Abstract: A computer system includes an exterior casing having an opening therein to permit user access to peripheral devices, such as floppy drives, CD ROM drives, tape drives, or optical drives. A door driven by a reversible motor slides along the exterior casing to open and close the opening in the exterior casing. A user may activate a sensor provided on the exterior casing to selectively open or close the door. The sensor may be a light-sensitive sensor, a voice-activated sensor, or a proximity sensor. Alternatively or in addition, the user may open and close the door via a system processor, for example, by entering commands via a keyboard. The door may slide along tracks within the exterior casing. In addition, the door may be locked in a closed position and unlocked to allow opening.

Abstract: A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts.

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract: An electrical interconnect system comprising a first electrical connector including a first plurality of electrically conductive contacts and a first insulator shroud surrounding the first plurality of contacts, the first shroud comprising a first side wall having upwardly and downwardly sloping portions and a second side wall having upwardly and downwardly sloping portions; and a second electrical connector including a second plurality of electrically conductive contacts and a second insulative shroud surrounding the second plurality of contacts, the second shroud comprising a third side wall having upwardly and downwardly sloping portions and a fourth side wall having upwardly and downwardly sloping portions, the first side wall being complementary with respect to the third wall, the second wall being complementary with respect to the fourth wall, and the sloping portions being configured such that, upon mating of the first and second electrical connectors, upper surfaces of the sloping portions of the firs

Abstract: A computer system including a plurality of air circulation areas to facilitate cooling of components with in the air circulation areas. Specifically, the system includes an air circulation area for a plurality of printed circuit boards, for a power supply, and for a plurality of internal and external peripherals, such as disk drives. The system also includes an automatic door that covers the external peripherals. The external peripherals slide forward, out of a casing of the system to facilitate upgrade and/or repair of the peripherals. In addition, the system includes cabling slots and structure to effect electromagnetic interference (EMI) shielding.

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract: A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts.