Abstract: There is disclosed novel copper ion-exchange media and processes for the recovery of cupric ion from ammoniacal copper solutions and for the recovery of spent printed circuit board etchant. The novel ion-exchange media comprise hydrophobic nonporous polymer plasticized and swollen with a monomeric organic liquid copper ion-exchange agent such as beta-diketones or hydroxyoximes. A novel copper ion-complexing agent, 1-n-octylphenyl-p-1,3-butanedione, is also disclosed. The processes essentially comprise contacting the ammoniacal cupric ion-containing solution or spent etchant with the novel copper ion-exchange media to extract copper in cupric ion form. Copper can be recovered therefrom by conventional methods such as acid stripping and electrowinning.