Patents by Inventor Mark Bennett

Mark Bennett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8398124
    Abstract: A fitting is provided that may optionally be pulled up to its final assembled condition by torque rather than by turns. At least one fitting component includes a structure that facilitates pull up by torque. In one embodiment, a ring is provided that may be disposed on one of the fitting components and includes an engagement surface that engages a surface on the other of the fitting components at a first axial position that corresponds to a complete pull up. The engaging surfaces increase the torque required to continue pulling up the fitting past the first axial position.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: March 19, 2013
    Inventors: Mark A. Bennett, Tobin Barry, Mark A. Clason, John D. Karkosiak, Thomas A. Lippucci, Andrew P. Marshall, Jeffrey Michael Rubinski, Edward A. Stroberg, Peter C. Williams
  • Publication number: 20130066868
    Abstract: A system, a method and a computer program product for storing data, which include receiving a data stream having a plurality of transactions that include at least one portion of data, determining whether at least one portion of data within at least one transaction is substantially similar to at least another portion of data within at least one transaction, clustering together at least one portion of data and at least another portion of data within at least one transaction, selecting one of at least one portion of data and at least another portion of data as a representative of at least one portion of data and at least another portion of data in the received data stream, and storing each representative of a portion of data from each transaction in the plurality of transactions, wherein a plurality of representatives is configured to form a chain representing the received data stream.
    Type: Application
    Filed: October 13, 2011
    Publication date: March 14, 2013
    Applicant: EXAGRID SYSTEMS, INC.
    Inventors: Mark Bennett Hecker, Ashok T. Ramu
  • Publication number: 20120296543
    Abstract: A vehicle, air brake system is presented with an improved service work brake arrangement. The arrangement may provide a service work brake function or both a service work brake function and a parking brake function for the vehicle. The arrangement may provide an improved service work brake arrangement disposed within a housing for reducing the number of components and plumbing required to achieve this functionality versus prior known systems. The arrangement may utilizes a pneumatic latching valve to deliver pressurized air for applying a vehicle's service brakes. The pneumatic latching valve opens upon receiving a pneumatic control signal from an electronically controlled valve and closes upon receiving a pneumatic control signal from another source. In addition, a controller and control logic may be provided for controlling the arrangement.
    Type: Application
    Filed: August 6, 2012
    Publication date: November 22, 2012
    Applicant: BENDIX COMMERCIAL VEHICLE SYSTEMS LLC
    Inventors: Matthew E. Rogers, Mark A. Bennett, Ron R. Stahl, Michael D. Tober, Kenneth A. Grolle, Richard J. Conklin, Timothy J. Frashure, David W. Howell
  • Patent number: 8283748
    Abstract: Electronic elements having an active device region and integrated passive device (IPD) region on a common substrate preferably include a composite dielectric region in the IPD region underlying the IPD to reduce electro-magnetic (E-M) coupling to the substrate. Mechanical stress created by plain dielectric regions and its deleterious affect on performance, manufacturing yield and occupied area may be avoided by providing electrically isolated inclusions in the composite dielectric region of a material having a thermal expansion coefficient (TEC) less than that of the dielectric material in the composite dielectric region. For silicon substrates, non-single crystal silicon is suitable for the inclusions and silicon oxide for the dielectric material. The inclusions preferably have a blade-like shape separated by and enclosed within the dielectric material.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: October 9, 2012
    Assignee: Freescale Semiconductors, Inc.
    Inventors: Xiaowei Ren, Wayne R. Burger, Colin Kerr, Mark A. Bennett
  • Publication number: 20120241043
    Abstract: A semi-automated system suitable for use in a hospital setting for filling patient-specific liquid prescriptions to be administered by oral syringes on a just-in-time basis. The system enables hospital pharmacists to simplify and streamline their task, increasing the number of prescriptions that can be filled in a day, improving patient safety and care by minimizing medication errors and the consequences that ensue.
