Abstract: A die is provided with an interconnect, and the grain structure of the interconnect is adapted to reduce electron scattering.

Abstract: A method for adiabatically heating semiconductor device surfaces, including using capping layers to prevent deformation of surfaces. Using the method, semiconductor surfaces having varying topographies or topologies may be heated adiabatically. In an embodiment of the method, one or more capping layers may be formed over a semiconductor surface, to further prevent deformation of semiconductor surfaces.

Abstract: Methods of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising source/drain and gate regions, wherein the gate region comprises a metal layer disposed on a gate dielectric layer, and then laser annealing the substrate.

Abstract: A polysilicon structure may be defined on a semiconductor substrate using plasma doping to dope the sidewalls and upper surface of the polysilicon material as well as the source drain extensions. Shortly after plasma doping, the structure may be encapsulated within a suitable capping layer to prevent the removal of the thin surface doped regions during subsequent semiconductor processing.

Abstract: Numerous embodiments of a method and apparatus for a capping layer are disclosed. In one embodiment, a method of forming a capping layer for a semiconductor device comprises forming one or more layers on at least a portion of the top surface of a semiconductor device, substantially planarizing at least one of the one or more layers, annealing at least a portion of the semiconductor device, and removing a substantial portion of the one or more layers, using one or more etching processes.

Abstract: Embodiments of the present invention relate to methods and systems for manipulating and combining files from different applications without the use of the files' originating applications. Application files are collected and converted to a page-format which preserves the visual aspects and page formatting of the application file. A composer application is then used to manipulate and reorganize the pages of the files as needed. Pages from files created by different applications may be compiled into a single document which can be printed or electronically transmitted without manual editing or delivery.

Abstract: A polysilicon structure may be defined on a semiconductor substrate using plasma doping to dope the sidewalls and upper surface of the polysilicon material as well as the source drain extensions. Shortly after plasma doping, the structure may be encapsulated within a suitable capping layer to prevent the removal of the thin surface doped regions during subsequent semiconductor processing.

Abstract: Methods of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising source/drain and gate regions, wherein the gate region comprises a metal layer disposed on a gate dielectric layer, and then laser annealing the substrate.

Abstract: Arrangements incorporating laser-induced cleaving.

Abstract: A method for adiabatically heating semiconductor device surfaces, including using capping layers to prevent deformation of surfaces. Using the method, semiconductor surfaces having varying topographies or topologies may be heated adiabatically. In an embodiment of the method, one or more capping layers may be formed over a semiconductor surface, to further prevent deformation of semiconductor surfaces.

Abstract: A system and method are provided for composing documents. The method comprises: accepting an electronically formatted document; converting the document into a metafile format description; and, arranging the converted documents in a Composer file. In some aspects, converting the documents into a metafile format description includes converting the documents into printer commands. The method may: create a call for a graphical device interface (GDI) function; and, supply GDI function parameters. In other aspects, arranging the converted documents in a Composer file includes arranging the GDI function calls and parameters in a Windows enhanced metafile (EMF) document. In one aspect, a Composer file is created with images differentiated by logical pages. Then, the method further comprises: modifying the edge margins of the composer file pages, for example, the footers and headers. Modifying the edge margins includes: either creating a page overlay; and/or, resizing a page.

Abstract: A method and apparatus for flexible control of the routing and processing of documents by a document receiver. Document classifications are defined by a receiver and stored on a registration server together with an associated document processing profile (“DPP”). The receiver communicates to a sender how to access his account on the registration server. The sender views the receiver's document classifications, selects one, and prints a cover page, which includes a document classification identifier. The sender scans the cover page and a source document with a digital scanner and transceiver. The document is sent to recipients and transformed according to the DPP.

Abstract: Embodiments of the present invention relate to methods and systems for manipulating and combining files from different applications without the use of the files' originating applications. Application files are collected and converted to a page-format which preserves the visual aspects and page formatting of the application file. A composer application is then used to manipulate and reorganize the pages of the files as needed. Pages from files created by different applications may be compiled into a single document which can be printed or electronically transmitted without manual editing or delivery.

Abstract: A data processing system includes a power control circuit, a processor, a power supply, and a plurality of other components. Upon system reset, the power control circuit can generate at least one sequencing signal indicating a first sequence in which power is to be supplied to the plurality of components. Similarly, power sequencing code executed by the processor upon system reset can selectively generate at least one sequencing signal indicating a second sequence in which power is to be supplied to the plurality of components. The power supply, which can receive both the sequencing signal generated by the power control circuit and the sequencing signal generated by the power sequencing code, supplies power to the plurality of components in the second sequence if the power supply receives the sequencing signal generated by the power sequencing code. In one embodiment, the plurality of components require a plurality of different power supply voltages.

Abstract: Two daughter cards connected by bus connectors to a motherboard have integrated circuits connected to each other and to an integrated circuit on the motherboard through a bus network. The bus network is also connected by a bus cable connected at the top of the two daughter cards so as to form a loop within the bus network.

Abstract: A process is described for selectively preparing a compound of the formula ##STR1## wherein: R.sup.1 is halogen;R.sup.2 is halogen, alkyl, cycloalkyl, aryl or ##STR2## and R.sup.3 hydrogen, alkyl, cycloalkyl, aryl, ##STR3## wherein the process comprises treating the associated ketone with an oxido-reductase or a microorganism comprising an oxidoreductase. Compounds prepared by this process are useful antipsychotic agents or useful intermediates therefor.