Patents by Inventor Marc C. Jin

Marc C. Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-Dimensional Network in CMP Pad
    Publication number: 20090137121
    Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
    Type: Application
    Filed: October 23, 2008
    Publication date: May 28, 2009
    Applicant: innoPad, Inc.
    Inventors: Oscar K. HSU, Paul Lefevre, David Adam Wells, Marc C. Jin, John Erik Aldeborgh