    Type: Application
    Filed: September 19, 2011
    Publication date: September 27, 2012
    Inventors: Nicholas J. Perazzo, Robert A. Rosen, John G. Grosskopf, JR., Mark Bennett, D. Bruce Cohen, John M. Chopper
  • Publication number: 20120222897
    Abstract: In one general embodiment, a product includes a metal panel having a main portion and a knockout portion formed therein and detachably coupled thereto, wherein the knockout portion includes at least one member insertable in one or more apertures in the main portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom. In another general embodiment, a product includes a metal panel having a main portion and a knockout portion formed therein and detachably coupled thereto, wherein the main portion includes at least one member insertable in one or more apertures in the knockout portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom.
    Type: Application
    Filed: May 8, 2012
    Publication date: September 6, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gregory Mark Bennett, Daniel Paul Kelaher, Timothy Andreas Meserth, Derek Ian Schmidt
  • Patent number: 8247709
    Abstract: A product according to one embodiment includes a metal panel having a main portion and a knockout portion formed therein, the knockout portion being coupled to the main portion by at least one web of metal contiguous to both the knockout portion and the main portion, the at least one web allowing detachment of the knockout portion from the main portion, wherein the knockout portion includes at least one member insertable in one or more apertures in the main portion for allowing re-coupling the knockout portion to the main portion after detachment therefrom.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: August 21, 2012
    Assignee: International Business Machines Corporation
    Inventors: Gregory Mark Bennett, Daniel Paul Kelaher, Timothy Andreas Meserth, Derek Ian Schmidt
  • Publication number: 20120187678
    Abstract: Fittings are provided for use with different types of tubing. One such fitting includes a gripping member having a sharp tube indenting edge that provides a seal between the tube gripping member and the tube. Another such fitting includes a tube gripping member having a body indenting edge that provides a seal between the tube gripping member and a fitting body.
    Type: Application
    Filed: November 23, 2011
    Publication date: July 26, 2012
    Applicant: SWAGELOK COMPANY
    Inventors: Peter C. Williams, George A. Carlson, Andrew P. Marshall, Mark A. Clason, Mark A. Bennett, Jeffrey M. Rubinski, Mark D. Bearer, Dale C. Arstein
  • Patent number: 8134241
    Abstract: Electronic elements having an active device region and bonding pad (BP) region on a common substrate desirably include a dielectric region underlying the BP to reduce the parasitic impedance of the BP and its interconnection as the electronic elements are scaled to higher power and/or operating frequency. Mechanical stress created by plain (e.g., oxide only) dielectric regions can adversely affect performance, manufacturing yield, pad-to-device proximity and occupied area. This can be avoided by providing a composite dielectric region having electrically isolated inclusions of a thermal expansion coefficient (TEC) less than that of the dielectric material in which they are embedded and/or closer to the substrate TEC. For silicon substrates, poly or amorphous silicon is suitable for the inclusions and silicon oxide for the dielectric material. The inclusions preferably have a blade-like shape separated by and enclosed within the dielectric material.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: March 13, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jeffrey K. Jones, Margaret A. Szymanowski, Michele L. Miera, Xiaowei Ren, Wayne R. Burger, Mark A. Bennett, Colin Kerr
  • Publication number: 20120038023
    Abstract: Electronic elements having an active device region and integrated passive device (IPD) region on a common substrate preferably include a composite dielectric region in the IPD region underlying the IPD to reduce electro-magnetic (E-M) coupling to the substrate. Mechanical stress created by plain dielectric regions and its deleterious affect on performance, manufacturing yield and occupied area may be avoided by providing electrically isolated inclusions in the composite dielectric region of a material having a thermal expansion coefficient (TEC) less than that of the dielectric material in the composite dielectric region. For silicon substrates, non-single crystal silicon is suitable for the inclusions and silicon oxide for the dielectric material. The inclusions preferably have a blade-like shape separated by and enclosed within the dielectric material.
    Type: Application
    Filed: October 20, 2011
    Publication date: February 16, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Xiaowei Ren, Wayne R. Burger, Colin Kerr, Mark A. Bennett
  • Patent number: 8071461
    Abstract: Electronic elements (44, 44?, 44?) having an active device region (46) and integrated passive device (IPD) region (60) on a common substrate (45) preferably include a composite dielectric region (62, 62?, 62?) in the IPD region underlying the IPD (35) to reduce electromagnetic (E-M) (33) coupling to the substrate (45). Mechanical stress created by plain dielectric regions (36?) and its deleterious affect on performance, manufacturing yield and occupied area may be avoided by providing electrically isolated inclusions (65, 65?, 65?) in the composite dielectric region (62, 62?, 62?) of a material having a thermal expansion coefficient (TEC) less than that of the dielectric material (78, 78?, 78?) in the composite dielectric region (62, 62?, 62?). For silicon substrates (45), non-single crystal silicon is suitable for the inclusions (65, 65?, 65?) and silicon oxide for the dielectric material (78, 78?, 78?).
