Abstract: A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

Abstract: Embodiments of the present invention provide methods for destructive testing of a printed circuit board assembly (PCBA). The PCBA contains embedded components on a printed circuit board within a non-functional area. At least one of these embedded components is susceptible to defects and exposed to conditions that facilitate destructive testing which leads to accelerated measurements. The accelerated measurements on the non-functional area are more representative of variability than measurements on a functional module while providing insights into potential future defects.

Abstract: A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

Abstract: A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer and a second thermal interface material layer. The second thermal interface material layer at least partially overlaps the first thermal interface material layer.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A first connector includes a first plurality of eye-of-needle (EON) pins. Each EON pin of the first plurality includes two opposing spring arms. Each EON pin of the first plurality is configured to be received within a corresponding electrical via of a printed circuit board (PCB) such that the spring arms engage walls of the corresponding electrical via at a set of contact points. A second connector includes a second plurality of EON pins. Each EON pin of the second plurality includes two opposing spring arms. Each EON pin of the second plurality is configured to be received within a same corresponding electrical via of the PCB as a corresponding EON pin of the first plurality located at a same relative connector body location such that the spring arms engage the walls of the same corresponding electrical via at a different set of contact points.

Abstract: An eye-of-needle (EON) compliant pin that includes a compliant segment including two opposing spring arms defining a substantially planar opening. The Eon compliant pin includes a twisted segment connected between a top portion of the compliant segment and a bottom portion of a length segment. The compliant segment, the length segment, and the twisted segment together form a substantially straight solid body. The twisted segment is twisted about a longitudinal axis of the substantially straight solid body such that the substantially planar opening of the compliant segment is rotated at an angle with respect to the length segment.

Abstract: An eye-of-needle (EON) compliant pin that includes a compliant segment including two opposing spring arms defining a substantially planar opening. The Eon compliant pin includes a twisted segment connected between a top portion of the compliant segment and a bottom portion of a length segment. The compliant segment, the length segment, and the twisted segment together form a substantially straight solid body. The twisted segment is twisted about a longitudinal axis of the substantially straight solid body such that the substantially planar opening of the compliant segment is rotated at an angle with respect to the length segment.

Abstract: A first connector includes a first plurality of eye-of-needle (EON) pins. Each EON pin of the first plurality includes two opposing spring arms. Each EON pin of the first plurality is configured to be received within a corresponding electrical via of a printed circuit board (PCB) such that the spring arms engage walls of the corresponding electrical via at a set of contact points. A second connector includes a second plurality of EON pins. Each EON pin of the second plurality includes two opposing spring arms. Each EON pin of the second plurality is configured to be received within a same corresponding electrical via of the PCB as a corresponding EON pin of the first plurality located at a same relative connector body location such that the spring arms engage the walls of the same corresponding electrical via at a different set of contact points.

Abstract: Printed circuit boards (PCBs) can be designed to have dynamic warp characteristics complimentary to those of an attached component. A PCB and an attached component can be designed to dynamically warp, during a thermal excursion, in the same direction and with approximately the same magnitude of warp. Warp characteristics of the PCB and the attached component can be determined by the vertical thickness of conductor and dielectric layers, by the wiring density and number of conductor layers. Warp characteristics can also be at least partially determined by the arrangement/ordering of conductor and dielectric layers, by dimensions of a sash structure surrounding a component outline and by dimensions of a prepreg layer applied to an existing design. Such a prepreg layer can cover a portion or an entirety of one of the PCBs planar surfaces.

Abstract: A solder tail extender connector and method are provided for implementing production of solder tail extender connectors from compliant pins. A forming fixture is provided to collapse compliant pins prior to soldering. The compliant pin is collapsed at or beyond the normal compliant pin low end dimensions and removed from the forming fixture. A solder tail extender optionally is added to the collapsed compliant pin, forming the solder tail extender connector.

Abstract: A first connector includes a first plurality of eye-of-needle (EON) pins. Each EON pin of the first plurality includes two opposing spring arms. Each EON pin of the first plurality is configured to be received within a corresponding electrical via of a printed circuit board (PCB) such that the spring arms engage walls of the corresponding electrical via at a set of contact points. A second connector includes a second plurality of EON pins. Each EON pin of the second plurality includes two opposing spring arms. Each EON pin of the second plurality is configured to be received within a same corresponding electrical via of the PCB as a corresponding EON pin of the first plurality located at a same relative connector body location such that the spring arms engage the walls of the same corresponding electrical via at a different set of contact points.

Abstract: An eye-of-needle (EON) compliant pin that includes a compliant segment including two opposing spring arms defining a substantially planar opening. The Eon compliant pin includes a twisted segment connected between a top portion of the compliant segment and a bottom portion of a length segment. The compliant segment, the length segment, and the twisted segment together form a substantially straight solid body. The twisted segment is twisted about a longitudinal axis of the substantially straight solid body such that the substantially planar opening of the compliant segment is rotated at an angle with respect to the length segment.

Abstract: According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include a non-conductive force transfer plate affixed to the electronic component body to receive an assembly force. The electronic component assembly may also include a plurality of electrical connectors passing through the non-conductive force transfer plate, wherein first ends of the electrical connectors are located within the electronic component body and second ends are located outside the electronic component body, and the electrical connectors have a force transfer structure adapted to engage the non-conductive force transfer plate and transfer at least a portion of the assembly force from the force transfer plate to the electrical connectors.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: A solder tail extender connector and method are provided for implementing production of solder tail extender connectors from compliant pins. A forming fixture is provided to collapse compliant pins prior to soldering. The compliant pin is collapsed at or beyond the normal compliant pin low end dimensions and removed from the forming fixture. A solder tail extender optionally is added to the collapsed compliant pin, forming the solder tail extender connector.