Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

Abstract: A novel high availability small foot-print server is described in which four or more separate computer modules and associated power supply and communication connections or other units are clustered together in a single server chassis to occupy a limited amount of space while providing maximum accessibility for administrative, maintenance, installation, or other purposes. Each separate computer module is equipped with its own fan or blower box to provide redundancy in the case of fan or blower box failure. The server chassis is contoured to provide for natural interconnection such that more than one high availability small foot-print server may be stacked together to take up the same amount of floor, shelf, or desk space as a single server.

Abstract: A novel high availability small foot-print server is described in which four or more separate computer modules and associated power supply and communication connections or other units are clustered together in a single server chassis to occupy a limited amount of space while providing maximum accessibility for administrative, maintenance, installation, or other purposes. Each separate computer module is equipped with its own fan or blower box to provide redundancy in the case of fan or blower box failure. The server chassis is contoured to provide for natural interconnection such that more than one high availability small foot-print server may be stacked together to take up the same amount of floor, shelf, or desk space as a single server.

Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: A novel high availability small foot-print server is described in which four or more separate computer modules and associated power supply and communication connections or other units are clustered together in a single server chassis to occupy a limited amount of space while providing maximum accessibility for administrative, maintenance, installation, or other purposes. Each separate computer module is equipped with its own fan or blower box to provide redundancy in the case of fan or blower box failure. The server chassis is contoured to provide for natural interconnection such that more than one high availability small foot-print server may be stacked together to take up the same amount of floor, shelf, or desk space as a single server.

Abstract: A system and method for cooling multiple microprocessors located on a circuit board containing disk drives, memory and other components. This cooling system and method utilizes a blower connected to an air duct. The air duct is divided into several channels via the placement of one or more walls within their duct. Each channel of the air duct is connected to a separate heat sink affixed to each microprocessor. Ambient air blown into the air duct is divided among the channels and proceeds to absorb heat from each of the heat sinks prior to being expelled from the circuit board. The system and method utilizes minimal space on the circuit board and provides maximum cooling for each microprocessor.

Abstract: A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.

Abstract: Pressure sensors that are fabricated to sense low pressures are tested and calibrated by providing a controlled gas flow or leak to create a pressure during testing. Rather than placing the pressure sensor in a sealed environment, a controlled leak of a gas is used to induce a stable and controllable pressure region over the pressure sensor during testing. The stable low pressure region is monitored via a sensing tube.

Abstract: A smart control panel (10) includes a processor (40) for remotely controlling a radio (20). The smart control panel (10) attaches and detached from the skirt (21) of the radio (20). The smart control panel (10) also includes a display screen (13) for inputting information from a user to the smart control panel (10) which is translated by the smart control panel (10) to operate the radio (20). A latching arrangement allow a handle (11) to lock the smart control panel (10) into the radio (20) when the units are in the attaches mode. A cable (30) or other RF links provide for coupling the units when they are in the detached mode.