Patents by Inventor Mark Chen

Mark Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11496324
    Abstract: Techniques are disclosed to provide enforceable pseudonymous reputation through chained endorsers. In various embodiments, a request associated with a chained endorsement operation is received via a communication interface. A client identity information is extracted from the request. Data comprising or associated with the client identity information is combined with a secret value. A one-way transform of the combined value is performed. A result of the one-way transform is returned to a client with which the chained endorsement operation is associated.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: November 8, 2022
    Assignee: Digital Trust Networks Inc.
    Inventors: Mark Chen, Jason S. Burnett
  • Publication number: 20220286283
    Abstract: A system includes a shard generation circuit configured to create shards from a security credential, and to recreate the security credential from the shards. The system includes a secret generation circuit configured to create secrets from a shard and to recreate the shard from a subset of the secrets, and store at least one of secrets in a location. The system includes another secret generation circuit configured to create secrets from another shard, recreate the other shard of the shards, and store at least one the shards in another, different location.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 8, 2022
    Applicant: SOFTIRON LIMITED
    Inventors: Charles C. Ruffino, Stephen Hardwick, Mark Chen
  • Publication number: 20220271015
    Abstract: Semiconductor package structures are provided. An interposer is bonded to a printed circuit board (PCB) or package substrate through first solder bumps disposed on a first side of the interposer. The first solder bumps have a first pitch. A plurality of semiconductor chips are formed, and each of the semiconductor chips is bonded to a second side of the interposer through second solder bumps. The second solder bumps have a second pitch that is less than the first pitch. Each of the semiconductor chips includes a substrate with one or more transistors or integrated circuits formed thereon.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 25, 2022
    Inventors: Chan-Hong Chern, Mark Chen
  • Patent number: 11392970
    Abstract: The present disclosure is directed toward systems and methods for managing a digital survey over voice-capable devices. In particular, the systems and methods described herein create a digital survey question from a verbal input. Additionally, the systems and methods described herein provide the digital survey question to respondents by way of voice-capable devices. The systems and methods also receive verbal survey responses, generate survey results from the verbal responses, and provide the survey results to a survey administrator.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: July 19, 2022
    Assignee: Qualtrics, LLC
    Inventors: Ali BaderEddin, Hongyi Gao, Mark Chen-Young Wu, Ali Hyder, Jeffrey Angell, Kyle Seely, Cameron Holiman, Micah Arvey, Aravind Aluri, Anderson Quach, Ben Alton
  • Patent number: 11360721
    Abstract: A policy-based printing system is implemented to allow access to a private domain to print using a public domain. The private domain includes private servers that store documents. The public domain includes servers and a printing device. A public policy server uses a domain list and a protocol connection with a private authentication server to validate a user and identify which private domain to access. The public policy server retrieves a policy from a private policy server that configures the parameters for printing using the public domain. The print job data is provided to a public file server until the public policy server confirms that the print job can be sent to the printing device.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: June 14, 2022
    Assignee: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Arthur Alacar, Mark Chen, Jin Liang, Michael Martin
  • Patent number: 11296055
    Abstract: Semiconductor package structures are provided. An interposer is bonded to a printed circuit board (PCB) or package substrate through first solder bumps disposed on a first side of the interposer. The first solder bumps have a first pitch. A plurality of semiconductor chips are formed, and each of the semiconductor chips is bonded to a second side of the interposer through second solder bumps. The second solder bumps have a second pitch that is less than the first pitch. Each of the semiconductor chips includes a substrate with one or more transistors or integrated circuits formed thereon.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: April 5, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chan-Hong Chern, Mark Chen
  • Patent number: 11275856
    Abstract: A policy-based printing system is implemented to allow access to a private domain to print using a public domain. The private domain includes private servers that store documents. The public domain includes servers and a printing device. A public policy server uses a domain list and a protocol connection with a private authentication server to validate a user and identify which private domain to access. The public policy server retrieves a policy from a private policy server that configures the parameters for printing using the public domain. The print job data is provided to a public file server until the public policy server confirms that the print job can be sent to the printing device.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: March 15, 2022
    Assignee: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Arthur Alacar, Mark Chen, Jin Liang, Michael Martin
  • Publication number: 20220060555
    Abstract: Devices and techniques for accelerated packet processing are described herein. The device can match an action to a portion of a network data packet and accelerate the packet-processing pipeline for the network data packet through the machine by processing the action.
