Patents by Inventor Marc E. Robinson
Marc E. Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9824999Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: GrantFiled: December 15, 2015Date of Patent: November 21, 2017Assignee: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Publication number: 20160218088Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: ApplicationFiled: March 31, 2016Publication date: July 28, 2016Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, JR.
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Publication number: 20160104689Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: ApplicationFiled: December 15, 2015Publication date: April 14, 2016Inventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Patent number: 9305862Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: GrantFiled: April 25, 2012Date of Patent: April 5, 2016Assignee: Invensas CorporationInventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, Jr.
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Patent number: 9252116Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: GrantFiled: April 1, 2014Date of Patent: February 2, 2016Assignee: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Publication number: 20140213020Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: ApplicationFiled: April 1, 2014Publication date: July 31, 2014Applicant: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson
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Patent number: 8729690Abstract: Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to the electrical connection pads. After being placed atop one another in a stack, vertically adjacent die or die segments can be electrically interconnected using a flexible bond wire or bond ribbon attached to an electrical connection pad exposed within such opening, the bond wire or ribbon protruding horizontally, and an electrically conductive polymer, or epoxy, filaments or lines can be applied to the stack.Type: GrantFiled: December 27, 2012Date of Patent: May 20, 2014Assignee: Invensas CorporationInventors: Al Vindasius, Marc E. Robinson, Larry Jacobsen, Donald Almen
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Patent number: 8723332Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.Type: GrantFiled: May 20, 2008Date of Patent: May 13, 2014Assignee: Invensas CorporationInventors: Simon J. S. McElrea, Lawrence Douglas Andrews, Jr., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
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Patent number: 8704379Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: GrantFiled: August 27, 2008Date of Patent: April 22, 2014Assignee: Invensas CorporationInventors: Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, DeAnn Eileen Melcher, Marc E. Robinson
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Patent number: 8629543Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.Type: GrantFiled: October 27, 2010Date of Patent: January 14, 2014Assignee: Invensas CorporationInventors: Simon J. S. McElrea, Lawrence Douglas Andrews, Jr., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
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Publication number: 20130099392Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: ApplicationFiled: April 25, 2012Publication date: April 25, 2013Applicant: VERTICAL CIRCUITS, INC.Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, JR.
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Patent number: 8357999Abstract: The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack.Type: GrantFiled: May 3, 2007Date of Patent: January 22, 2013Assignee: Vertical Circuits (Assignment for the Benefit of Creditors), LLCInventors: Marc E. Robinson, Alfons Vindasius, Donald Almen, Larry Jacobsen
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Patent number: 8178978Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: GrantFiled: March 12, 2009Date of Patent: May 15, 2012Assignee: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, Jr.
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Publication number: 20110037159Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.Type: ApplicationFiled: October 27, 2010Publication date: February 17, 2011Applicant: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
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Publication number: 20100117224Abstract: A sensor die in a sensor device includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some devices, a conformal dielectric coating over at least part of the active area of the front side of the die. The sensor die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. In some devices, a coating over the active area of the sensor die provides mechanical and chemical protection for underlying structures in and on the die. In an image sensor device, for example, the coating over the image sensor array on the die is substantially optically transparent.Type: ApplicationFiled: December 15, 2009Publication date: May 13, 2010Applicant: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Marc E. Robinson
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Publication number: 20100052087Abstract: An image sensor die includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some embodiments, a conformal dielectric coating over the image array area of the front side of the die. The die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. The coating over the image array area, at least, is substantially transparent to visible light, and provides mechanical and chemical protection for underlying structures in and on the image sensor.Type: ApplicationFiled: August 28, 2009Publication date: March 4, 2010Applicant: Vertical Circuits, Inc.Inventors: Simon J. S. McElrea, Marc E. Robinson
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Publication number: 20090230528Abstract: Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.Type: ApplicationFiled: March 12, 2009Publication date: September 17, 2009Applicant: VERTICAL CIRCUITS, INC.Inventors: Simon J. S. McElrea, Marc E. Robinson, Lawrence Douglas Andrews, JR.
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Patent number: 7535109Abstract: The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack.Type: GrantFiled: May 3, 2007Date of Patent: May 19, 2009Assignee: Vertical Circuits, Inc.Inventors: Marc E. Robinson, Alfons Vindasius, Donald Almen, Larry Jacobsen
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Publication number: 20090102038Abstract: A die prepared for stacking in a chip scale stacked die assembly, having interconnect sites in an area inward from a die edge and interconnect pads near at least one die edge. Second-level interconnection of the stacked die assembly can be made by way of connections between a first die in the assembly and circuitry on a support; and interconnection between die in the stack can be made by way of connection of z-interconnects with bonds pads in the die attach side of the support near or at one or more die edges. Methods for preparing the die include processes carried out to an advanced stage at the wafer level or at the die array level.Type: ApplicationFiled: October 15, 2008Publication date: April 23, 2009Applicant: VERTICAL CIRCUITS, INC.Inventors: SIMON J.S. MCELREA, Marc E. Robinson, Lawrence Douglas Andrews, JR., Terrence Caskey, Scott McGrath, Yong Du, Al Vindasius
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Publication number: 20090065916Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.Type: ApplicationFiled: August 27, 2008Publication date: March 12, 2009Applicant: VERTICAL CIRCUITS, INC.Inventors: Scott Jay Crane, Simon J.S. McElrea, Scott McGrath, Weiping Pan, De Ann Melcher, Marc E. Robinson