Patents by Inventor Marc C. Jin
Marc C. Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9796063Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: June 30, 2014Date of Patent: October 24, 2017Assignee: FNS TECH CO., LTD.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
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Patent number: 9375822Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.Type: GrantFiled: November 4, 2014Date of Patent: June 28, 2016Assignee: FNS TECH CO., LTD.Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
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Publication number: 20150056894Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.Type: ApplicationFiled: November 4, 2014Publication date: February 26, 2015Inventors: Oscar K. HSU, Marc C. JIN, David Adam WELLS, John Erik ALDEBORGH
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Patent number: 8900036Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.Type: GrantFiled: March 16, 2012Date of Patent: December 2, 2014Assignee: FNS Tech No., Ltd.Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
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Publication number: 20140311043Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN
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Patent number: 8790165Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: January 5, 2010Date of Patent: July 29, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
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Patent number: 8758659Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: GrantFiled: September 29, 2010Date of Patent: June 24, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Guangwei Wu, Anoop Mathew
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Patent number: 8491360Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.Type: GrantFiled: October 23, 2008Date of Patent: July 23, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Marc C. Jin, John Erik Aldeborgh
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Patent number: 8430721Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.Type: GrantFiled: December 31, 2008Date of Patent: April 30, 2013Assignee: Innopad, Inc.Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
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Patent number: 8377351Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: GrantFiled: October 2, 2008Date of Patent: February 19, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, David Adam Wells, Marc C. Jin, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20120178348Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.Type: ApplicationFiled: March 16, 2012Publication date: July 12, 2012Applicant: INNOPAD, INC.Inventors: Oscar K. HSU, Marc C. JIN, David Adam WELLS, John Erik ALDEBORGH
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Patent number: 8172648Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.Type: GrantFiled: December 31, 2008Date of Patent: May 8, 2012Assignee: Innopad, Inc.Inventors: Paul Lefevre, Oscar K. Hsu, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
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Publication number: 20120073210Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Guangwei WU, Anoop MATHEW
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Patent number: 8137166Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.Type: GrantFiled: July 19, 2007Date of Patent: March 20, 2012Assignee: Innopad, Inc.Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
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Patent number: 7985121Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.Type: GrantFiled: July 24, 2008Date of Patent: July 26, 2011Assignee: Innopad, Inc.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
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Publication number: 20100221983Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: January 5, 2010Publication date: September 2, 2010Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Xuechan Zhao
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Publication number: 20090246504Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: ApplicationFiled: October 2, 2008Publication date: October 1, 2009Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, David Adam WELLS, Marc C. JIN, Oscar K. HSU, John Erik ALDEBORGH, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20090170413Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.Type: ApplicationFiled: December 31, 2008Publication date: July 2, 2009Applicant: innoPad, Inc.Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
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Publication number: 20090170410Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.Type: ApplicationFiled: December 31, 2008Publication date: July 2, 2009Applicant: INNOPAD, INC.Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
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Publication number: 20090142989Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.Type: ApplicationFiled: July 24, 2008Publication date: June 4, 2009Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN