Abstract: Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: Photonic integrated circuits (PICs) may include transmit and receive PICs that include individually tunable optical elements. In one implementation, a device may include a number of optical elements that form a number of optical channels. Tuners may be used to modify a property associated with the at least one of the optical elements where the modified properties of the optical elements adjust a frequency grid of the optical channels.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

Abstract: Photonic integrated circuits (PICs) may include transmit and receive PICs that include individually tunable optical elements. In one implementation, a device may include a number of optical elements that form a number of optical channels. Tuners may be used to modify a property associated with the at least one of the optical elements where the modified properties of the optical elements adjust a frequency grid of the optical channels.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.

Abstract: A photonic integrated circuit that includes a plurality of active and passive components on a substrate where one of the components is an optical combiner/decombiner having at least one free space coupler region and a plurality of longitudinal ridge waveguides each extending in the circuit from a first region of the waveguide and coupled at a second region of the waveguide at the free space coupler region. A first dielectric layer formed over the ridge waveguides and the free space coupler region. The first dielectric layer monotonically increases in cross-sectional thickness from the waveguide first region to the second region to reduce signal insertion losses in transitioning from the ridge waveguides to the free space coupler region. The first dielectric layer may be covered with a second passivation layer. The first dielectric layer may be SiOx, SiNx or SixONy and the second passivation layer may be BCB, ZnS or ZnSe.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands.

Abstract: A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.