Abstract: Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

Abstract: A data storage medium from which information is reproduced by scanning a surface of the medium with a probe-based tip, such as an Atomic Force Microscope (AFM) tip positioned in contact therewith. The medium comprises a substrate; and a polymer recording surface within which data bit values are determined by the topographical state at the bit location. The polymer contains thermally reversible crosslinkages. The data bit value is a function of the depth of the pit at the bit location.

Abstract: A data storage medium is introduced. The data storage medium from which information is reproduced by scanning a surface of the medium with a tip positioned in contact therewith comprises a recording layer within which data values are determined by the topographical state at the data item location. The material of said recording layer comprises a component that is generating an etchant. The etchant removes the naturally occurring surface oxide layer of the tip which keeps the tip sharp and works against tip wear.

Abstract: A data storage device is introduced. The data storage device comprises a write head. The write head comprises a heating element and a tip. The write head scans a data storage medium, wherein in an operation mode of the data storage device the tip is in contact with a surface of the data storage medium and heat is applied to the tip by means of the heating element. In order to achieve a good thermal contact between the tip and the data storage medium, the tip comprises a carbon element that is at least partially in contact with the surface in that operation mode. Such a write head can also be applied in the field of scanning probe lithography.