Abstract: A planar fully integrated variable reluctance micromotor (10) is microfabricated on a substrate base (18). The micromotor includes a pin (19), rotor (12) with radially extending poles (16), and a stator (20) having a plurality of poles (21) configured in pairs (22) circumferentially spaced about the rotor. The rotor is microfabricated in place, or in situ, contiguous to the substrate base. The pairs of stator poles include a multilevel core (26) wrapped around a meander conductor (27) which is connected to bonding pads (32). The variable reluctance micromotor is particularly adapted to operating as a micropump (45) for conductive fluids.

Abstract: A synthetic jet actuator, which can be micromachined if desired, generates a synthetic jet stream characterized by a series of successive vortices that can be used for effectively entraining adjacent fluid. The synthetic jet actuator can be used to bend, or vector, a jet stream from another jet actuator. Further, because the synthetic jet actuator exhibits zero net mass flux, the synthetic jet actuator can be used within a bounded volume. In structure, the synthetic jet actuator comprises a housing defining an internal chamber and having an orifice. A flexible metallized diaphragm forms a wall of the housing and can change the volume of the chamber when moved. An electrode is disposed adjacent to and spaced from the diaphragm, and an electrical bias is imposed between the metallized diaphragm and the electrode by a control system to force movement of the diaphragm. As the diaphragm moves, the volume in the internal chamber changes and vortices are ejected from the chamber through the orifice.

Abstract: A magnetic relay system is implemented to act as a relay driven by a magnetic flux yet capable of production through micromachining. The magnetic relay system has an electromagnet, a movable plate, and conductive contacts. The contacts are connected to the circuits of outside electrical systems that are to be controlled by the switching of the relay system. The plate is movable allowing it to engage both contacts and allow current flow between the contacts or to disengage both contacts and prevent current flow between the contacts. The electromagnet provides a sufficient magnetic flux at desired times to move the movable plate and thereby controls whether the movable plate is engaged with the contacts. The electromagnet, movable plate, and the conductive contacts may be formed on a substrate capable of construction using microfabrication techniques.

Abstract: Synthetic jet actuator, which can be micromachined if desired, generates a synthetic jet stream characterized by a series of successive vortices that can be used for effectively entraining adjacent fluid. The synthetic jet actuator can be used to bend, or vector, a jet stream from another jet actuator. Further, because the synthetic jet actuator exhibits zero net mass flux, the synthetic jet actuator can be used within a bounded volume. In structure, the synthetic jet actuator comprises a housing defining an internal chamber and having an orifice. A flexible metallized diaphragm forms a wall of the housing and can change the volume of the chamber when moved. An electrode is disposed adjacent to and spaced from the diaphragm, and an electrical bias is imposed between the metallized diaphragm and the electrode by a control system to force movement of the diaphragm. As the diaphragm moves, the volume in the internal chamber changes and vortices are ejected from the chamber through the orifice.

Abstract: A planar fully integrated variable reluctance micromotor (10) is microfabricated on a substrate base (18). The micromotor includes a pin (19), rotor (12) with radially extending poles (16), and a stator (20) having a plurality of poles (21) configured in pairs (22) circumferentially spaced about the rotor. The rotor is microfabricated in place, or in situ, contiguous to the substrate base. The pairs of stator poles include a multilevel core (26) wrapped around a meander conductor (27) which is connected to bonding pads (32). The variable reluctance micromotor is particularly adapted to operating as a micropump (45) for conductive fluids.

Abstract: A fully integrated micromachined magnetic particle manipulator and separator which can be used to influence magnetic particles suspended in a fluid. The magnetic particle manipulator and separator is integrated on a substrate, preferably a silicon wafer. The magnetic particle manipulator and separator is comprised of a fluid flow channel and integrated inductive components formed on each side of the channel. Each inductive component is comprised of a magnetic core and a conductor coil. Preferably, a meander-type inductor is used. The magnetic cores have ends located adjacent the fluid channel which function as electromagnet poles. When approximately 500 mA of DC current at less than 1 volt is supplied to the circuit, the inductive components produce magnetic fields and the magnetic particles suspended in the fluid clump onto the electromagnet poles. When the current is removed, the magnetic particles are released from the electromagnet poles.

Abstract: Various novel lift-off and bonding processes (60, 80, 100) permit lift-off of thin film materials and devices (68), comprising In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y where 0<x<1, and 0<y<1, from a growth substrate (62) and then subsequent alignable bonding of the same to a host substrate (84). As a result, high quality communication devices can be fabricated for implementing a three dimensional electromagnetic communication network within a three dimensional integrated circuit cube (10), an array (90) of optical detectors (98) for processing images at very high speed, and a micromechanical device (110) having a platform (114) for steering or sensing electromagnetic radiation or light.

Abstract: Novel processes permit integrating thin film semiconductor materials and devices using epitaxial lift off, alignment, and deposition onto a host substrate. One process involves the following steps. An epitaxial layer(s) is deposited on a sacrificial layer situated on a growth substrate. Device layers may be defined in the epitaxial layer. All exposed sides of the epitaxial layer is coated with a transparent carrier layer. The sacrificial layer is then etched away to release the combination of the epitaxial layer and the transparent carrier layer from the growth substrate. The epitaxial layer can then be aligned and selectively deposited onto a host substrate. Finally, the transparent carrier layer is removed, thereby leaving the epitaxial layer on the host substrate. An alternative process involves substantially the same methodology as the foregoing process except that the growth substrate is etched away before the sacrificial layer.

Abstract: Three dimensional communication within an integrated circuit occurs via electromagnetic communication between emitters and detectors situated throughout the integrated circuit. The emitters and detectors can be produced in a diode or laser configuration. The emitters and detectors can be fabricated via novel lift-off and alignable deposition processes. Integrated circuit layers, including silicon and gallium arsenide, are transparent to the electromagnetic signals propagated from the emitter and received by the detector. Furthermore, arrays of optical detectors can be implemented to perform image processing with tremendous speed. Processing circuitry can be situated directly below the optical detectors to process in massive parallel signals from individual optical detectors.

Abstract: Disclosed is an integrated imaging sensor/neural network controller for combustion control systems. The controller uses electronic imaging sensing of chemiluminescence from a combustion system, combined with neural network image processing, to sensitively identify and control a complex combustion system. The imaging system used is not adversely affected by the normal emissions variations caused by changes in burner load and flame position. By incorporating neural networks to learn emission patterns associated with combustor performance, control using image technology is fast enough to be used in a real time, closed loop control system. This advance in sensing and control strategy allows use of the spatial distribution of important parameters in the combustion system in identifying the overall operation condition of a given combustor and in formulating a control response accorded to a pre-determined control model.

Abstract: Various novel processes permit integrating thin film semiconductor materials and devices using lift off, alignment, and deposition onto a host substrate. As a result, three dimensional integrated circuits can be constructed. Three dimensional communication in an integrated circuit can be implemented via electromagnetic communication between emitters and detectors fabricated via the novel processes. Integrated circuit layers are transparent to the electromagnetic signals propagated from the emitter and received by the detector. Furthermore, arrays of optical detectors can be implemented to perform image processing with tremendous speed. Processing circuitry can be situated directly below the optical detectors to process in massive parallel signals from individual optical detectors.

Abstract: A device for quantitatively measuring adherence of thin films provides a first substrate having an upper surface and a second substrate having a surface coplanar therewith. The second substrate is spaced on all sides from the first substrate by a cavity. The thin film is suspended over the cavity and adhered to the surfaces of the two substrates. A characteristic length of the area of the surface of the second substrate to which the film is adhered is made small relative to the characteristic length of the cavity. A pressure differential is applied across the thickness of the film such that the film debonds from the surface of the second substrate. Mechanical characteristics of the debonding of the film are observed and measured. The characteristics are thereafter related to provide a quantitative measurement of adherence of the thin film to the second substrate. A measurement of relative adherence between different films is obtained by testing a multilayered film structure.