Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: A laser-welded, sealed electronic device housing and related systems and methods are provided. The sealed housing includes a first substrate having a first surface and a second substrate having a second surface facing the first surface. The sealed housing includes a recess formed in the first substrate. The recess faces the second surface such that the second surface and the recess define a chamber. A laser weld bonds the first surface to the second surface, and the laser weld surrounds the chamber. A functional film is supported by at least one of the first surface and the second surface, and the functional film extends from the chamber and across the laser weld. In exemplary arrangements the device is an OLED device and the functional film form conductive leads in communication with the OLED.

Abstract: The QD LED module (10) disclosed herein includes a support assembly (40), a circuit board (20), an LED (30) operably supported by the circuit board, wherein the LED emits blue light (36G). The QD LED module also has a QD structure (60) supported by the support assembly and axially spaced apart from the LED surface. The QD structure has an active area (AR) that includes a first region (R1) of QD material and a second region (R2) that has no QD material. A first portion of the blue light passes through the first region and is converted to red light (36R) and green light (36G). A second portion of the blue light passes through the second region. The QD material has a CIE color point that is shifted toward the yellow portion of the color space.

Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Abstract: A method of making a glass article, for example a glass light guide plate comprising at least one structured surface including a plurality of channels and peaks. The glass article may be suitable for enabling one dimensional dimming when used in a backlight unit for use as an illuminator for liquid crystal display devices.

Abstract: A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 ?m, and the inorganic particle layer has an average thickness of less than or equal to 5 ?m.

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((?tensile stress location)/(?interface laser weld))<<1 or <1 and ?interface laser weld>10 MPa or >1 MPa where ?tensile stress location is the stress present in the first substrate and ?interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Abstract: Assemblies, optical connectors, and methods for forming fiber arrays using laser bonded optical fibers are disclosed. In one embodiment, a method of forming a fiber array includes placing an optical fiber on a surface of a substrate, directing a laser beam into the optical fiber disposed on the surface of the substrate, melting, using the laser beam, a material of the substrate to create a first laser bond zone between the optical fiber and the surface of the substrate, applying an adhesive to the optical fiber and the substrate to create an adhesive bond zone between the optical fiber and the surface of the substrate, and cutting the optical fiber and the substrate to create a first section of the fiber array and a second section of the fiber array.

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Abstract: Assemblies, optical connectors, and methods for forming fiber arrays using laser bonded optical fibers are disclosed. In one embodiment, a method of forming a fiber array includes placing an optical fiber on a surface of a substrate, directing a laser beam into the optical fiber disposed on the surface of the substrate, melting, using the laser beam, a material of the substrate to create a first laser bond zone between the optical fiber and the surface of the substrate, applying an adhesive to the optical fiber and the substrate to create an adhesive bond zone between the optical fiber and the surface of the substrate, and cutting the optical fiber and the substrate to create a first section of the fiber array and a second section of the fiber array.

Abstract: An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which ?HAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein ?HAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its ?interface laser weld>?HAZ, wherein ?interface laser weld is peak value of compressive stress in the laser welded zone.

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one bond between the first and second substrates. The inorganic film can comprise about 10-80 mol % B2O3, about 5-60 mol % Bi2O3, and about 0-70 mol % ZnO. Methods for sealing devices using such an inorganic film are also disclosed herein, as well as display and electronic components comprising such sealed devices.

Abstract: Disclosed herein are methods for making a sealed device (200), the methods comprising positioning a sealing layer comprising at least one metal between a first glass substrate (201a) and a second substrate (201b) to form a sealing interface; and directing a laser beam operating at a predetermined wavelength onto the sealing interface to form at least one seal (207) between the first and second substrates and to convert the at least one metal to metal nanoparticles. Sealed devices having a seal comprising metal nanoparticles having a particles size of less than about 50 nm are also disclosed herein, as well as display devices comprising such sealed devices.

Abstract: A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 ?m, and the inorganic particle layer has an average thickness of less than or equal to 5 ?m.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices.