Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

Abstract: Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate. The method also includes forming a block from the layer of underfill material. The method further includes measuring a force required to shear the block from a surface of the flip-chip module.

Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.

Abstract: Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate. The method also includes forming a block from the layer of underfill material. The method further includes measuring a force required to shear the block from a surface of the flip-chip module.

Abstract: Underfill flow guide structures and methods of using the same are provided with a module. In particular the underfill flow guide structures are integrated with a substrate and are configured to prevent air entrapment from occurring during capillary underfill processes.

Abstract: Underfill flow guide structures and methods of using the same are provided with a module. The method includes mounting bumps on a substrate. The method also includes forming underfill flow guide structures on the substrate by patterning wires with an overlay of hard substance. The underfill flow guide structures are integrated with the substrate and formed between adjacent bumps. The underfill flow guide structures are further formed to uniformly guide underfill along the substrate during capillary underfill processing.

Abstract: Embodiments of the invention provide a semiconductor chip having a passivation layer extending along a surface of a semiconductor substrate to an edge of the semiconductor substrate, and methods for their formation. One aspect of the invention provides a semiconductor chip comprising: a semiconductor substrate; a passivation layer including a photosensitive polyimide disposed along a surface of the semiconductor substrate and extending to at least one edge of the semiconductor substrate; and a channel extending through the passivation layer to the surface of the semiconductor substrate.

Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.

Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.