Patents by Inventor Mark Boysel

Mark Boysel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10407299
    Abstract: A three dimensional (3D) micro-electro-mechanical system (MEMS) device is provided. The device comprises a central MEMS wafer, and top and bottom cap wafers. The MEMS wafer includes a MEMS structure, such as an inertial sensor. The 5 top cap wafer, the bottom cap wafer and the MEMS wafers are stacked along a stacking axis and together form at least one hermetic cavity enclosing the MEMS structure. At least one of the top cap wafer and the bottom cap wafer is a silicon-on- insulator (SOI) cap wafer comprising a cap device layer, a cap handle layer and a cap insulating layer interposed between the cap device layer and the cap handle layer. At 10 least one electrically conductive path extends through the SOI cap wafer, establishing an electrical convection between an outer electrical contact provided on the SOI cap wafer and the MEMS structure.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: September 10, 2019
    Assignee: Motion Engine Inc.
    Inventor: Robert Mark Boysel
  • Patent number: 10273147
    Abstract: A MEMS and a method of manufacturing MEMS components are provided. The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS wafer and optionally a bottom cap wafer. The MEMS wafer has MEMS structures patterned therein. The MEMS wafer and the cap wafers include insulated conducting channels forming insulated conducting pathways extending within the wafer stack. The wafer stack is bonded to an integrated circuit wafer having electrical contacts on its top side, such that the insulated conducting pathways extend from the integrated circuit wafer to the outer side of the top cap wafer. Electrical contacts on the outer side of the top cap wafer are formed and are electrically connected to the respective insulated conducting channels of the top cap wafer. The MEMS wafer stack and the integrated circuit wafer are then diced into components having respective sealed chambers and MEMS structures housed therein.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: April 30, 2019
    Assignee: Motion Engine Inc.
    Inventor: Robert Mark Boysel
  • Publication number: 20190064364
    Abstract: Systems and methods are provided for determining the position of sensor elements in a sensor system. The sensor system includes a plurality of sensor elements. The platform comprises a plurality of MEMS IMUs, each associated with one of the sensor elements, measuring the acceleration and angular rate of the sensor elements. A controller determines the position and attitude of the sensor elements, based on the acceleration and angular rate measured by each of the MEMS IMUs.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 28, 2019
    Inventors: Robert Mark Boysel, Louis Ross
  • Patent number: 10214414
    Abstract: An integrated MEMS system having a MEMS chip, including a MEMS transducer, and at least one IC chip, including MEMS processing circuitry, and additional circuitry to process electrical signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducer and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct electrical signals to the IC chip, to be processed by additional circuitry.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: February 26, 2019
    Assignee: Motion Engine, Inc.
    Inventors: Robert Mark Boysel, Louis Ross
  • Publication number: 20180362330
    Abstract: A MEMS and a method of manufacturing MEMS components are provided. The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS wafer and optionally a bottom cap wafer. The MEMS wafer has MEMS structures patterned therein. The MEMS wafer and the cap wafers include insulated conducting channels forming insulated conducting pathways extending within the wafer stack. The wafer stack is bonded to an integrated circuit wafer having electrical contacts on its top side, such that the insulated conducting pathways extend from the integrated circuit wafer to the outer side of the top cap wafer. Electrical contacts on the outer side of the top cap wafer are formed and are electrically connected to the respective insulated conducting channels of the top cap wafer. The MEMS wafer stack and the integrated circuit wafer are then diced into components having respective sealed chambers and MEMS structures housed therein.
