Abstract: For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: pulse width <40 ns pulse frequency ?20 kHz wavelength =532 nm.

Abstract: The invention relates to an intermediate support for electronic components, for example a semiconductor, comprising a plastic substrate with contact bumps (2) in one-piece, covered with a metallic layer, which is electrically connected to at least one conducting path of said substrate (1). Said contact bumps (2) each comprise a well wettable path, extending from the tips to the base thereof and each leading to the corresponding contact bump (2) base in a solder receiving region with suction (11). Therefore, by soldering said contact bumps, excess solder can be sucked off, such that short circuits can be avoided even without the use of a solder resist. By solder contacting said intermediate support, the solder can thus be applied over a large surface on a circuit support and sucked off the cavities between the contact points by reflow soldering.

Abstract: A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left.

Abstract: An intermediate base supports a semiconductor module on a printed circuit board. The intermediate base has an upper face on which the semiconductor component is directly mounted with its component connecting elements facing the upper face. The base has through-holes which are incorporated from a lower face of the base body so that the component conducting elements of the semiconductor component are exposed. The through-holes are then at least partially coated with a metal layer, which also contacts the exposed portions of the component connecting elements. Each of the through-holes has at least a partially annular notch, so that each through-hole extends through a recessed stud, which is used to form an external connection for the module onto the printed circuit board.

Abstract: A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency≧30 kHz for the metal layer and ≧20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.

Abstract: A method for introducing plated-through holes into an electrically insulating base material includes steps of: providing an electrically insulating base material having a first surface with a first metal layer and a second surface with a second metal layer; applying an etching resist layer at least to the first metal layer; using electromagnetic radiation to remove the etching resist layer and to thereby uncover the first metal layer in regions where plated-through holes are to be produced; etching away the uncovered regions of the first metal layer as far as the first surface of the base material; and using a laser beam to produce the plated-through holes in the base material.

Abstract: According to the invention, the connection side of an undivided semiconductor wafer (1) is directly connected to a thermoplastic film (2), whose thermal expansion coefficient is approximately as low as that of the semiconductor material. Protuberance (21) are moulded onto the exposed underside of the film (2) by a hot embossing process, said protuberances acting as elastic external connections (25) and being connected in a conductive manner to internal connections (24) or to the wafer terminal elements (11) via passages (22). Individual semiconductor modules or packages that can be contacted on a printed circuit board by means of the plastic protuberances (21) are produced by dividing the finished contacted wafer.

Abstract: In order to produce soldered connections between the contacts of components and the associated connections of a support, a deflectable laser beam is aimed at all the soldered points of a component quickly one after another and in a plurality of passes. This is done until the solder has melted at all the soldered points. The energy is supplied in a timesharing procedure, as a result of which more energy can be supplied without the risk of thermal damage, and the processing time can be shortened.

Abstract: The invention relates to a method for describing a predetermined desired course (1) with a beam of particles or waves, wherein a movable beam-directing device influences the direction of the beam, so that the latter describes an actual course (3, 4). The deviation of the actual course (3, 4) from the desired course due to inertia is minimized by specifying a corrected desired course (2), which describes diversions at the point of direction changes. The invention also relates to the use of this method for laser structuring or for writing guard plates or dial plates.

Abstract: To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region.

Abstract: A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures and the entire region of the later fine conductor structures. After the uncovered etching resist has been stripped, the photoresist is removed, whereupon the etching resist is patterned with the aid of a laser beam in such a way that it has the pattern of the fine conductor structures. The coarse conductor structures and the fine conductor structures are then formed in a common etching process.

Abstract: For the laser machining of organic materials, a laser with the below listed parameters is used. The laser has a wavelength of 300 nm to 1200 nm, a pulse width of <50 ns and a pulse frequency of >20 kHz. To increase a degree of absorption and consequently the machining rate, additives with good absorption of the laser beam with the respectively chosen wavelength are admixed with the organic materials.

Abstract: A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Abstract: A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left.

Abstract: To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region.

Abstract: A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures and the entire region of the later fine conductor structures. After the uncovered etching resist has been stripped, the photoresist is removed, whereupon the etching resist is patterned with the aid of a laser beam in such a way that it has the pattern of the fine conductor structures. The coarse conductor structures and the fine conductor structures are then formed in a common etching process.

Abstract: An intermediate base supports a semiconductor module on a printed circuit board. The intermediate base has an upper face on which the semiconductor component is directly mounted with its component connecting elements facing the upper face. The base has through-holes which are incorporated from a lower face of the base body so that the component conducting elements of the semiconductor component are exposed. The through-holes are then at least partially coated with a metal layer, which also contacts the exposed portions of the component connecting elements. Each of the through-holes has at least a partially annular notch, so that each through-hole extends through a recessed stud, which is used to form an external connection for the module onto the printed circuit board.

Abstract: For the laser machining of organic materials, a laser with the below listed parameters is used. The laser has a wavelength of 300 nm to 1200 nm, a pulse width of >50 ns and a pulse frequency of ≧20 kHz. To increase a degree of absorption and consequently the machining rate, additives with good absorption of the laser beam with the respectively chosen wavelength are admixed with the organic materials.

Abstract: A method for introducing plated-through holes into an electrically insulating base material includes steps of: providing an electrically insulating base material having a first surface with a first metal layer and a second surface with a second metal layer; applying an etching resist layer at least to the first metal layer; using electromagnetic radiation to remove the etching resist layer and to thereby uncover the first metal layer in regions where plated-through holes are to be produced; etching away the uncovered regions of the first metal layer as far as the first surface of the base material; and using a laser beam to produce the plated-through holes in the base material.

Abstract: A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.