Patents by Inventor Mark Clark

Mark Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LEAD-FREE HIGH TEMPERATURE/PRESSURE PIPING COMPONENTS AND METHODS OF USE
    Publication number: 20160069483
    Abstract: A piping component for controlling the flow of fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and up to approximately 650° F. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than trace amounts of lead, less than trace amounts of bismuth, 2 to 6% silicon and a balance of copper (by weight). In certain aspects, less than 0.09% of lead and/or less than 0.09% bismuth are contained in the silicon-copper alloy.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 10, 2016
    Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
  • Tunneling barrier creation in MSM stack as a selector device for non-volatile memory application
    Patent number: 9246092
    Abstract: Selector elements that can be suitable for nonvolatile memory device applications are disclosed. The selector element can have low leakage currents at low voltages to reduce sneak current paths for non-selected devices, and higher leakage currents at higher voltages to minimize voltage drops during device switching. The selector element can include insulator layers between the semiconductor layer and the metal layers to lower the leakage current of the device. The metal layers of the selector element can include conductive materials such as tungsten, titanium nitride, or combinations thereof.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: January 26, 2016
    Assignee: Intermolecular, Inc.
    Inventors: Ashish Bodke, Mark Clark, Kevin Kashefi, Prashant B. Phatak, Dipankar Pramanik
  • Lead-free high temperature/pressure piping components and methods of use
    Patent number: 9217521
    Abstract: A piping component for controlling the flow of fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and up to approximately 650° F. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than trace amounts of lead, less than trace amounts of bismuth, 2 to 6% silicon and a balance of copper (by weight). In certain aspects, less than 0.09% of lead and/or less than 0.09% bismuth are contained in the silicon-copper alloy.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: December 22, 2015
    Assignee: NIBCO INC.
    Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
  • METHODS AND SYSTEMS FOR TREATING SPENT CAUSTIC AND REGENERATING MEDIA
    Publication number: 20150284264
    Abstract: Methods and systems for applying separation processes to a spent caustic stream are disclosed. Methods and systems for regenerating media utilized in spent caustic separation processes are disclosed.
    Type: Application
    Filed: October 22, 2013
    Publication date: October 8, 2015
    Applicant: SIEMENS ENERGY, INC.
    Inventors: Bryan J. Kumfer, Andrea J. Larson, Chad L. Felch, Mark Clark
  • TiOx Based Selector Element
    Publication number: 20150179933
    Abstract: Control elements that can be suitable for nonvolatile memory device applications are disclosed. The control element can have low leakage currents at low voltages to reduce sneak current paths for non selected devices, and high leakage currents at high voltages to minimize voltage drops during device switching. The control element can be based on a single dielectric layer or on a multilayer dielectric stack.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Applicant: Intermolecular, Inc.
    Inventors: Monica Sawkar Mathur, Venkat Ananthan, Mark Clark, Prashant B. Phatak
  • LEAD-FREE HIGH TEMPERATURE/PRESSURE PIPING COMPONENTS AND METHODS OF USE
    Publication number: 20150159782
    Abstract: A piping component for controlling the flow of fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and up to approximately 650° F. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than trace amounts of lead, less than trace amounts of bismuth, 2 to 6% silicon and a balance of copper (by weight). In certain aspects, less than 0.09% of lead and/or less than 0.09% bismuth are contained in the silicon-copper alloy.
    Type: Application
    Filed: February 18, 2015
    Publication date: June 11, 2015
    Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
  • Lead-free high temperature/pressure piping components and methods of use
    Patent number: 8991787
    Abstract: A piping component for controlling the flow of high-temperature fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and 650° F. The piping body may also be sized for high-temperature fluids (e.g., steam) operating at pressures of up to approximately 400 psi, and 600 psi. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than 0.25% lead, less than 0.25% bismuth, 2 to 6% silicon and a balance of copper (by weight).
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: March 31, 2015
    Assignee: NIBCO Inc.
    Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
  • Multiple RF Band Operation in Mobile Devices
    Publication number: 20140228072
    Abstract: Methods and apparatuses for multiple RF band operation in mobile devices are disclosed. In one example, a method for dual radio frequency band operation includes operating a mobile communication device in a first radio frequency band, monitoring a RSSI associated with the mobile communication device, and switching operation of the mobile communication device to operation in a second radio frequency band responsive to the RSSI crossing a threshold RSSI value.
    Type: Application
    Filed: April 14, 2014
    Publication date: August 14, 2014
    Applicant: Plantronics, Inc.
    Inventors: Mark Clark, Steve C. Evans, Stephen V. Cahill
  • Multiple RF band operation in mobile devices
    Patent number: 8712467
    Abstract: Methods and apparatuses for multiple RF band operation in mobile devices are disclosed. In one example, a method for dual radio frequency band operation includes operating a mobile communication device in a first radio frequency band, monitoring a RSSI associated with the mobile communication device, and switching operation of the mobile communication device to operation in a second radio frequency band responsive to the RSSI crossing a threshold RSSI value.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: April 29, 2014
    Assignee: Plantronics, Inc.
    Inventors: Mark Clark, Steve Evans, Stephen Cahill
  • LEAD-FREE HIGH TEMPERATURE/PRESSURE PIPING COMPONENTS AND METHODS OF USE
    Publication number: 20140090714
    Abstract: A piping component for controlling the flow of high-temperature fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and 650° F. The piping body may also be sized for high-temperature fluids (e.g., steam) operating at pressures of up to approximately 400 psi, and 600 psi. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than 0.25% lead, less than 0.25% bismuth, 2 to 6% silicon and a balance of copper (by weight).
    Type: Application
    Filed: March 12, 2013
    Publication date: April 3, 2014
    Applicant: NIBCO INC.
    Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
  • Call control across multiple interfaces
    Patent number: 8660255
    Abstract: Methods and apparatuses for call control are disclosed. In one example, methods and apparatuses for receiving communications associated with a monitoring of a first interface, a second interface, and a third interface for an incoming call. A current active call is placed in a bold queue, the hold queue configured to contain calls placed on hold received over the first interface, the second interface, and the third interface. Notification of a second user action to place the incoming call on a hold status is received. The incoming call is placed in the hold queue, a next call from the hold queue is retrieved, and the next call is activated.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: February 25, 2014
    Assignee: Plantronics, Inc.
    Inventors: Ramesh Theivendran, Mark Clark, Gopal Anatharaman
  • ATHLETIC GLOVE
    Publication number: 20140026280
    Abstract: Disclosed is an athletic glove comprising a pair of finger pads on the dorsal surface of each finger portion, a dorsal pad extending between the metacarpophalangeal finger joints and the metacarpals when worn, and a lateral pad.
    Type: Application
    Filed: January 16, 2013
    Publication date: January 30, 2014
    Inventor: Mark Clark
  • ARTICULATED INTRAMEDULLARY NAIL
    Publication number: 20130325006
    Abstract: System, including methods, apparatus, and kits, for bone fixation with an articulated nail. The nail may have a first segment and a second segment that extend from respective opposite ends of the nail to a joint region that connects the segments. Each segment may define one or more transverse apertures configured to receive a fastener that attaches the segment to bone. The joint region may have a movable configuration that permits pivotal rearrangement of the segments relative to each other and a locked configuration that fixes the segments relative to each other.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: James W. Michelinie, Mark Clark, Matthew J. Ryan
  • Communications system with efficient multiprotocol-aware channel selection and interference avoidance
    Patent number: 8583138
    Abstract: In one example, a method and system for selecting a channel for use with a mobile communication device is described. A shared frequency band shared between a first wireless communications protocol and a second wireless communications protocol is scanned to identify an active second wireless communications protocol channel. One or more first wireless communications protocol channels corresponding to the active second wireless communications protocol channel are removed from a list of selectable channels. A first wireless communications protocol channel is selected from the list of selectable channels.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: November 12, 2013
    Assignee: Plantronics, Inc.