    Type: Application
    Filed: September 24, 2021
    Publication date: February 24, 2022
    Applicant: Intel Corporation
    Inventors: Daniel Daly, John Fastabend, Matthew Vick, Brian J. Skerry, Marco Varlese, Jing Mark Chen, Danny Y. Zhou
  • Publication number: 20220037914
    Abstract: A power supply system which connects a DC consumer to an AC supply includes an AC-DC converter and a UPS. The AC-DC converter has an input to which alternating current from the AC supply is applied and an output at which DC current is developed. The UPS has an input to which direct current from the AC-DC converter is applied and an output at which DC current is developed. The DC current developed at the output of the AC-DC converter and DC current developed at the output of the UPS are applied to the DC consumer selectively in parallel with each other or exclusively to each other.
    Type: Application
    Filed: September 6, 2021
    Publication date: February 3, 2022
    Applicant: SOFTIRON LIMITED
    Inventors: Phil Straw, Gary Preston, Norman Fraser, Mark Chen
  • Patent number: 11219859
    Abstract: The present disclosure relates to a catalyst for NOx removal. In some embodiments, the catalyst comprises a support comprising at least one selected from the group consisting of TiO2, Al2O3, SiO2, ZrO2, CeO2, zeolite, TiO2 and WO3, and combinations thereof, and catalytically active components supported on the support. The catalytically active components comprise vanadium, antimony and at least one further component selected from the group consisting of silicon, aluminum and zirconium.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: January 11, 2022
    Assignee: BASF Corporation
    Inventors: Liang Chen, Feng Zhao, Jia Di Zhang, An Ju Shi, Shau-Lin Frank Chen, Miao Mark Chen
  • Publication number: 20210363153
    Abstract: Disclosed herein are compound capable of exploiting non-bonding electron densities, for example, cationic open-shell, pi-conjugated bisphenalenyls wherein intermolecular covalent bonding interactions can occur in multiple dimensions. Further disclosed are compositions comprising the disclosed compounds and process for the preparation thereof.
    Type: Application
    Filed: May 21, 2019
    Publication date: November 25, 2021
    Inventors: Mark CHEN, Caleb WEHRMANN, Ryan CHARLTON
  • Publication number: 20210325339
    Abstract: Biosensor devices and methods of forming the same are provided. A cavity is formed in a substrate and is configured to receive one or more charged molecules. A transistor is formed in the substrate and includes a source region, a drain region, and a channel region that are spatially separated from the cavity in a lateral direction. A gate of the transistor is disposed below the cavity and extends between the cavity and the source, drain, and channel regions. A voltage potential of the gate is based on a number of the charged molecules in the cavity.
