Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: A method includes providing a semiconductor wafer that includes at least one optical waveguide extending in a longitudinal direction. Stealth dicing laser processing is applied to the semiconductor wafer by producing defect regions into the wafer along at least one cutting line. The cutting line is oblique to the longitudinal direction of the at least one optical waveguide. The wafer is expanded to induce fracture thereof at the at least one cutting line, thereby producing an end surface of the at least one optical waveguide. The end surface is oblique to the longitudinal direction of the at least one optical waveguide.

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface..

Abstract: An optical waveguide includes a glass waveguide body and a waveguide core through which optical radiation propagates. The waveguide core includes: a body portion extending within the waveguide body, a coupling portion extending at the surface of the waveguide body, and an S-bent intermediate portion coupling the body portion and the coupling portion. An optical coupling arrangement (e.g., for coupling one or more optical fibers to a silicon photonics device) includes one such optical waveguide and a second optical waveguide including a respective waveguide body and one or more waveguide members. The second optical waveguide is coupled with the first optical waveguide with the waveguide member(s) facing the coupling portion of the first optical waveguide.

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: An optical coupling includes a body having a first surface which couples with a photonics integrated circuit and a second surface including an array of lenses integral with the body. The array of lenses couples to an optical fiber connector. The array of lenses may be a linear array. The body may be made of a polymer material, which may be optically cured. The photonics integrated circuit and the optical coupling may be used, for example, in a mobile phone. The optical coupling may be made by shaping curable material on a photonics integrated circuit into a body, and curing the body of curable material. The cured body includes the first surface in contact with the photonics integrated circuit and the second surface including the array of optical lenses to couple with the optical fiber connector.

Abstract: An electro-optic device may include a photonic chip having an optical grating at a surface, and an IC coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path.

Abstract: An electro-optic device may include a photonic chip having an optical grating at a surface, and an IC coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path.

Abstract: An electro-optic device may include a photonic chip having an optical grating at a surface, and an IC coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path.

Abstract: An electro-optic device may include a photonic chip having an optical grating at a surface, and an IC coupled to the photonic chip. The electro-optic device may include an optical element defining an optical path above the optical grating, and a dichroic mirror above the optical grating and aligned with the optical path.

Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate.

Abstract: An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate.

Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Abstract: An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.

Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.

Abstract: An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.

Abstract: An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.