Patents by Inventor Mari SAJI

Mari SAJI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180175282
    Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode including a first electrode layer located on the piezoelectric substrate and including one of Mo and W as a main component and a second electrode layer laminated on the first electrode layer and including Cu as a main component, and a dielectric film located on the piezoelectric substrate and covering the IDT electrode. The piezoelectric substrate is made of lithium niobate. The dielectric film is made of silicon oxide. The elastic wave device utilizes Rayleigh waves propagating along the piezoelectric substrate.
    Type: Application
    Filed: October 4, 2017
    Publication date: June 21, 2018
    Inventor: Mari SAJI
  • Publication number: 20180145658
    Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode including a first electrode layer which is provided on the piezoelectric substrate and contains Pt as a main component and a second electrode layer which is laminated on the first electrode layer and contains Cu as a main component, and a dielectric film that is provided on the piezoelectric substrate and covers the IDT electrode. The piezoelectric substrate is made of lithium niobate. The dielectric film is made of silicon oxide. The elastic wave device uses Rayleigh waves propagating along the piezoelectric substrate.
    Type: Application
    Filed: September 13, 2017
    Publication date: May 24, 2018
    Inventor: Mari SAJI
  • Publication number: 20180091118
    Abstract: An elastic wave device includes a piezoelectric substrate that includes first and second main surfaces which face each other, an interdigital transducer electrode that is provided on the first main surface of the piezoelectric substrate and includes a first electrode layer containing molybdenum as a main component, and a dielectric film that is provided on the piezoelectric substrate and covers the interdigital transducer electrode. The piezoelectric substrate is made of lithium niobate. The dielectric film is made of silicon oxide. The elastic wave device utilizes Rayleigh waves propagating through the piezoelectric substrate. The duty ratio of the interdigital transducer electrode is equal to or more than about 0.55 and less than or equal to about 0.75.
    Type: Application
    Filed: June 27, 2017
    Publication date: March 29, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Mari SAJI
  • Patent number: 9466782
    Abstract: A manufacturing method for a boundary acoustic wave device is capable of certainly providing the boundary acoustic wave device with desired target frequency characteristics. The manufacturing method for the boundary acoustic wave device includes a process for preparing a laminated body that includes a first medium, a second medium laminated on the first medium, and an IDT electrode that is disposed at an interface between the first and second media, and a process for implanting ions from an outer portion of the second medium and adjusting a frequency.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: October 11, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hajime Kando, Mari Saji
  • Patent number: 9368712
    Abstract: A surface acoustic wave device includes a piezoelectric substrate including a groove located in a surface thereof, an IDT electrode, and a dielectric film. The IDT electrode includes a first electrode layer located in the groove and a second electrode layer located outside the groove. The dielectric film is arranged on the piezoelectric substrate so as to cover the IDT electrode. The second electrode layer is tapered toward a side opposite to the piezoelectric substrate.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: June 14, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tetsuya Kimura, Yasuyuki Ida, Mari Saji
  • Publication number: 20140030442
    Abstract: A manufacturing method for a boundary acoustic wave device is capable of certainly providing the boundary acoustic wave device with desired target frequency characteristics. The manufacturing method for the boundary acoustic wave device includes a process for preparing a laminated body that includes a first medium, a second medium laminated on the first medium, and an IDT electrode that is disposed at an interface between the first and second media, and a process for implanting ions from an outer portion of the second medium and adjusting a frequency.
    Type: Application
    Filed: September 25, 2013
    Publication date: January 30, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Hajime KANDO, Mari SAJI
  • Patent number: 8569926
    Abstract: A manufacturing method for a boundary acoustic wave device is capable of certainly providing the boundary acoustic wave device with desired target frequency characteristics. The manufacturing method for the boundary acoustic wave device includes a process for preparing a laminated body that includes a first medium, a second medium laminated on the first medium, and an IDT electrode that is disposed at an interface between the first and second media, and a process for implanting ions from an outer portion of the second medium and adjusting a frequency.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: October 29, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hajime Kando, Mari Saji
  • Publication number: 20120049691
    Abstract: A manufacturing method for a boundary acoustic wave device is capable of certainly providing the boundary acoustic wave device with desired target frequency characteristics. The manufacturing method for the boundary acoustic wave device includes a process for preparing a laminated body that includes a first medium, a second medium laminated on the first medium, and an IDT electrode that is disposed at an interface between the first and second media, and a process for implanting ions from an outer portion of the second medium and adjusting a frequency.
    Type: Application
    Filed: August 23, 2011
    Publication date: March 1, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Hajime KANDO, Mari SAJI