Patents by Inventor Mark D. Kittel

Mark D. Kittel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11014203
    Abstract: A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: May 25, 2021
    Inventors: Mark D. Kittel, Jason L. Strader
  • Publication number: 20210028142
    Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.
    Type: Application
    Filed: August 10, 2020
    Publication date: January 28, 2021
    Inventors: Jason L. STRADER, Michael S. WLADYKA, Keith David JOHNSON, Jingting YANG, Kevin Joel BOHRER, Mark D. KITTEL
  • Patent number: 10741519
    Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: August 11, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel
  • Patent number: 10741475
    Abstract: A delivery roll (1) for thermal interface components, the roll comprising a carrier tape (10), an adhesive layer (10a), and a plurality of thermal interface components (20), wherein the adhesive layer (10a) is arranged on a surface of the carrier tape (10); each thermal interface component (20) comprises a top liner (22), a bottom liner (26) and a thermal interface pad (24) arranged therebetween; the carrier tape (10) supports the plurality of thermal interface components (20) by the adhesive adhering to the bottom liner (26) of each thermal interface component (20); and the plurality of thermal interface components (20) is arranged in a spaced apart manner along the carrier tape (10). The invention also relates to a manufacturing method for a delivery roll.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 11, 2020
    Assignee: NOLATO SILIKONTEKNIK AB
    Inventors: Xiongwei Lu, Mark D. Kittel, Jussi Myllyluoma
  • Publication number: 20190237387
    Abstract: A delivery roll (1) for thermal interface components, the roll comprising a carrier tape (10), an adhesive layer (10a), and a plurality of thermal interface components (20), wherein the adhesive layer (10a) is arranged on a surface of the carrier tape (10); each thermal interface component (20) comprises a top liner (22), a bottom liner (26) and a thermal interface pad (24) arranged therebetween; the carrier tape (10) supports the plurality of thermal interface components (20) by the adhesive adhering to the bottom liner (26) of each thermal interface component (20); and the plurality of thermal interface components (20) is arranged in a spaced apart manner along the carrier tape (10). The invention also relates to a manufacturing method for a delivery roll.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 1, 2019
    Inventors: Xiongwei LU, Mark D. KITTEL, Jussi MYLLYLUOMA
  • Publication number: 20190013291
    Abstract: Disclosed are exemplary embodiments of systems and methods of applying materials to components. The materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.
    Type: Application
    Filed: August 28, 2018
    Publication date: January 10, 2019
    Inventors: Jason L. STRADER, Michael S. WLADYKA, Keith David JOHNSON, Jingting YANG, Kevin Joel BOHRER, Mark D. KITTEL
  • Publication number: 20180009072
    Abstract: Disclosed are exemplary embodiments of systems and methods of applying thermal interface materials (TIMs). The thermal interface materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.
    Type: Application
    Filed: July 11, 2016
    Publication date: January 11, 2018
    Inventors: Mark D. Kittel, Jason L. Strader
  • Patent number: 7135973
    Abstract: A tamper monitoring article and system, and an associated method of making, installing and using the article and system. The article has an elongate body portion. The body portion has a first end portion that adheres to a second end portion, if present, or to a substrate. The article also includes a pathway structure that runs along or throughout the body portion and can conduct energy, such as light or electricity, along its length. A monitor communicates with the pathway structure and detects a change in the energy being conducted thereby. A change in the energy is indicative of a change in a conductive property of the pathway structure caused by, for example, manipulation of the body portion and the pathway structure that is disposed therein or thereon. The monitor can then signal, or respond to a request signal, and provide information that such manipulation has occurred.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: November 14, 2006
    Assignee: Avery Dennison Corporation
    Inventors: Mark D. Kittel, Joseph Miglionico, Richard L. Sandt, Terrence Sullivan
  • Patent number: 6758000
    Abstract: Livestock identification tag assembly comprising: (a) a heat seal laminate comprising: (i) a facestock having an upper surface and a lower surface; (ii) a heat-activatable adhesive layer having an upper surface and a lower surface, wherein the upper surface of the heat-activatable adhesion layer is adhered to the lower surface of said facestock; (iii) an ink or graphics layer adhered to the lower surface of said heat-activatable layer; and (b) a flexible polymeric substrate; wherein the lower surface of the heat-activatable adhesive of the laminate is adhered to the substrate. In one embodiment, the ink or graphics layer is positioned between said heat-activatable adhesive layer and said facestock.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: July 6, 2004
    Assignee: Avery Dennison Corporation
    Inventors: Richard L. Sandt, Mark D. Kittel
  • Patent number: 6756095
    Abstract: This invention relates to a heat-sealable laminate, comprising: a facestock having an upper surface and a lower surface; a heat-activatable first adhesive layer underlying the lower surface of the facestock; and a second adhesive layer overlying the upper surface of the facestock, with the proviso that the laminate is characterized by the absence of either an adhesion promoting layer or an abrasion-resistant transparent coating layer positioned between the upper surface of the facestock and the second adhesive layer. These heat-sealable laminates may be used in providing pictorial and/or print designs or messages (e.g., labels, decals, etc.) that can be adhered to substrates (e.g., metal, plastic, leather, paper or textile substrates) such as automotive interior surfaces, hard plastic component parts, consumer durable goods, and the like.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: June 29, 2004
    Assignee: Avery Dennison Corporation
    Inventors: Richard L. Sandt, Mark D. Kittel, Henry Lum, Jr.