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: December 6, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Xiaowei Ren, Wayne R. Burger, Colin Kerr, Mark A. Bennett
  • Publication number: 20110277309
    Abstract: A ferrule type, flareless fitting is provided that may optionally be pulled-up to its assembled condition by torque rather than by turns. In one embodiment, at least one fitting component includes a structure that facilitates pull-up by torque and allows the fitting to be remade. The structure may take a wide variety of different forms. Examples of fitting component structures that facilitate pull-up by torque and allow the fitting to be remade include, but are not limited to, deformable or compressible devices or structures that are configured to increase the torque required to further tighten the fitting components when the fitting is properly pulled up, resiliently deformable structures that bias a tube gripping device into engagement with a conduit when the fitting is remade to an initial pull-up position, and plastically deformable retaining structures that maintain a tube gripping device in sealing en a ement with a conduit when a fittin is disassembled.
    Type: Application
    Filed: August 4, 2008
    Publication date: November 17, 2011
    Applicant: SWAGELOK COMPANY
    Inventors: Mark D. Bearer, Mark A. Bennett, John D. Karkosiak, Jeffrey Michael Rubinski, Peter C. Williams, Tobin Berry, Mark A. Clason, Eric M. Kvarda
  • Publication number: 20110266687
    Abstract: Electronic elements having an active device region and bonding pad (BP) region on a common substrate desirably include a dielectric region underlying the BP to reduce the parasitic impedance of the BP and its interconnection as the electronic elements are scaled to higher power and/or operating frequency. Mechanical stress created by plain (e.g., oxide only) dielectric regions can adversely affect performance, manufacturing yield, pad-to-device proximity and occupied area. This can be avoided by providing a composite dielectric region having electrically isolated inclusions of a thermal expansion coefficient (TEC) less than that of the dielectric material in which they are embedded and/or closer to the substrate TEC. For silicon substrates, poly or amorphous silicon is suitable for the inclusions and silicon oxide for the dielectric material. The inclusions preferably have a blade-like shape separated by and enclosed within the dielectric material.
    Type: Application
    Filed: July 8, 2011
    Publication date: November 3, 2011
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Jeffrey K. Jones, Margaret A. Szymanowski, Michele L. Miera, Xiaowei Ren, Wayne R. Burger, Mark A. Bennett, Colin Kerr
  • Patent number: 7998852
    Abstract: Electronic elements (44, 44?, 44?) having an active device region (46) and bonding pad (BP) region (60) on a common substrate (45) desirably include a dielectric region underlying the BP (35) to reduce the parasitic impedance of the BP (35) and its interconnection (41) as the electronic elements (44, 44?, 44?) are scaled to higher power and/or operating frequency. Mechanical stress created by plain (e.g., oxide only) dielectric regions (36?) can adversely affect performance, manufacturing yield, pad-to-device proximity and occupied area. This can be avoided by providing a composite dielectric region (62, 62?, 62?) having electrically isolated inclusions (65, 65?, 65?) of a thermal expansion coefficient (TEC) less than that of the dielectric material (78, 78?, 78?) in which they are embedded and/or closer to the substrate (45) TEC. For silicon substrates (45), poly or amorphous silicon is suitable for the inclusions (65, 65?, 65?) and silicon oxide for the dielectric material (78, 78?, 78?).
