Patents by Inventor Marc E. Robinson

Marc E. Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
    Publication number: 20080303131
    Abstract: In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
    Type: Application
    Filed: May 20, 2008
    Publication date: December 11, 2008
    Applicant: Vertical Circuits, Inc.
    Inventors: Simon J.S. McElrea, Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson, Loreto Cantillep
  • Conductive epoxy flip-chip on chip
    Patent number: 6271598
    Abstract: A flip chip on chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection between the first flip chip and the second flip chip. In another preferred embodiment, the present invention provides a flip chip assembly including a plurality of semiconductor chips where the plurality of chips are vertically interconnected on top of one another to form an electrically interconnected stack of chips; a flip chip directly connected to the top chip of the stack of chips; and electrically conductive epoxy means disposed between said flip chip and said top chip to form an electrical connection between the flip chip and the top chip.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: August 7, 2001
    Assignee: Cubic Memory, Inc.
    Inventors: Alfons Vindasius, Marc E. Robinson, William R. Scharrenberg
  • Method for forming conductive epoxy flip-chip on chip
    Patent number: 6098278
    Abstract: A flip chip on chip method for forming a flip chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection between the first flip chip and the second flip chip. In another preferred embodiment, a method for forming a flip chip assembly including a plurality of semiconductor chips where the plurality of chips are vertically interconnected on top of one another to form an electrically interconnected stack of chips; a flip chip directly connected to the top chip of the stack of chips; and electrically conductive epoxy means disposed between said flip chip and said top chip to form an electrical connection between the flip chip and the top chip.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: August 8, 2000
    Assignee: Cubic Memory, Inc.
    Inventors: Alfons Vindasius, Marc E. Robinson, William R. Scharrenberg