Abstract: An optical fingerprint identification module includes a casing, an image pickup assembly, a light-guiding diffusion layer, a light-collecting reflective layer, a press plate, a light source and an optical tunnel structure. The optical tunnel structure is located under the press plate and located over the image pickup assembly. The optical tunnel structure is penetrated through the light-collecting reflective layer and a part of the light-guiding diffusion layer. After a light beam emitted by the light source is introduced into the light-guiding diffusion layer, the light beam is guided and diffused by the light-guiding diffusion layer and collected and reflected by the light-collecting reflective layer. Consequently, the light beam is transferred between the light-guiding diffusion layer and the light-collecting reflective layer. After the light beam is irradiated on the press plate through the optical tunnel structure, the light beam is reflected to the image pickup assembly.

Abstract: The present invention relates to a fingerprint identifying module, including a fingerprint identifying and sensing element, a support board, and a metal ring. The support board may bear the fingerprint identifying and sensing element thereon, and includes an accommodation groove. The metal ring is sleeved on the fingerprint identifying and sensing element and the support board. Moreover, the metal ring includes a fixing column which is formed by extending a lower surface of the metal ring, so as to extend into the accommodation groove to fix the metal ring on the support board. The fingerprint identifying module of the present invention strengthens bonding between the metal ring and the support board by bonding the fixing column and the accommodation groove.

Abstract: The present invention relates to a fingerprint identifying module, including a sensing assembly, a cover, and a metal ring. The cover is provided on the sensing assembly, and includes a protruding portion. The metal ring is sleeved on the cover and the sensing assembly, and includes an accommodation groove and a guide slope. The accommodation groove is provided on an inner side wall of the metal ring, and is configured to accommodate the protruding portion therein, so as to fix the cover on the metal ring. The guide slope is provided on the inner side wall of the metal ring, closes to the accommodation groove, and is configured to contact the protruding portion, so as to assist the protruding portion to move along the guide slope, thereby enabling the protruding portion to enter the accommodation groove.

Abstract: A fingerprint identification module is provided for identifying a fingerprint of a finger. The fingerprint identification module includes a sensing chip and a thermally deformable layer. The thermally deformable layer is disposed over the sensing chip and includes a sensing region. When the finger is placed on the sensing region, the fingerprint of the finger is sensed by the sensing chip. If the fingerprint identification result of the fingerprint identification module fails, the thermally deformable layer is firstly changed to a molten state and then returned to a solidified state within a predetermined time period. Consequently, the finger is fixed by the thermally deformable layer.

Abstract: A fingerprint identification module is provided for identifying a fingerprint of a finger. The fingerprint identification module includes a circuit board, a sensing chip, a microprocessor and a piezoelectric element. The piezoelectric has a fingerprint sensing region to be pressed by the finger. When the fingerprint sensing region is pressed by the finger, the piezoelectric element generates a driving voltage. The electric power corresponding to the driving voltage is provided to the sensing chip and the microprocessor. Consequently, a fingerprint identification process is performed.

Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.

Abstract: A fingerprint identification module includes a fingerprint sensor, a coating structure and a circuit board. The fingerprint sensor is disposed on the circuit board. The coating structure is disposed on the fingerprint sensor. An insulation layer of the coating structure is disposed on the top surface of the fingerprint sensor to isolate electrostatic charges from entering the fingerprint sensor. The coating structure of the fingerprint identification module of the present invention is used for isolating electrostatic charges in replace of the metallic ring of the conventional technology. Consequently, the material cost of the metallic ring is reduced, and the thickness of the fingerprint identification module is reduced.

Abstract: A method for assembling a fingerprint identification module is provided. During the process of cutting a sensing strip, the junction parts between adjacent fingerprint sensors are retained. Consequently, the cut sensing strip is still a one-piece structure. Then, a paint-spraying process is performed to spray paint on the one-piece structure of the sensing strip. After the junction parts are removed, plural individual fingerprint sensors are produced. In comparison with the conventional technology of spraying paint on the individual fingerprint sensors, the assembling time of the method of the present invention is largely reduced. Consequently, the production efficiency of the present invention is enhanced.

Abstract: A method for assembling a fingerprint identification module is provided. During the process of cutting the sensing strip, the thin junction slices between the fingerprint sensors are retained. Consequently, the size of the top surface of the fingerprint sensor is close to a predetermined size. After the thin junction slices are cut, the concave structures are formed on the bottom surfaces of the fingerprint sensors. Consequently, the size of the bottom surface of the fingerprint sensor is smaller than the size of the top surface of the fingerprint sensor. Even if the cutting skew is generated during the cutting process, the fingerprint sensor can pass the size test. Consequently, the production efficiency is enhanced.

