Abstract: In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.

Abstract: A polymer stud grid array for microwave circuits is proposed which includes an injection-molded, three-dimensional substrate that is fabricated from an electrically insulating polymer. The substrate includes a plurality of polymer studs which are arranged over the underside of the substrate and which are integrally formed with the substrate during the injection-molding process. Signal connections are formed on the studs which include an end surface that is capable of being soldered. Potential connections are formed on at least one of the studs. The potential connection also includes an end surface that is capable of being soldered. Striplines are also constructed which connect the studs to the microwave circuit. Each stripline includes a first structured metal layer disposed on the underside of the substrate, a dielectric layer disposed on the first metal layer and a second structured metal layer disposed on top of the dielectric layer.

Abstract: In order to achieve better dissipation of the heat losses, a polymer stud grid array in proposed havingan injection-molded, three-dimensional substrate (S) composed of an electrically insulating polymer,polymer studs (PS) which are arranged over the area on the underneath of the substrate (S) and are integrally formed during injection molding,external connections which are formed on the polymer studs (PS) by an end surface which can be soldered,conductor runs which are formed at least on the underneath of the substrate (S) and connect the external connections to internal connections,at least one heat sink (WL) which is partially coated during the injection molding of the substrate (S), and havingat least one chip or wiring element (VE) which is arranged on the heat sink (WL) and whose connections are electrically conductively connected to the internal connections.The new configuration is suitable in particular for power components or power modules in a polymer stud grid array package.

Abstract: A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Abstract: A printed circuit board includes an injection molded substrate having a pattern recessed in the substrate surface of interconnect traces, through-connections and contact rods. A trench-shaped depression is provided in the substrate surface in the region of each interconnect trace, and a planar depression is provided in the substrate surface in at least one of (a) the region of each through-connection and (b) the region of each contact surface. The pattern of recesses is covered with a conductive metal coat, and the width of each trench-shaped depression is dimensioned narrowly in comparison of the width of each planar depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied, such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.