Abstract: A split-band coding system combines multiple channels of input signals into various forms of composite signals and generates spatial-characteristic signals representing soundfield spatial characteristics in a plurality of frequency subbands. The spatial-characteristics signals may be generated in either or both of two forms. In a first form, the signal represents measures of signal levels for subband signals from the input channels. In a second form, the signal represents one or more apparent directions for the soundfield. The type of the spatial-characteristics signal may be adapted dynamically in response to a variety of criteria including input signal characteristics. Temporal smoothing and spectral smoothing of the spatial-characteristics signals may be applied in an encoder. Temporal smoothing and spectral smoothing may be applied to gain factors derived from the spatial-characteristics signals in a decoder.

Abstract: A multi-channel signal compressor for compressing digital sound signals in the respective channels of a multi-channel sound system. The apparatus comprises a first-stage compression system and a second-stage compression system. In the first-stage compression system, a coupling circuit performs coupling between the digital sound signals of at least two of the channels to generate coupling-processed signals, one for each of the channels. A compressor circuit receives the coupling-processed signals from the coupling circuit and frequency divides each coupling-processed signal into frequency range signals in respective frequency ranges, and compresses the frequency range signals obtained by dividing each coupling-processed signal to generate a first-stage compressed signal.

Abstract: A surround sound encoder, intended for implementation in software, runs in real time on a personal computer using low mips and a small fraction of available CPU cycles. In the principal application for the encoder, the Lt and Rt signals of the encoder are mixed with the Lt and Rt signals of a pre-recorded source (e.g., computer game soundtrack, CD ROM, Internet audio, etc.). Alternatively, the encoder may be used by itself or with one or more other virtual encoders to provide a totally user-generated soundfield. The encoder is implemented in either of two ways: the signal being encoded may be panned to one or more of the four inputs of a surround-sound fixed matrix encoder or the signal may be encoded by applying the signal to a surround-sound variable-matrix encoder.

Abstract: A split-band perceptual coding system utilizes generalized waveform predictive coding in frequency bands to further reduce coded signal information requirements. The system including frequency subband each having a bandwidth commensurate with or less than a corresponding critical band of human perception. The order of the predictors are selected to balance requirements for prediction accuracy and rapid response time. Predictive coding may be adaptively inhibited in a band during intervals in which no predictive coding gain is realized.

Abstract: An apparatus for producing a plasma suitable for semiconductor processing at pressures in the low millitorr range. The apparatus includes a vacuum chamber with a dielectric window, a generally planar coil disposed adjacent the window outside the chamber and coupled to an appropriate power source, and a plasma initiator disposed within the chamber. Once the plasma is initiated, the planar coil sustains the plasma by inductive power coupling. In one embodiment the plasma initiator is a secondary electrode disposed within the chamber and coupled to a second RF power source. In an alternative embodiment both the secondary electrode and a target pedestal are coupled to the secondary RF power source through a power splitter. In an alternative embodiment, the plasma initiator is used to ionize a portion of the process gas and provide a plasma that may then inductively couple with the planar coil.

Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: An apparatus for producing a plasma suitable for semiconductor processing at pressures in the low millitorr range. The apparatus includes a vacuum chamber with a dielectric window, a generally planar coil disposed adjacent the window outside the chamber and coupled to an appropriate power source, and a plasma initiator disposed within the chamber. Once the plasma is initiated, the planar coil sustains the plasma by inductive power coupling. In one embodiment the plasma initiator is a secondary electrode disposed within the chamber and coupled to a second RF power source. In an alternative embodiment both the secondary electrode and a target pedestal are coupled to the secondary RE power source through a power splitter. In an alternative embodiment, the plasma initiator is used to ionize a portion of the process gas and provide a plasma that may then inductively couple with the planar coil.

Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: An electronic frequency indicator for an AM/FM receiver utilizing a plurality of light-emitting diodes. The intensity of the diodes is varied to achieve greater resolution for the number of diodes in the indicator.