Abstract: A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.

Abstract: A solid antenna positioned on a substrate, includes a feeding portion for feeding electromagnetic signals and a radiating portion for transceiving the electromagnetic signals. The radiating portion includes a first radiator, a second radiator, a third radiator, a fourth radiator, a first connecting section, and a second connecting section. The first radiator and the second radiator are positioned on a first plane, and respectively comprise a first inverted-U-shaped radiating section and a second inverted-U-shaped radiating section. The third U-shaped radiator is positioned on a second plane perpendicular to the first plane. The first connecting section connects the first radiator to the third radiator. The second connecting section connects the second radiator to the third radiator. The fourth radiator is connected to the second radiator. The first connecting section, the second connecting section, and the fourth radiator comprise one radiating section positioned on a third plane.

Abstract: A multi-path simulation system (100) includes a signal generator (10) generating a signal, a power divider (24) connected to the signal generator for dividing the signal into N attenuated sub-signals, N delay lines (26) connected to the power divider delaying the N attenuated sub-signals to simulate the delays resulting from the transmission of the signal in the N paths, P switches (28) connected to the delay lines selecting the attenuated sub-signals delayed by the delay lines, thereby generating selected signals, and a signal combiner (29) connected to the switches combining the selected signals into a single signal. The delay lines are respectively represented by transmission lines disposed on a printed circuit board. A length of the transmission line controls a distance of transmission of the signal. Wherein N is an integer greater than one, and P is an integer equal to or greater than one.

Abstract: A multiband antenna includes a feed portion, a radiating portion and a matching portion. The radiating portion is operable to transceive electromagnetic signals, and includes a first radiator, a second radiator and a third radiator. The first radiator is connected to the feed portion, and includes a first free end and a second free end. The second radiator is bent, and includes a first feed end and a third free end, wherein the first feed end is connected to the feed portion. The third radiator is substantially L shaped, and includes a second feed end and a fourth free end, wherein the second feed end is electrically connected to the feed portion. The matching portion is rectangularly shaped, and electrically connected to the first radiator, for impedance matching.

Abstract: A multiband antenna located on a substrate includes a feed portion, a grounded portion, and an antenna body. The feed portion is connected to the substrate, delivering electromagnetic signals. The grounded portion is connected to the substrate. The antenna body is electrically connected to the feed portion and the grounded portion, transceiving electromagnetic signals. The antenna body includes a first radiator, a second radiator, a first resonator, and a second resonator. The first radiator is connected to the first radiator and the grounded portion. The second radiator is connected to the first radiator and the grounded portion. The first resonator is connected to the second radiator. The second resonator is connected to the second radiator. The second resonator and the first radiator are parallel and of different lengths.

Abstract: A solid antenna positioned on a substrate, includes a feeding portion for feeding electromagnetic signals and a radiating portion for transceiving the electromagnetic signals. The radiating portion includes a first radiator, a second radiator, a third radiator, a fourth radiator, a first connecting section, and a second connecting section. The first radiator and the second radiator are positioned on a first plane, and respectively comprise a first inverted-U-shaped radiating section and a second inverted-U-shaped radiating section. The third U-shaped radiator is positioned on a second plane perpendicular to the first plane. The first connecting section connects the first radiator to the third radiator. The second connecting section connects the second radiator to the third radiator. The fourth radiator is connected to the second radiator. The first connecting section, the second connecting section, and the fourth radiator comprise one radiating section positioned on a third plane.

Abstract: A multi-path simulation system (100) includes a signal generator (10) generating a signal, a power divider (24) connected to the signal generator for dividing the signal into N attenuated sub-signals, N delay lines (26) connected to the power divider delaying the N attenuated sub-signals to simulate the delays resulting from the transmission of the signal in the N paths, P switches (28) connected to the delay lines selecting the attenuated sub-signals delayed by the delay lines, thereby generating selected signals, and a signal combiner (29) connected to the switches combining the selected signals into a single signal. The delay lines are respectively represented by transmission lines disposed on a printed circuit board. A length of the transmission line controls a distance of transmission of the signal. Wherein N is an integer greater than one, and P is an integer equal to or greater than one.