Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

Abstract: In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.

Abstract: A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may include one or more support members extending across at least a portion of the carrier card. One or more rollers may be supported on the support member(s) in a manner that allows rotation to facilitate insertion and/or extraction of mezzanine cards from the carrier card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: Rotating latching mechanism for securing Advanced Telecom Computing Architecture (ATCA) mezzanine card (AdvancedMC) modules within mezzanine slots on an ATCA carrier board. The rotating latching mechanism includes a rotating latching member having a handle coupled to a shaft to which a latching paddle and position detector actuator paddle are also coupled. The rotating latching member is pivotally coupled relative to a faceplate of a module proximate to the handle, and the shaft at the opposite end is supported by a rear bearing support member coupled to the modules circuit card. As the handle is rotated, the latching paddle is rotated to engage a cutout formed in a strut coupled to the ATCA carrier board, thus latching the module in place. The position detector actuator paddle is also rotated to cause a position detector to be actuated.

Abstract: A folding latching mechanism and related structure. An embodiment of the folding latching mechanism includes a latch member having a claw-shaped clasp disposed proximate to a pivot member that enables a pivotal coupling about a first pivot axis. A lever arm is pivotally-coupled to the latch member about a second pivot (fold) axis that is perpendicular to the first pivot axis of the latch member. During use, the latch member is rotated about its first pivot axis via the lever arm in an extended position, whereby the latching member is securely coupled to a frame member via its clasp. The lever arm is then rotated about its fold axis and secured in place. The folding latching mechanism may be employed on an Advanced Telecom Computing Architecture (ATCA) board hosting one or more Advanced Mezzanine Card (AdvancedMC) modules, wherein the mechanism does not interfere with the I/O port interfaces for the modules.

Abstract: A two-dimensional adjustable edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes a housing having a cavity formed in one side and an edge connector extending outward from an opposing side. The edge connector includes contact members that are configured to function as conventional edge connector contacts on one end, while the opposing end includes a leg that is in contact with first side of an elastomer connector disposed in the cavity. The elastomer connector facilitates electrical coupling between each contact member and a corresponding board contact on a board having a connector edge that is inserted into the cavity, wherein each board contact includes a leg that is in contact with a second side of the elastomer connector. The adjustable edge connector adaptor enables the board to be positioned in both the horizontal and vertical directions relative to the edge connector.

Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.

Abstract: An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The power rails are electrically coupled to a power supply and the integrated circuits. At the same time, the power rails are used to thermally couple one or more heatsinks to the integrated circuit(s). Each power rails includes at least one slot configured to receive a flange on the heatsink(s). In situations under which different voltages are supplied via the power rails, means are provided to electrically insulate at least one power rail from the heatsink(s) while maintaining thermal coupling to the power rails. In one embodiment, a split-rail configuration is used, wherein the power rail includes multiple conductive sections separated by one or more insulator sections. The scheme is well-suited for modular board/blade architectures, such as the Advanced Telecommunications Architecture (ATCA).

Abstract: High-reliability edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes an edge connector slot for mating with a card edge connector and a connector edge along which a set or sets of biased contacts are arrayed. The connector edge and biased contacts are configured to mate with a corresponding connector having an edge connector slot normally employed for coupling to a conventional card edge connector. In one embodiment, the edge connector slot in the adapter is configured to mate with the edge connector of an Advance Mezzanine Card (AdvancedMC) card, while the connector edge and biased contacts are configured to mate with an AdvancedMC connector. Upon assembly, the biased contacts are deflected so as to exert a normal force against a mating contact in the AdvancedMC connector. Meanwhile, the contacts of the AdvancedMC card are securely coupled to a mating contact in the edge connector adapter, e.g., using a solder or the like.

Abstract: According to some embodiments, a system includes a holder to hold an electrical module, the module having an electrical circuit and a conductive module pad electrically coupled to the electrical circuit. A system may also include a flexible circuit coupled to the holder and having a conductive pad to contact the conductive module pad.

Abstract: An adjustable-width, dual-connector card module. The module includes an adjustable-width printed circuit board (PCB) assembly including first and second PCBs, each having a respective end connector. A flexible connector is coupled to each of the PCBs to enable electrical signals to pass therebetween. An adjustable width stiffening mechanisms is employed to maintain the end connectors in a common plane, while enabling the distance between the PCBs to be adjusted. In one embodiment, the end connectors are edge connectors that are designed to mate with corresponding Advance Mezzanine Card (AMC) connectors, and the module is configured to have a form factor corresponding to either a full-height or half-height double-width AMC module. In one embodiment, one or more AMC modules of these configurations are installed in an Advanced Telecom Computing Architecture (ATCA) carrier board, which in turn is installed in an ATCA chassis.

Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

Abstract: The present invention provides a screw comprising a head and a threaded shank, wherein the shank is covered with a coating at least 60% of the length thereof from the end, the coating includes microcapsules that contain a viscous fluid with an appropriate level of viscosity. Shavings, including powdered shavings due to friction and exfoliations that may be generated during the screwing process, will be held, so that they will not fall, at the surface of the shank by the viscous fluid coming out of the microcapsules.

Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.