    Type: Application
    Filed: May 10, 2021
    Publication date: October 21, 2021
    Inventors: Tung-Tsun Chen, Chien-Kuo Yang, Jui-Cheng Huang, Mark Chen, Ta-Chuan Liao, Cheng-Hsiang Hsieh
  • Patent number: 11134132
    Abstract: Devices and techniques for accelerated packet processing are described herein. The device can match an action to a portion of a network data packet and accelerate the packet-processing pipeline for the network data packet through the machine by processing the action.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: September 28, 2021
    Assignee: Intel Corporation
    Inventors: Daniel Daly, John Fastabend, Matthew Vick, Brian J. Skerry, Marco Varlese, Jing Mark Chen, Danny Y. Zhou
  • Patent number: 11114891
    Abstract: A power supply system which connects a DC consumer to an AC supply includes an AC-DC converter and a UPS. The AC-DC converter has an input to which alternating current from the AC supply is applied and an output at which DC current is developed. The UPS has an input to which direct current from the AC-DC converter is applied and an output at which DC current is developed. The DC current developed at the output of the AC-DC converter and DC current developed at the output of the UPS are applied to the DC consumer selectively in parallel with each other or exclusively to each other.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: September 7, 2021
    Assignee: SOFTIRON LIMITED
    Inventors: Phil Straw, Gary Preston, Norman Fraser, Mark Chen
  • Publication number: 20210184866
    Abstract: Techniques are disclosed to provide enforceable pseudonymous reputation through chained endorsers. In various embodiments, a request associated with a chained endorsement operation is received via a communication interface. A client identity information is extracted from the request. Data comprising or associated with the client identity information is combined with a secret value. A one-way transform of the combined value is performed. A result of the one-way transform is returned to a client with which the chained endorsement operation is associated.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 17, 2021
    Inventors: Mark Chen, Jason S. Burnett
  • Patent number: 11002704
    Abstract: Biosensor devices and methods of forming the same are provided. A cavity is formed in a substrate and is configured to receive one or more charged molecules. A transistor is formed in the substrate and includes a source region, a drain region, and a channel region that are spatially separated from the cavity in a lateral direction. A gate of the transistor is disposed below the cavity and extends between the cavity and the source, drain, and channel regions. A voltage potential of the gate is based on a number of the charged molecules in the cavity.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Tung-Tsun Chen, Chien-Kuo Yang, Jui-Cheng Huang, Mark Chen, Ta-Chuan Liao, Cheng-Hsiang Hsieh
  • Publication number: 20210133701
    Abstract: Proxied cross-ledger authentication techniques are disclosed. In various embodiments, a verifier presentation requirement is determined, the verifier presentation requirement indicating a set of elements required to be provided by a client to authenticate the client. An authentication contract instance is created on a market maker ledger not associated specifically with the verifier, the authentication contract instance including at least a subset of the elements required by the verifier presentation requirement. A verifier system associated with the verifier presentation requirement is configured to read information from the authentication contract instance, obtain from an issuer associated with the client an issuer revocation data associated with the authentication contract instance, and use the information read from the authentication contract instance and the issuer revocation data to authenticate the client.
    Type: Application
    Filed: October 12, 2020
    Publication date: May 6, 2021
    Inventors: Mark Chen, Ramesh Kesanupalli, Soonhyung Lee, Jason S. Burnett, Taejin Kim, Changsoo Kim
  • Publication number: 20210117559
    Abstract: A policy-based printing system is implemented to allow access to a private domain to print using a public domain. The private domain includes private servers that store documents. The public domain includes servers and a printing device. A public policy server uses a domain list and a protocol connection with a private authentication server to validate a user and identify which private domain to access. The public policy server retrieves a policy from a private policy server that configures the parameters for printing using the public domain. The print job data is provided to a public file server until the public policy server confirms that the print job can be sent to the printing device.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Applicant: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Arthur ALACAR, Mark CHEN, Jin LIANG, Michael MARTIN
  • Publication number: 20210117138
    Abstract: A policy-based printing system is implemented to allow access to a private domain to print using a public domain. The private domain includes private servers that store documents. The public domain includes servers and a printing device. A public policy server uses a domain list and a protocol connection with a private authentication server to validate a user and identify which private domain to access. The public policy server retrieves a policy from a private policy server that configures the parameters for printing using the public domain. The print job data is provided to a public file server until the public policy server confirms that the print job can be sent to the printing device.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Inventors: Arthur ALACAR, Mark CHEN, Jin LIANG, Michael MARTIN
  • Patent number: 10942688
    Abstract: A policy-based printing system is implemented to allow access to a private domain to print using a public domain. The private domain includes private servers that store documents. The public domain includes servers and a printing device. A public policy server uses a domain list and a protocol connection with a private authentication server to validate a user and identify which private domain to access. The public policy server retrieves a policy from a private policy server that configures the parameters for printing using the public domain. The print job data is provided to a public file server until the public policy server confirms that the print job can be sent to the printing device.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 9, 2021
    Assignee: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Arthur Alacar, Mark Chen, Jin Liang, Michael Martin