    Type: Application
    Filed: September 19, 2014
    Publication date: December 20, 2018
    Inventor: Robert Mark Boysel
  • Publication number: 20180074090
    Abstract: A single Micro-Electro-Mechanical System (MEMS) sensor chip is provided, for measuring multiple parameters, referred to as multiple degrees of freedom (DOF). The sensor chip comprises a central MEMS wafer bonded to a top cap wafer and a bottom cap wafer, all three wafer being electrically conductive. The sensor comprises at least two distinct sensors, each patterned in the electrically conductive MEMS wafer and in at least one of the top and bottom cap wafer. Insulated conducting pathways extend from electrical connections on the top or bottom cap wafers, through at least one of the electrically conductive top cap and bottom cap wafers, and through the electrically conductive MEMS wafer, to the sensors, for conducting electrical signals between the sensors and the electrical connections. The two or more distinct sensors are enclosed by the top and bottom cap wafers and by the outer frame of MEMS wafer.
    Type: Application
    Filed: March 17, 2016
    Publication date: March 15, 2018
    Inventor: Robert Mark Boysel
  • Publication number: 20180002163
    Abstract: A three dimensional (3D) micro-electro-mechanical system (MEMS) device is provided. The device comprises a central MEMS wafer, and top and bottom cap wafers. The MEMS wafer includes a MEMS structure, such as an inertial sensor. The 5 top cap wafer, the bottom cap wafer and the MEMS wafers are stacked along a stacking axis and together form at least one hermetic cavity enclosing the MEMS structure. At least one of the top cap wafer and the bottom cap wafer is a silicon-on- insulator (SOI) cap wafer comprising a cap device layer, a cap handle layer and a cap insulating layer interposed between the cap device layer and the cap handle layer. At 10 least one electrically conductive path extends through the SOI cap wafer, establishing an electrical convection between an outer electrical contact provided on the SOI cap wafer and the MEMS structure.
    Type: Application
    Filed: January 14, 2016
    Publication date: January 4, 2018
    Inventor: Robert Mark Boysel
  • Publication number: 20170363694
    Abstract: A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.
    Type: Application
    Filed: December 2, 2015
    Publication date: December 21, 2017
    Inventor: Robert Mark Boysel
  • Publication number: 20170108336
    Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.
    Type: Application
    Filed: January 12, 2015
    Publication date: April 20, 2017
    Applicant: Motion Engine Inc.
    Inventors: Robert Mark Boysel, Louis Ross
  • Publication number: 20170030788
    Abstract: The present invention provides a MEMS pressure sensor and a manufacturing method. The pressure is formed by a top cap wafer, a MEMS wafer and a bottom cap wafer. The MEMS wafer comprises a frame and a membrane, the frame defining a cavity. The membrane is suspended by the frame over the cavity. The bottom cap wafer closes the cavity. The top cap wafer has a recess defining with the membrane a capacitance gap. The top cap wafer comprises a top cap electrode located over the membrane and forming, together with the membrane, a capacitor to detect a deflection of the membrane. Electrical contacts on the top cap wafer are connected to the top cap electrode. A vent is extends from outside of the sensor into the cavity or the capacitance gap. The pressure sensor can include two cavities and two capacitance gaps, to form a differential pressure sensor.
    Type: Application
    Filed: January 15, 2015
    Publication date: February 2, 2017
    Inventors: Robert Mark Boysel, Louis Ross
  • Publication number: 20160320426
    Abstract: The present invention provides a 3D System (“3DS”) MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (SoC) or System in Package (SiP). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry.
    Type: Application
    Filed: July 11, 2016
    Publication date: November 3, 2016
    Inventors: Robert Mark Boysel, Louis Ross
  • Publication number: 20160229685
    Abstract: A MEMS and a method of manufacturing MEMS components are provided. The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS wafer and optionally a bottom cap wafer. The MEMS wafer has MEMS structures patterned therein. The MEMS wafer and the cap wafers include insulated conducting channels forming insulated conducting pathways extending within the wafer stack. The wafer stack is bonded to an integrated circuit wafer having electrical contacts on its top side, such that the insulated conducting pathways extend from the integrated circuit wafer to the outer side of the top cap wafer. Electrical contacts on the outer side of the top cap wafer are formed and are electrically connected to the respective insulated conducting channels of the top cap wafer. The MEMS wafer stack and the integrated circuit wafer are then diced into components having respective sealed chambers and MEMS structures housed therein.
