Abstract: A device and method for manufacturing a device comprising two semiconductor dice. The device is formed by a first die and a second die. The first die is of semiconductor material and integrates electronic components. The second die has a main surface, forms patterned structures, and is bonded to the first die. Internal electrical coupling structures electrically couple the main surface of the first die to the second die. External connection regions extend on the main surface of the first die. A package packages the first die, the second die and the internal electrical coupling structures and partially surrounds the external connection regions, the external connection regions partially protruding from the package.

Abstract: A series of fused pentacyclic imidazole derivatives, being potent modulators of human TNFa activity, are accordingly of benefit in the treatment and/or prevention of various human ailments, including autoimmune and inflammatory disorders; neurological and neurodegenerative disorders; pain and nociceptive disorders; cardiovascular disorders; metabolic disorders; ocular disorders; and oncological disorders. In particular, the present invention is concerned with 6, 7-dihydro-7, 14-methanobenzimidazo[1, 2-b][2,5]benzodiazocin-5(14H)-one derivatives and analogs thereof.

Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where the electrically insulating material partially covers the first surface so as to expose the optical zone.

Abstract: The methods and systems provide remote device recovery using a sideband communication path in response to an error occurring in the device. A management entity sends a sideband communication using the sideband communication path to a logic circuit in communication with the device. The logic circuit initiates the recovery of the device.

Abstract: An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

Abstract: A process for manufacturing electroacoustic modules including: forming an assembly with a redistribution structure and a plurality of dice arranged in a dielectric region; forming a wafer with a semiconductor body and a plurality of respective unit portions laterally staggered, each of which includes a respective supporting region, set in contact with the semiconductor body, and a number of actuators; reducing the thickness of the semiconductor body and then selectively removing portions of the semiconductor body so as to singulate, starting from the wafer, a plurality of transduction structures, each including a semiconductor substrate, which contacts a corresponding supporting region and is traversed by cavities delimited by portions of the supporting region that form membranes mechanically coupled to the actuators; and then coupling the transduction structures to the redistribution structure of the assembly.

Abstract: An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.

Abstract: The present disclosure relates to systems, methods, and computer readable media for enabling a power shelf unit to communicate a power throttle signal to devices of a power rack (or other grouping of devices) via a busbar. In particular, systems disclosed herein involve detecting a trigger condition associated with throttling power on server devices of a server rack. In response to detecting the trigger condition, systems here cause a direct current (DC) power supply voltage to change from an operating voltage to a notification voltage for a period of time to alert or otherwise communicate to server devices coupled to the busbar of the trigger condition. Causing the DC power supply voltage to change to the notification voltage may cause processors on server devices to throttle power consumption in accordance with one or more power capping policies implanted thereon.

Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.

Abstract: A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.

Abstract: An optical waveguide includes a glass waveguide body and a waveguide core through which optical radiation propagates. The waveguide core includes: a body portion extending within the waveguide body, a coupling portion extending at the surface of the waveguide body, and an S-bent intermediate portion coupling the body portion and the coupling portion. An optical coupling arrangement (e.g., for coupling one or more optical fibers to a silicon photonics device) includes one such optical waveguide and a second optical waveguide including a respective waveguide body and one or more waveguide members. The second optical waveguide is coupled with the first optical waveguide with the waveguide member(s) facing the coupling portion of the first optical waveguide.

Abstract: A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.

Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

Abstract: A processor may be coupled to a flash memory by way of an interface. The processor may be caused to read and/or write data, such as computer executable instructions, from/to the flash memory via the interface. An interface filter may be interposed between the processor and the flash memory to enhance the security and validity of data transactions associated with the processor and the flash memory.

Abstract: A method includes providing a semiconductor wafer that includes at least one optical waveguide extending in a longitudinal direction. Stealth dicing laser processing is applied to the semiconductor wafer by producing defect regions into the wafer along at least one cutting line. The cutting line is oblique to the longitudinal direction of the at least one optical waveguide. The wafer is expanded to induce fracture thereof at the at least one cutting line, thereby producing an end surface of the at least one optical waveguide. The end surface is oblique to the longitudinal direction of the at least one optical waveguide.

Abstract: An optical coupling includes a body having a first surface which couples with a photonics integrated circuit and a second surface including an array of lenses integral with the body. The array of lenses couples to an optical fiber connector. The array of lenses may be a linear array. The body may be made of a polymer material, which may be optically cured. The photonics integrated circuit and the optical coupling may be used, for example, in a mobile phone. The optical coupling may be made by shaping curable material on a photonics integrated circuit into a body, and curing the body of curable material. The cured body includes the first surface in contact with the photonics integrated circuit and the second surface including the array of optical lenses to couple with the optical fiber connector.

Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.

Abstract: A processor may be coupled to a flash memory by way of an interface. The processor may be caused to read and/or write data, such as computer executable instructions, from/to the flash memory via the interface. An interface filter may be interposed between the processor and the flash memory to enhance the security and validity of data transactions associated with the processor and the flash memory.