  • Patent number: 6461722
    Abstract: This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: October 8, 2002
    Assignee: Avery Dennnison Corporation
    Inventors: Mark D. Kittel, Richard L. Sandt, Charles K. Herrmann, Mark Wisniewski
  • Publication number: 20020127361
    Abstract: This invention relates to a heat-sealable laminate, comprising: a facestock having an upper surface and a lower surface; a heat-activatable first adhesive layer underlying the lower surface of the facestock; and a second adhesive layer overlying the upper surface of the facestock, with the proviso that the laminate is characterized by the absence of either an adhesion promoting layer or an abrasion-resistant transparent coating layer positioned between the upper surface of the facestock and the second adhesive layer. These heat-sealable laminates may be used in providing pictorial and/or print designs or messages (e.g., labels, decals, etc.) that can be adhered to substrates (e.g., metal, plastic, leather, paper or textile substrates) such as automotive interior surfaces, hard plastic component parts, consumer durable goods, and the like.
    Type: Application
    Filed: January 10, 2001
    Publication date: September 12, 2002
    Inventors: Richard L. Sandt, Mark D. Kittel, Henry Lum
  • Publication number: 20020088154
    Abstract: This invention relates to a livestock identification tag assembly comprising: (a) a heat seal laminate comprising: (i) a facestock having an upper surface and a lower surface; (ii) a heat-activatable adhesive layer having an upper surface and a lower surface, wherein the upper surface of the heat-activatable adhesion layer is adhered to the lower surface of said facestock; (iii) an ink or graphics layer adhered to the lower surface of said heat-activatable layer; and (b) a flexible polymeric substrate; wherein the lower surface of the heat-activatable adhesive of the laminate is adhered to the substrate. In one embodiment, the ink or graphics layer is positioned between said heat-activatable adhesive layer and said facestock.
    Type: Application
    Filed: January 10, 2001
    Publication date: July 11, 2002
    Inventors: Richard L. Sandt, Mark D. Kittel
  • Patent number: 6365255
    Abstract: This invention relates to an article useful in applying a tamper evident film comprising a frangible layer which is bonded on one side to an adhesive and on the other side to a laminate support layer wherein the bond between the frangible layer and the support layer is a non-destructible bond. The present invention provides an article which is able to apply frangible and delicate tamper evident films to articles. The invention also relates to methods of applying tamper evident films.
    Type: Grant
    Filed: November 4, 1998
    Date of Patent: April 2, 2002
    Assignee: Avery Dennison Corporation
    Inventors: Mark D. Kittel, Charles K. Herrmann
  • Patent number: 6228486
    Abstract: This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.
    Type: Grant
    Filed: October 6, 1998
    Date of Patent: May 8, 2001
    Assignee: Avery Dennison Corporation
    Inventors: Mark D. Kittel, Richard L. Sandt, Charles K. Herrmann, Mark Wisniewski
  • Patent number: D879046
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: March 24, 2020
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang
  • Patent number: D881822
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: April 21, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang
  • Patent number: D998827
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: September 12, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang
  • Patent number: D999405
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: September 19, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang