a circuit board, a fingerprint sensor and a resilient fixing plate. The fingerprint sensor is disposed on the circuit board, and detects a fingerprint image of a finger. The resilient fixing plate is located under the circuit board, connected with the circuit board, and contacted with a bottom side of the accommodation space. The resilient fixing plate is subjected to deformation and descended according to the accommodation space. Consequently, the fingerprint identification module installed in the accommodation space.
    Type: Application
    Filed: May 3, 2017
    Publication date: July 12, 2018
    Inventors: MAO-HSIU HSU, KUAN-PAO TING