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: August 16, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jeffrey K. Jones, Margaret A. Szymanowski, Michele L. Miera, Xiaowei Ren, Wayne R. Burger, Mark A. Bennett, Colin Kerr
  • Patent number: 7966906
    Abstract: Three elements of a fluid flow control device—switch, button, label—are designed to minimize the possibility of two labeled buttons being swapped on their switches. If the parts are assembled incorrectly or mislabeled, or if the buttons are thereafter swapped on the switches, it will be very obvious; then, if one attempts to fix such a problem, it can only be fixed by placing the buttons on the correct switches, and it can not be fixed by leaving the buttons on the wrong switches.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: June 28, 2011
    Assignee: Bendix Commercial Vehicle Systems LLC
    Inventors: Mark A. Bennett, Jeffrey M Geither
  • Patent number: 7967268
    Abstract: A vertically stabilized shelf bracket assembly having at least two support strips on which a plurality of shelf brackets are mounted. A cover is provided that aesthetically enhances the shelf bracket assembly and stabilizes it at the same time. In one embodiment, the cover includes a cap and a hanging casing. In one embodiment, apertures are provided in the shelf brackets to support a rod. In another embodiment an adjustable mounting slot is provided in the support strips to facilitate their parallel installation.
    Type: Grant
    Filed: January 19, 2009
    Date of Patent: June 28, 2011
    Assignee: Herron Intellectual Property Holdings, LLC
    Inventors: Warren L. Herron, III, Warren L. Herron, Jr., Mark Bennett, Randall Bachtel
  • Patent number: 7954530
    Abstract: At least one guide roller is provided for guiding a moving cable or conduit. At least one tamping device comprising at least one tamping pad is provided for applying at least one label onto the moving cable or conduit. A guide shoe assembly comprising at least one guide shoe is provided for pressing the at least one label directly against at least one side of the moving cable or conduit. A method for applying labels is also provided. A method comprising guiding a cable or conduit to a labeling unit with a set of guide rollers, affixing a label to the cable or conduit with at least one tamping device, and pressing the label against at least one side of the cable or conduit using at least one guide shoe.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: June 7, 2011
    Assignee: Encore Wire Corporation
    Inventors: Mark Bennett, William Thomas Bigbee, Jr., Steve Griffin
  • Patent number: 7953841
    Abstract: The communication apparatus includes a VoIP phone, a VoIP gateway, a communication network, and a network analyzer. The VoIP phone is a transmitting/receiving device to transmit and receive a VoIP phone call. A plurality of VoIP phone calls are transmitted and received over the communication network via the VoIP gateway. The network analyzer analyzes and monitors the plurality of VoIP phone calls transmitted and received over the communication network. Accordingly, a respective VoIP phone call is identified from the plurality of phone calls and associated with a respective data stream to be monitored and analyzed by the network analyzer.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: May 31, 2011
    Assignee: JDS Uniphase Corporation
    Inventors: Timothy Mark Bennett, William Grant Grovenburg
  • Patent number: 7930812
    Abstract: A method and apparatus for providing toolless rack mounting rail installation using a pin having a latch. A retention device according to an embodiment of the present invention includes stepped features and a dual locking mechanism that are configured to engage standard apertures of rack systems. The locking mechanism is configured to extend beyond the surface of a pin when in a normal position, but may be depressed to allow the retention device to be easily inserted or removed without the use of tools.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: April 26, 2011
    Assignee: International Business Machines Corporation
    Inventors: Michael Allen Curnalia, John Geoffrey Gundlach, Daniel Paul Kelaher, Gregory Mark Bennett
  • Publication number: 20100308044
    Abstract: A sealable container (210) for flowable material formed with top (212) and flexible and stiffened bottom (214) walls joined by front (216), rear (218), and opposite side walls (220, 222). The top wall including an openable lid (D) formed with an improved scoop holder (30) and a collar (300) received about a finish (282) of the front, rear, and side walls. The flexible and stiffened bottom wall (214) includes at least one sagittal stiffening channel (500) and an optional transverse stiffening channel (530). The openable lid includes a sealing wall (340) that cooperates with other improved container components to prevent spillage of the flowable material after the seal is peeled and removed.
    Type: Application
    Filed: August 3, 2009
    Publication date: December 9, 2010
    Applicant: Abbott Laboratories
    Inventors: James P. Perry, Mark A. Bennett, Martin J. Gibler, Marc A. Pedmo, Sean P. Cronican, Jeremy J. McBroom, John G. Barca, David E. Compeau, Gregory J. Finn