Abstract: A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.

Abstract: A flexible substrate is described herein which is made from a freestanding inorganic material (e.g., mica paper, carbon paper, glass fiber paper) with pores/interstices that have been impregnated with a special impregnating material (e.g., silsesquioxane, alkali silicate glass with weight ratio of SiO2/X2O (X is alkali Na, K etc.) between 1.6-3.5). In one embodiment, the flexible substrate is made by: (1) providing a freestanding inorganic material; (2) providing an impregnating material; (3) impregnating the pores/interstices within the freestanding inorganic material with the impregnating material; and (4) curing the freestanding inorganic material with the impregnated pores/interstices to form the flexible substrate. The flexible substrate is typically used to make a flexible display or a flexible electronic.