Patents by Inventor Marc B. Cartier
Marc B. Cartier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180324941Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: ApplicationFiled: July 11, 2018Publication date: November 8, 2018Applicant: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
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Patent number: 10096945Abstract: An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may be addressed by the features. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are not fully removed. Alternatively or additionally, a housing may include openings around tie bar locations such that a punch may be used to sever the tie bars. These openings may be filled to avoid performance-affecting artifacts.Type: GrantFiled: December 12, 2016Date of Patent: October 9, 2018Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., Mark W. Gailus, Thomas S. Cohen, John Robert Dunham, Vysakh Sivarajan
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Publication number: 20180269612Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: ApplicationFiled: May 21, 2018Publication date: September 20, 2018Applicant: Amphenol CorporationInventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine, Donald A. Girard, JR.
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Publication number: 20180248289Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.Type: ApplicationFiled: November 17, 2017Publication date: August 30, 2018Inventors: Thomas S. Cohen, Huilin Ren, Marc B. Cartier, JR., Trent K. Do, Mark W. Gailus
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Patent number: 10063013Abstract: An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may degrade electrical performance. However, that degradation may be avoided by features that compensate for the artifacts. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are not fully removed.Type: GrantFiled: September 26, 2016Date of Patent: August 28, 2018Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., Mark W. Gailus, Thomas S. Cohen, John Robert Dunham, Vysakh Sivarajan
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Publication number: 20180233858Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: ApplicationFiled: January 29, 2018Publication date: August 16, 2018Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., Brian Kirk, David Levine, Vysakh Sivarajan
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Publication number: 20180219331Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.Type: ApplicationFiled: September 25, 2017Publication date: August 2, 2018Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
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Patent number: 10034366Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: GrantFiled: October 25, 2017Date of Patent: July 24, 2018Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Patent number: 9991617Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: GrantFiled: April 14, 2016Date of Patent: June 5, 2018Assignee: Amphenol CorporationInventors: Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine, Donald A. Girard, Jr.
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Patent number: 9905975Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: GrantFiled: January 22, 2015Date of Patent: February 27, 2018Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., Brian Kirk, David Levine, Vysakh Sivarajan
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Publication number: 20180049312Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: ApplicationFiled: October 25, 2017Publication date: February 15, 2018Applicant: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
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Patent number: 9825391Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.Type: GrantFiled: July 29, 2014Date of Patent: November 21, 2017Assignee: Amphenol CorporationInventors: Thomas S. Cohen, Huilin Ren, Marc B. Cartier, Jr., Trent K. Do, Mark W. Gailus
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Patent number: 9807869Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: GrantFiled: November 20, 2015Date of Patent: October 31, 2017Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Publication number: 20170294743Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material.Type: ApplicationFiled: June 19, 2017Publication date: October 12, 2017Applicant: Amphenol CorporationInventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, JR., Donald A. Girard, JR.
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Patent number: 9774144Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.Type: GrantFiled: October 27, 2016Date of Patent: September 26, 2017Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
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Patent number: 9775231Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.Type: GrantFiled: November 20, 2015Date of Patent: September 26, 2017Assignee: Amphenol CorporationInventor: Marc B. Cartier, Jr.
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Patent number: 9730313Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.Type: GrantFiled: November 20, 2015Date of Patent: August 8, 2017Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Patent number: 9685736Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.Type: GrantFiled: November 12, 2015Date of Patent: June 20, 2017Assignee: Amphenol CorporationInventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, Jr., Donald A. Girard, Jr.
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Publication number: 20170141517Abstract: An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may degrade electrical performance. However, that degradation may be avoided by features that compensate for the artifacts. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are not fully removed.Type: ApplicationFiled: September 26, 2016Publication date: May 18, 2017Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., Mark W. Gailus, Thomas S. Cohen, John Robert Dunham, Vysakh Sivarajan
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Publication number: 20170093093Abstract: An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may be addressed by the features. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are riot fully removed. Alternatively or additionally, a housing may include openings around tie bar locations such that a punch may be used to sever the tie bars. These openings may be filled to avoid performance-affecting artifacts.Type: ApplicationFiled: December 12, 2016Publication date: March 30, 2017Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., Mark W. Gailus, Thomas S. Cohen, John Robert Dunham, Vysakh Sivarajan