    Inventors: Stephen Cahill, Mark Clark
  • Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same
    Patent number: 8558220
    Abstract: In some aspects, a method of fabricating a memory cell is provided that includes (1) fabricating a first conductor above a substrate; (2) selectively fabricating a carbon nano-tube (CNT) material above the first conductor; (3) fabricating a diode above the CNT material; and (4) fabricating a second conductor above the diode. Numerous other aspects are provided.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: October 15, 2013
    Assignee: SanDisk 3D LLC
    Inventors: April Schricker, Mark Clark, Brad Herner
  • CALL CONTROL ACROSS MULTIPLE INTERFACES
    Publication number: 20130156177
    Abstract: Methods and apparatuses for call control are disclosed. In one example, methods and apparatuses for receiving communications associated with a monitoring of a first interface, a second interface, and a third interface for an incoming call. A current active call is placed in a bold queue, the hold queue configured to contain calls placed on hold received over the first interface, the second interface, and the third interface. Notification of a second user action to place the incoming call on a hold status is received. The incoming call is placed in the hold queue, a next call from the hold queue is retrieved, and the next call is activated.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 20, 2013
    Applicant: PLANTRONICS, INC.
    Inventors: Ramesh Theivendran, Mark Clark, Gopal Anatharaman
  • Device wearing status determination using RSSI
    Patent number: 8369779
    Abstract: Methods and apparatuses for determining the wearing status of body worn devices are disclosed. In one example, RSSI values are processed to identify the wearing status of a body worn device.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: February 5, 2013
    Assignee: Plantronics, Inc.
    Inventors: Mark Clark, Steve Evans
  • ALKYLATION UNIT AND PROCESS RELATING THERETO
    Publication number: 20120279848
    Abstract: One exemplary embodiment can be an alkylation unit. The alkylation unit can include at least one alkylation reaction zone having an alkylation catalyst, at least one cooler communicating with the at least one alkylation reaction zone, a settler communicating with the at least one alkylation reaction zone and the at least one cooler, a fractionation zone receiving an effluent from the settler passing through a line, and a boot coupled to a substantially horizontal portion of the line. Generally, the boot receives an effluent portion rich in the alkylation catalyst.
    Type: Application
    Filed: July 16, 2012
    Publication date: November 8, 2012
    Applicant: UOP LLC
    Inventors: Mark A. Clark, Jason J. Gislason
  • MEMORY CELL THAT EMPLOYS A SELECTIVELY GROWN REVERSIBLE RESISTANCE-SWITCHING ELEMENT AND METHODS OF FORMING THE SAME
    Publication number: 20120217462
    Abstract: A method of forming a memory cell is provided that includes forming a steering element above a substrate, and forming a reversible resistance-switching element coupled to the steering element. The reversible resistance-switching element includes one or more of TiOx, Ta2O5, Nb2O5, Al2O3, HfO2, and V2O5, and the reversible resistance switching element is formed without being etched. Numerous other aspects are provided.
    Type: Application
    Filed: May 4, 2012
    Publication date: August 30, 2012
    Inventors: April Schricker, Brad Herner, Mark Clark
  • Alkylation unit
    Patent number: 8246921
    Abstract: One exemplary embodiment can be an alkylation unit. The alkylation unit can include at least one alkylation reaction zone having an alkylation catalyst, at least one cooler communicating with the at least one alkylation reaction zone, a settler communicating with the at least one alkylation reaction zone and the at least one cooler, a fractionation zone receiving an effluent from the settler passing through a line, and a boot coupled to a substantially horizontal portion of the line. Generally, the boot receives an effluent portion rich in the alkylation catalyst.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: August 21, 2012
    Assignee: UOP LLC
    Inventors: Mark A. Clark, Jason J. Gislason