Patents by Inventor Marcus Edward Hennecke

Marcus Edward Hennecke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10276256
    Abstract: A device may include a first analog memory device to sample an analog input during a first time window of a sampling window, store a first analog signal based on sampling the analog input, and provide a first analog output after storing the first analog signal. The device may include a second analog memory device to sample the analog input during a second time window of the sampling window, store a second analog signal based on sampling the analog input, and provide a second analog output after storing the second analog signal. An output rate may be different from a sampling rate associated with sampling the analog input. An output order may be different from a sampling order associated with sampling the analog input. A time at which a read-out phase is performed, may be significantly different from a time at which a write phase is performed.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: April 30, 2019
    Assignee: Infineon Technologies AG
    Inventors: Marcus Edward Hennecke, Franz Michael Darrer
  • Publication number: 20190064026
    Abstract: Disclosed is an apparatus which has, among other things, a MEMS device with a first measurement arrangement for capturing a measurement variable (X1) based on a physical variable, which has a useful variable component (N1) and a first disturbance variable component (Z1), and a second measurement arrangement for capturing a second disturbance variable component (Z2). The apparatus furthermore has a disturbance compensation circuit which is configured to combine the second disturbance variable component (Z2) and the measurement variable (X1) with one another and to obtain a disturbance-compensated measurement variable (Xcomp). The MEMS device is arranged in a housing, wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a MEMS device surface.
    Type: Application
    Filed: August 20, 2018
    Publication date: February 28, 2019
    Inventors: Benjamin Kollmitzer, Franz Michael Darrer, Philipp Greiner, Marcus Edward Hennecke, Walter Schuchter, Christoph Steiner