Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: A method of bonding glass to metal foil comprising contacting a glass substrate and a metal foil to create an interface therebetween; and directing a laser beam operating at a predetermined wavelength onto the interface to form an interfacial weld between the glass substrate and the metal foil, wherein the metal foil has a thickness greater than or equal to 5 ?m and less than or equal to 200 ?m, and wherein the laser beam comprises a pulsed laser having a pulse width greater than or equal to 1 nanosecond and less than or equal to 200 nanoseconds. In other embodiments, the metal foil has a thickness greater than 100 nm and less than or equal to 10 mm.

Abstract: A glass article comprises a film layer deposited on a glass substrate. The film layer has a melting point less than 450° C. and comprises a thickness and a primary surface. The primary surface defines at least one elevated surface protruding relative to the at least one relief surface. The elevated surface forms a periodic pattern defined by an etch mask, and the relief surface is defined as an inverse pattern of the etch mask. The duration of an etching process applied to the film layer defines a ratio of a first area of the elevated surface to a second area of the relief surface.

Abstract: A method of forming a nanopatterned substrate includes imprinting a deposited photoresist on a substrate with a stamp to form a nanopattern including nanofeatures on the substrate, the nanofeatures including a gap therebetween. The method includes performing glancing angle deposition of a metal on the nanopattern to deposit the metal on the nanofeatures. The method includes directionally etching the nanopattern including the metal in a direction normal to a surface of the nanopattern to remove the photoresist in the gap between the nanofeatures and to expose the substrate in the gap between the nanofeatures. The method includes depositing a deposition material on the directionally etched nanopattern such that the deposition material is deposited on the exposed substrate in the gap between the nanofeatures and on the metal that is on the nanofeatures.

Abstract: Methods and systems for forming a fiber assembly are provided herein. A method comprises removing an excess portion from an end of an optical fiber to form a severed end. The optical fiber defines an optical variation portion that includes an optical pathway defining a varying output characteristic of optical signals depending on a position therealong. When the severed end is formed, the position of the severed end along the optical variation portion defines the output characteristic of optical signals therefrom. The method further includes positioning the optical fiber with the severed end onto a film disposed on a surface of a substrate and placing a fixture thereover. The method further includes applying heat to the film through an opening of the fixture to create a bond between the optical fiber and the surface of the substrate.

Abstract: Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.

Abstract: A composite has repeating domains of an inorganic glass and a polymer, such that the inorganic glass and the polymer each have a glass transition temperature (Tg) or softening temperature of less than 450° C., and at least 50% of the inorganic glass domains have a length of less than 30 ?m as measured along at least one cross-sectional dimension.

Abstract: Assemblies and optical connectors including one or more optical fibers laser-bonded to a substrate, as well as methods for fabricating the same, are disclosed. In one embodiment, an assembly includes a substrate having a surface, an optical element bonded to the surface of the substrate, a bond area between the optical fiber and the surface of the substrate, wherein the bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate, and a metal buttress structure adjacent to the bond area.

Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Abstract: A device comprising: a first substrate; and a second substrate bonded to the first substrate via an innermost bond, an outermost bond, and bonds between the innermost bond and the outermost bond, the second substrate comprising a through-hole and an axis extending through the through-hole. Each of the bonds has a strength, and the strength of the bonds increases sequentially from the innermost bond to the outermost bond. The strength of each bond is sufficiently low such that the bonds fail in response to liquid (within a cavity defined by the first substrate, a third substrate, and the through-hole of the second substrate) exerting pressure on the first substrate instead of the first substrate failing. Each of the bonds are configured to fail at approximately the same pressure exerted upon the first substrate by the liquid. Additionally disclosed is a method of manufacturing the device.

Abstract: A bonded article includes a first substrate, a second substrate, and a bonding layer disposed between the first substrate and the second substrate. The bonding layer includes a conducting layer and a capping layer. The first substrate is bonded to the second substrate at a bonded region extending along a bond track. The bonded region is substantially continuous between the first substrate and the second substrate.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: A sealed glass package includes a top substrate and a bottom substrate, each of the top substrate and the bottom substrate comprising a first major surface and a second major surface opposite the first major surface; a central substrate disposed between the second major surface of the top substrate and the first major surface of the bottom substrate, the central substrate including a cavity filled by a first liquid and a second liquid; a polymer disposed between the second major surface of the top substrate and the central substrate; a first laser bond joining and hermetically sealing the first major surface of the bottom substrate and the central substrate; and a second laser bond joining and hermetically sealing the second major surface of the top substrate and the central substrate.

Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Abstract: Assemblies having one or more optical fibers laser bonded to a substrate are disclosed. In one embodiment, an assembly includes a substrate having a surface, an array of optical elements bonded to the surface of the substrate, an epoxy disposed between individual optical elements of the array of optical elements, and a plurality of spacer elements disposed within the epoxy, wherein at least one spacer element of the plurality of spacer elements is positioned between adjacent optical elements of the array of optical elements, and the plurality of spacer elements has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the epoxy. The assembly includes a bond area between each optical element of the array of optical elements and the surface of the substrate, wherein the bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Abstract: Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

Abstract: A composite has repeating domains of an inorganic glass and a polymer, such that the inorganic glass and the polymer each have a glass transition temperature (Tg) or softening temperature of less than 450° C., and at least 50% of the inorganic glass domains have a length of less than 30 ?m as measured along at least one cross-sectional dimension.

Abstract: A method of making a glass article, for example a glass light guide plate comprising at least one structured surface including a plurality of channels and peaks. The glass article may be suitable for enabling one dimensional dimming when used in a backlight unit for use as an illuminator for liquid crystal display devices.