    Type: Application
    Filed: September 19, 2014
    Publication date: August 11, 2016
    Inventor: Robert Mark Boysel
  • Publication number: 20160229684
    Abstract: A micro-electro-mechanical system (MEMS) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a MEMS wafer disposed between the top cap wafer and the bottom cap wafer. The top, bottom and MEMS wafers define sidewalls of a cavity. A MEMS structure is housed within the cavity and is movable relative to the top and bottom caps. At least one electrode is provided in one of the wafers, the electrode being operatively coupled to the MEMS structure to detect or induce a movement thereof. A support structure extends through the cavity from the top cap wafer to the bottom cap wafer to prevent bowing in the top cap and bottom cap wafers.
    Type: Application
    Filed: September 23, 2014
    Publication date: August 11, 2016
    Inventor: Robert Mark Boysel
  • Patent number: 9309106
    Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: April 12, 2016
    Assignee: Motion Engine Inc.
    Inventors: Robert Mark Boysel, Louis Ross
  • Publication number: 20150260519
    Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.
    Type: Application
    Filed: February 13, 2015
    Publication date: September 17, 2015
    Inventors: Robert Mark Boysel, Louis Ross
  • Publication number: 20150191345
    Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.
    Type: Application
    Filed: February 13, 2015
    Publication date: July 9, 2015
    Inventors: Robert Mark Boysel, Louis Ross
  • Patent number: 8593036
    Abstract: The present invention relates generally to a High Efficiency MEMS Micro-Vibrational Energy Harvester (?VEH) having a thick beam bimorph architecture. The disclosed architecture is capable of producing a voltage of sufficient magnitude such that the requirement to connect a plurality of harvesters in series to produce an adequate voltage magnitude is eliminated.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: November 26, 2013
    Assignee: MCB Clean Room Solutions, LLC
    Inventor: Robert Mark Boysel
  • Publication number: 20110210554
    Abstract: The present invention relates generally to a High Efficiency MEMS Micro-Vibrational Energy Harvester (?VEH) having a thick beam bimorph architecture. The disclosed architecture is capable of producing a voltage of sufficient magnitude such that the requirement to connect a plurality of harvesters in series to produce an adequate voltage magnitude is eliminated.
    Type: Application
    Filed: February 18, 2011
    Publication date: September 1, 2011
    Applicant: MCB CLEAN ROOM SOLUTIONS, LLC
    Inventor: Robert Mark Boysel
  • Publication number: 20080204744
    Abstract: High speed, optically-multiplexed, hyperspectral imagers and methods for producing multiple, spectrally-filtered image information of a scene. In a preferred embodiment, an array of imaging lenslets project multiple images of a scene along parallel optical paths which are then collimated, filtered into distinct wavelengths, and focused onto an array of image sensors. A digital image formatter converts output data from the image sensors into hyperspectral image information of the scene.
    Type: Application
    Filed: July 11, 2006
    Publication date: August 28, 2008
    Inventors: Jose Mir, R. Mark Boysel
  • Patent number: 6346776
    Abstract: A compact, high resolution, bright and long life modulator for projection displays, mates a field emission array (FEA) with a deformable light valve modulator (DLVM) of reflective operation in a thin vacuum package. The DLVM includes a continuous film mirror layer formed on or between one or more deformable layers on a transparent substrate. The field emitters (at least one per pixel) are driven to deliver primary electrons that strike and deposit a charge that produces electrostatic forces that locally deform the continuous film mirror layer. Because the mirror layer is a continuous film, i.e. not pixelated, the modulator resolution is limited only by the addressing resolution of the FEA. Mating the FEA and DLVM technologies also reduces the drive voltage requirements associated with typical FEA driven phosphor displays and scanned beam DLVMs thus improving their performance and extending the lifetime of each.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: February 12, 2002
    Assignee: MEMSolutions, Inc.
    Inventors: William P. Robinson, Robert Mark Boysel